Patent Assignment
Reel/Frame 063351/0291
Assignment of Assignor's Interest
Recorded: 2023-04-18
Pages: 6
Assignors
OYAMA, YASUYUKI
Executed: 2023-04-10
MIYAZAWA, EMI
Executed: 2023-04-07
AKASU, YUTA
Executed: 2023-04-07
FURUTANI, RYOJI
Executed: 2023-04-10
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device, Method for Manufacturing Film Material for Temporary Fixing, and Film Material for Temporary Fixing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.