Patent Assignment
Reel/Frame 063347/0283
Assignment of Assignor's Interest
Recorded: 2023-04-17
Pages: 6
Assignors
AHN, SEOKGEUN
Executed: 2023-01-04
LEE, SEOKHYUN
Executed: 2023-01-04
CHOI, HWANYOUNG
Executed: 2023-01-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Semiconductor Package
Application:
18/135,541 →
Publication:
US 2024/0014086