Patent Assignment
Reel/Frame 063273/0184
Assignment of Assignor's Interest
Recorded: 2023-04-10
Pages: 8
Assignors
SUN, FENGPEI
Executed: 2023-04-04
FENG, ZHIHONG
Executed: 2023-04-10
XU, JINGHUI
Executed: 2023-04-03
DONG, XIAOSHI
Executed: 2023-04-10
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Mems Chip, Manufacturing Method Thereof, Mems Device, and Electronic Device