Patent Assignment
Reel/Frame 063343/0089
Assignment of Assignor's Interest
Recorded: 2023-04-17
Pages: 4
Assignors
WU, CHIEH-HAN
Executed: 2019-10-21
TSAI, CHENG-HSIUNG
Executed: 2019-10-21
LU, CHIH WEI
Executed: 2019-10-21
LEE, CHUNG-JU
Executed: 2019-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure Having a Barrier Layer Along the Sidewall of Self-Aligned via Structures