IP Library Assignment 063356/0001
Patent Assignment
Reel/Frame 063356/0001

Assignment of Assignor's Interest

Recorded: 2023-04-18 Pages: 14
Assignors
CHECK, MICHAEL
Executed: 2023-04-17
WHITE, JUSTIN
Executed: 2023-04-18
WUESTER, STEVEN
Executed: 2023-04-18
HABERERN, KEVIN
Executed: 2023-04-18
BLAKELY, COLIN
Executed: 2023-04-18
REIHERZER, JESSE
Executed: 2023-04-18
Assignee
CREELED, INC.
4001 E HWY 54, SUITE 2000, DURHAM, NORTH CAROLINA, 27709
Covered Properties (2)
Current Spreading Layer Structures for Light-Emitting Diode Chips
Application: 18/302,149 →
Publication: US 2023/0395747
Current Spreading Layer Structures for Light-Emitting Diode Chips
Application: 63/365,645 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →