IP Library › Assignment 063297/0336
Patent Assignment
Reel/Frame 063297/0336

Change of Name

Recorded: 2023-04-11 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Techniques for Joining Dissimilar Materials in Microelectronics
Application: 16/459,610 →
Publication: US 2020/0013765
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 17, 2020
From: FOUNTAIN, GAIUS GILLMAN, JR.; MANDALAPU, CHANDRASEKHAR; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051546/0207 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →