Patent Assignment
Reel/Frame 063293/0752
Assignment of Assignor's Interest
Recorded: 2023-04-11
Pages: 4
Assignor
LIN, MENG-HAN
Executed: 2023-03-29
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same
Application:
18/192,672 →
Publication:
US 2024/0243187