Patent Assignment
Reel/Frame 063323/0485
Assignment of Assignor's Interest
Recorded: 2023-04-14
Pages: 10
Assignors
CHEN, CHAO-YANG
Executed: 2019-03-29
TSAI, CHUN-YANG
Executed: 2019-03-29
HUANG, KUO-CHING
Executed: 2019-04-02
CHU, WEN-TING
Executed: 2019-04-03
HUANG, PILI
Executed: 2019-03-29
WU, CHENG-JUN
Executed: 2019-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bottom Electrode Structure in Memory Device
Application:
18/300,526 →
Publication:
US 2023/0255124