Patent Assignment
Reel/Frame 071755/0001
Patent Security Agreement
Recorded: 2025-06-30
Pages: 108
Assignors
CREELED, INC.
Executed: 2025-06-24
PENGUIN SOLUTIONS CORPORATION (DE)
Executed: 2025-06-24
SMART EMBEDDED COMPUTING, INC.
Executed: 2025-06-24
SMART HIGH RELIABILITY SOLUTIONS LLC
Executed: 2025-06-24
SMART MODULAR TECHNOLOGIES, INC.
Executed: 2025-06-24
PENGUIN COMPUTING, INC.
Executed: 2025-06-24
Assignee
JPMORGAN CHASE BANK, N.A.
10 SOUTH DEARBORN, MAIL CODE IL1-1190; FLOOR L2, CHICAGO, ILLINOIS, 60603
Covered Properties
(1025)
Light Emitting Diodes and Methods
Cover Structure Arrangements for Light Emitting Diode Packages
Application:
17/103,121 →
Publication:
US US20220165923A1
Reflective Layers for Light-Emitting Diodes
Lumiphoric Material Arrangements for Multiple-Junction Light-Emitting Diodes
Application:
17/494,264 →
Publication:
US US20230106479A1
Light Emitting Diode Packages
Application:
17/507,201 →
Publication:
US US20220045253A1
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,628 →
Publication:
US US20230170447A1
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,678 →
Publication:
US US20230170449A1
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,685 →
Publication:
US US20230170445A1
Light-Emitting Devices with Reinforcement Materials and Related Methods
Mounting Arrangements for Semiconductor Packages and Related Methods
Application:
17/656,591 →
Publication:
US US20230307586A1
Light-Emitting Diode Packages with Directional Emission Intensity and Color Uniformity
Contact Structures of Led Chips for Current Injection
Light-Emitting Diode Packages with Selectively Placed Light-Altering Materials and Related Methods
Application:
17/674,430 →
Publication:
US US20230261154A1
Arrangements of Multiple-Chip Light-Emitting Diode Packages
Encapsulation Arrangements in Light-Emitting Diode Packages
Application:
17/686,943 →
Publication:
US US20230282786A1
Emission Height Arrangements in Light-Emitting Diode Packages and Related Devices and Methods
Light-Emitting Diode Packages with Lead Frame Structures for Flip-Chip Mounting of Light-Emitting Diode Chips
Mass Transfer of Semiconductor Die Using Transfer Elements
Light Extraction Structures for Light-Emitting Diode Chips and Related Methods
Application:
17/807,885 →
Publication:
US US20230411562A1
Thermal Pad Structures for Led Packages with Reduced Sizes
Application:
17/809,132 →
Publication:
US US20230420325A1
Wafer Level Fabrication for Multiple Chip Light-Emitting Devices
Application:
17/817,186 →
Publication:
US US20240047606A1
Sealing Structures for Light-Emitting Diode Packages
Light-Emitting Diode Chip Structures
Application:
17/822,339 →
Publication:
US US20240072099A1
Coated Phosphor Particle, Light Emitting Device Including a Coated Phosphor Particle, and Method of Making a Coated Phosphor Particle
Light Emitting Device with Light-Altering Material Layer, and Fabrication Method Utilizing Sealing Template
Application:
17/885,765 →
Publication:
US US20240055570A1
Metallic Layer for Dimming Light-Emitting Diode Chips
Textured Metal Core Printed Circuit Boards for Improved Thermal Dissipation
Application:
17/897,617 →
Publication:
US US20240074031A1
Liquid Metal Alloys in a Light-Emitting Diode Device
Shaped Cover Structures with Lumiphoric Materials for Light-Emitting Diode Packages and Related Methods
Application:
17/984,875 →
Publication:
US US20240162381A1
Reflectors for Support Structures in Light-Emitting Diode Packages
Application:
18/045,508 →
Publication:
US US20240120452A1
Light-Emitting Diode Devices with Support Elements for Improved Near-Field and Far-Field Emissions
Lumiphoric Material Structures for Light-Emitting Diode Packages and Related Methods
Error Detection in Led Packages
Lumiphoric Material Arrangements for Cover Structures of Light-Emitting Diode Packages
Application:
18/055,934 →
Publication:
US US20240162391A1
Cover Structure Arrangements for Light Emitting Diode Packages
Light-Emitting Diode Devices with Support Structures Including Patterned Light-Altering Layers
Textured Lumiphore Layer to Improve Light Extraction for Light-Emitting Diode Chips and Related Methods
Application:
18/085,672 →
Publication:
US US20240213401A1
Sidewall Arrangements for Light-Emitting Diode Devices and Related Methods
Application:
18/093,373 →
Publication:
US US20240234642A1
Laser Etching for Light-Emitting Diode Devices and Related Methods
Application:
18/104,966 →
Publication:
US US20240266462A1
Multiple-Layered Cover Structure for Beamshaping for Light-Emitting Diode Devices
Application:
18/117,630 →
Publication:
US US20240304609A1
Material Arrangements in Cover Structures for Light-Emitting Diodes
Application:
18/163,391 →
Publication:
US US20240266482A1
Lumiphoric Particle Structures in Wavelength Conversion Elements for Light-Emitting Diodes and Related Methods
Application:
18/163,396 →
Publication:
US US20240266478A1
Multiple Wavelength Light-Emitting Diode Chip and Related Methods
Light-Emitting Diode Packages with Real-Time Processing and Related Methods
Application:
18/169,264 →
Publication:
US US20240274063A1
Light-Emitting Diodes as Shunt Regulator to Power Low-Voltage Circuits
Cover Structure for Beamshaping for Light Emitting Diode Packages
Application:
18/203,868 →
Publication:
US US20240404998A1
Light Collector for Light Mixing in Light Emitting Diode Packages
Application:
18/207,399 →
Publication:
US US20240413281A1
Current Injection Structures for Light-Emitting Diode Chips
Application:
18/221,474 →
Publication:
US US20250022983A1
Wire Grid Polarization Structure for Current Spreading and Polarization Control
Application:
18/239,145 →
Publication:
US US20250081689A1
Multi-Planarity of Light Emitting Surfaces in Led Components
Application:
18/244,354 →
Publication:
US US20250089407A1
Interconnect Structures for Improved Light-Emitting Diode Chip Performance
Passivation Structures for Light-Emitting Diode Chips
Application:
18/302,123 →
Publication:
US US20230395760A1
Current Spreading Layer Structures for Light-Emitting Diode Chips
Application:
18/302,149 →
Publication:
US US20230395747A1
Contact Structures in Light-Emitting Diode Chips for Reduced Voiding of Bonding Metals
Light-Emitting Diode Packages with Materials for Reducing Effects of Environmental Ingress
Application:
18/304,836 →
Publication:
US US20240355979A1
Light-Emitting Diode Chip Structures with Electrically Insulating Substrates and Related Methods
Contact Interconnect Structures for Light-Emitting Diode Chips and Related Methods
Application:
18/312,733 →
Publication:
US US20240372039A1
Light-Emitting Diode Packages for Environmental Indication
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Lumiphoric Materials Within Light-Emitting Diode Chips
Application:
18/330,805 →
Publication:
US US20240413271A1
Edge-Emitting Semiconductor Devices and Related Methods
Application:
18/345,166 →
Publication:
US US20250006709A1
Stacked Led Chips
Application:
18/345,270 →
Publication:
US US20250006712A1
Reflective Layers for Light-Emitting Diodes
Mounting Structures for Edge-Emitting Semiconductor Devices
Application:
18/446,656 →
Publication:
US US20250056933A1
Solid State Light Emitting Components with Unitary Lens Structures
Application:
18/456,877 →
Publication:
US US20250056939A1
Light-Emitting Diode Packages with Varying Current Pulse Width Modulation and Related Methods
Multiple Junction Light-Emitting Diode Chips and Related Methods
Application:
18/460,758 →
Publication:
US US20250079409A1
Pseudo-Exponential Encoding for Light-Emitting Devices and Related Methods
Design for Test Scanning for Light-Emitting Diode Packages and Related Methods
Application:
18/488,186 →
Publication:
US US20250123330A1
Light-Emitting Diode Chip Structures for Light Extraction and Related Methods
Application:
18/490,105 →
Publication:
US US20250133876A1
Symmetrical Lead Frame Structure for Two-Pin Led Package
Application:
18/493,039 →
Publication:
US US20250133886A1
Anchored Light Mixing Structures in Led Packages and Related Methods
Application:
18/508,373 →
Publication:
US US20250038153A1
Multiple Chip Led Packages with Common Electrodes
Application:
18/512,165 →
Publication:
US US20250054920A1
Integrated Radio Frequency Powered Light Emitting Diode Chips and Fabrication Methods
Application:
18/584,656 →
Publication:
US US20240290766A1
Light-Emitting Diode Packages with Transformation and Shifting of Pulse Width Modulation Signals and Related Methods
Light Collector for Light Mixing in Light Emitting Diode Packages
Application:
18/656,839 →
Publication:
US US20240413282A1
Light-Emitting Diodes with Mixed Clock Domain Signaling
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Three Dimensional Led Device and Method of Manufacture
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Application:
18/904,720 →
Publication:
US US20250022412A1
Arrangements of Light-Altering Coatings in Light-Emitting Diode Packages
Application:
18/999,045 →
Publication:
US US20250126941A1
Light-Emitting Device Package
Patent:
1,104,971 →
Application:
29/823,528 →
Light-Emitting Diode Package
Patent:
1,087,430 →
Application:
29/876,413 →
Light-Emitting Device Package
Patent:
1,102,396 →
Application:
29/909,588 →
Light-Emitting Diode Package
Patent:
1,128,107 →
Application:
29/914,974 →
Lenses Formed by Additive Manufacturing for Light-Emitting Diode Packages
Application:
18/531,858 →
Publication:
US US20250194307A1
Frequency-Controlled Light-Emitting Diode Devices and Related Methods
Arrangements of Multiple-Junction Light-Emitting Diode Chips in Light-Emitting Diode Packages and Related Displays
Application:
18/417,120 →
Publication:
US US20250239573A1
Light-Emitting Diode Chip Structures with Electrode Extensions and Vias
Application:
18/436,807 →
Publication:
US US20250261485A1
Light-Emitting Diode Chip Structures with Electrode Extensions and Gradient Vias
Application:
18/589,641 →
Publication:
US US20250275307A1
Anchored Encapsulation in Led Devices
Application:
18/597,406 →
Publication:
US US20250287740A1
Light Mixing Arrangements in Multiple-Chip Light-Emitting Diode Packages
Application:
18/604,866 →
Publication:
US US20250293215A1
Landing Pad Structures for Contacts in Light-Emitting Diode Chips and Related Methods
Application:
18/645,598 →
Publication:
US US20250338682A1
Contact Structures for Submounts in Light-Emitting Diode Devices
Application:
18/670,372 →
Publication:
US US20250366279A1
Long-Pass Filter Structures for Light-Emitting Diodes
Application:
18/669,969 →
Publication:
US US20250362438A1
Light-Emitting Diode Package
Patent:
1,102,268 →
Application:
29/946,950 →
Light-Directing Structures in Light-Emitting Diode Devices and Related Methods
Application:
18/745,203 →
Publication:
US US20250386619A1
Light-Emitting Diode Package
Patent:
1,124,426 →
Application:
29/947,814 →
Lead Frame Structures for Reflow Mitigation in Light-Emitting Diode (Led) Packages
Application:
18/754,541 →
Publication:
US US20260006956A1
Structures for Light-Emitting Diode Packages with Multiple Light-Emitting Diode Chips
Application:
18/726,556 →
Publication:
US US20260123157A1
Structures for Light-Emitting Diode Packages with Multiple Light-Emitting Diode Chips
Application:
18/726,858 →
Publication:
US US20260177225A1
Lumiphoric Material Structures Within Light-Emitting Diodes and Related Methods
Application:
18/770,162 →
Publication:
US US20260020391A1
Reflective Structures for Light-Emitting Diode Chips and Related Methods
Application:
18/787,476 →
Publication:
US US20260033048A1
Lens Structures in Light-Emitting Diode Packages
Application:
18/806,014 →
Publication:
US US20260052813A1
Light-Emitting Diode Devices with Individually Adjustable Pulse Width Modulation Signals and Related Methods
Application:
18/806,800 →
Publication:
US US20250324497A1
Lens Structures for Light-Emitting Diode (Led) Chips in Led Packages
Application:
18/812,005 →
Publication:
US US20260059907A1
Die Attach Structures for Light-Emitting Diode Chips on Lead Frames
Application:
18/825,032 →
Publication:
US US20260068373A1
Light-Emitting Diode Chip Structures and Related Methods
Application:
18/883,532 →
Publication:
US US20260075992A1
Multi-Layer Reflective Structures for Light-Emitting Diode Chips and Related Methods
Application:
18/887,256 →
Publication:
US US20250331338A1
Light-Emitting Diode Chips with Metallic Dimming Layers and Related Methods
Application:
63/699,967 →
Lens Structures in Multiple-Chip Light-Emitting Diode (Led) Packages
Application:
18/901,734 →
Publication:
US US20260096256A1
Coefficient of Thermal Expansion Structures in Submounts of Light-Emitting Diodes
Application:
63/704,348 →
Light-Emitting Diode Chips with Optically Pumped Quantum Well Structures
Application:
18/909,243 →
Publication:
US US20260101609A1
Infrared Light-Emitting Diodes with Filter Structures
Application:
18/928,576 →
Publication:
US US20260123121A1
Identification Markers for Light-Emitting Diodes and Related Methods
Arrangements for Light Emitting Diode Packages
Application:
18/934,434 →
Publication:
US US20260130020A1
Microparticle Arrangements in Light-Emitting Diode Packages and Related Methods
Application:
18/942,908 →
Publication:
US US20260136727A1
Arrangements of Light-Emitting Diode Packages in Light-Emitting Devices and Related Methods
Application:
18/947,249 →
Publication:
US US20260136726A1
Stress Mitigation Structures in Lead Frames for Light-Emitting Diodes
Application:
63/722,119 →
Light-Emitting Diodes with Metal Pillars for Plugged Substrates
Application:
18/958,652 →
Publication:
US US20260150449A1
Recessed Cavity Substrates for Led Matrix
Application:
18/960,062 →
Publication:
US US20260150436A1
Self-Forming Sub-Mount / Lead Frame
Application:
18/975,538 →
Publication:
US US20260164867A1
Selectable-Color Light-Emitting Diode Chips
Application:
18/983,932 →
Publication:
US US20260173599A1
Coefficient of Thermal Expansion Structures in Submounts of Light-Emitting Diodes
Application:
18/987,626 →
Publication:
US US20260101614A1
Submount Structures of Light-Emitting Diodes and Related Methods
Application:
19/015,178 →
Publication:
US US20260198160A1
Lead Frame Cup for Improved Light Extraction
Application:
19/032,721 →
Publication:
US US20260215065A1
Cover Structures with Cutouts Away from Edges for Wirebonding
Application:
19/037,694 →
Publication:
US US20260223499A1
Light-Directing Features in Light-Emitting Diode Devices
Application:
19/049,151 →
Flexible Lead Frame
Application:
19/049,692 →
Light-Extraction Films for Light-Emitting Diode Devices and Related Methods
Application:
19/049,274 →
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Application:
19/069,965 →
Publication:
US US20250201184A1
Led Chips and Devices with Textured Light-Extracting Portions, and Fabrication Methods
Application:
19/093,530 →
Publication:
US US20250226363A1
Lens Arrays in Light-Emitting Diode Packages
Patent:
12,624,819 →
Application:
19/093,896 →
Light Emitting Diodes and Methods with Encapsulation
Application:
19/193,130 →
Publication:
US US20250267989A1
Reflective Layers for Light-Emitting Diodes
Application:
19/212,975 →
Publication:
US US20250280631A1
Methods and Systems for Automated Scheduler-Controlled Node Testing in a Computing Cluster
Application:
18/778,312 →
Publication:
US US20260023609A1
Secure, Anonymous Browsing with a Remote Browsing Server
Application:
18/816,932 →
Publication:
US US20240430330A1
Secure, Anonymous Browsing with a Remote Browsing Server
Application:
18/816,837 →
Publication:
US US20240422229A1
Secure, Anonymous Browsing with a Remote Browsing Server
Application:
18/816,807 →
Publication:
US US20240422228A1
Secure, Anonymous Browsing with a Remote Browsing Server
Application:
18/816,779 →
Publication:
US US20240422227A1
Ultra-Low Latency Remote Application Access
Application:
18/948,768 →
Publication:
US US20250071163A1
Methods and Systems for Enhanced Cluster Health Monitoring and Unhealthy Node Detection Through Drop Out-Accumulation Techniques
Methods and Systems for Enhanced Fault Detection of a Component of a Computing Node Through Peer-Based Assessments
Methods and System for Configuring an Advanced Electronic Circuit Board with Optimized Component Layout and Enhanced Signal Integrity for Data Processing Efficiency and Communication Speed
Application:
18/669,087 →
Publication:
US US20250356097A1
Methods and Systems for Enhanced Assessment and Scoring of High-Performance Compute Architectures
Application:
63/670,432 →
Methods and Systems for Automated Scheduler-Controlled Pre-Job Deployment Node Health Testing in a Computing Cluster
Application:
18/897,875 →
Publication:
US US20260089081A1
Systems and Method for Automated Health Assessment of Distributed Computing Nodes Using Randomized Node Sampling and Seeding Pair Evaluation
Application:
19/033,661 →
Publication:
US US20260211791A1
Method for Distributing Secure Datagrams
Verifying the Authenticity of Storage Devices
Single-Slot Pcie Card with Expanded Memory
Application:
18/087,198 →
Publication:
US US20230411882A1
Selective Backup to Persistent Memory for Volatile Memory
Systems and Methods for Balancing Memory Speeds
Application:
18/238,826 →
Publication:
US US20250077447A1
Memory Modules Including Active Cooling Devices and Related Methods
Application:
18/240,402 →
Publication:
US US20250076939A1
Migrating Data Between Byte-Addressable and Block-Addressable Storage Devices in Processor-Based Devices
Memory Packaging with Integrated Active Cooling Devices and Related Methods
Application:
18/383,108 →
Publication:
US US20250132290A1
Forced Early Failure for Memory Device
Application:
18/389,379 →
Publication:
US US20250155493A1
Energy Source for Memory Device
Application:
18/389,247 →
Publication:
US US20250155941A1
Systems and Methods for Testing Thermal Conditioning of an Integrated Circuit (Ic)
Application:
18/520,843 →
Publication:
US US20250172608A1
Selective Backup to Persistent Memory for Volatile Memory
Application:
18/520,756 →
Publication:
US US20250173221A1
Serial Attached Non-Volatile Memory
Application:
18/400,185 →
Publication:
US US20240134757A1
Connector for Memory Stick
Application:
18/647,559 →
Publication:
US US20250337182A1
Substrate with Hinge
Application:
18/904,279 →
Publication:
US US20260096025A1
Memory Module Mounting Frame
Application:
18/904,392 →
Publication:
US US20260093297A1
Methods of Forming Light-Emitting Devices Having an Active Region with Electrical Contacts Coupled to Opposing Surfaces Thereof
Iii-Nitride Optoelectronic Device Structure with High Al Algan Diffusion Barrier
Lift-Off Process for Gan Films Formed on Sic Substrates and Devices Fabricated Using the Method
Method for Fabricating Group-Iii Nitride Devices and Devices Fabricated Using Method
Composite Optical Lens with an Integrated Reflector
Methods of Assembly for a Semiconductor Light Emitting Device Package
Semiconductor Light Emitting Devices Including Patternable Films Comprising Transparent Silicone and Phosphor
Group Iii Nitride Based Superlattice Structures
Methods of Processing Semiconductor Wafer Backsides Having Light Emitting Devices (Leds) Thereon
Semiconductor Light Emitting Devices and Submounts
Light Emission Device and Method Utilizing Multiple Emitters and Multiple Phosphors
Solid Colloidal Dispersions for Backlighting of Liquid Crystal Displays
Semiconductor Light Emitting Device Mounting Substrates Including a Conductive Lead Extending Therein
High Output Small Area Group Iii Nitride Leds
Light Emitting Diodes Including Barrier Layers/Sublayers
Semiconductor Light Emitting Devices Including a Luminescent Conversion Element
Substrate Removal Process for High Light Extraction Leds
High Efficiency Group Iii Nitride Led with Lenticular Surface
Semiconductor Light Emitting Circuits Including Light Emitting Diodes and Four Layer Semiconductor Shunt Devices
Substrate Buffer Structure for Group Iii Nitride Devices
Led Bonding Structures and Methods of Fabricating Led Bonding Structures
Light Emitting Devices with Active Layers That Extend into Opened Pits
High power solid-state lamp
Led Fabrication via Ion Implant Isolation
Chip-Scale Methods for Packaging Light Emitting Devices and Chip-Scale Packaged Light Emitting Devices
Roughened High Refractive Index Layer/Led for High Light Extraction
Ultra-Thin Ohmic Contacts for P-Type Nitride Light Emitting Devices
Packages for Semiconductor Light Emitting Devices Utilizing Dispensed Encapsulants
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
High Efficacy White Led
Side-Emitting Optical Coupling Device
Laser Diode Backlighting of Lc Display with at Least One Diode Generating Light Beam Having Divergence Angle and with Display Panel Having Beam Spreader to Increase Divergence
Apparatus, System and Method for Use in Mounting Electronic Elements
Method for Coating Semiconductor Device Using Droplet Deposition
Packages for Semiconductor Light Emitting Devices Utilizing Dispensed Reflectors and Methods of Forming the Same
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Apparatus and Method for Use in Mounting Electronic Elements
Uniform Emission Led Package
Submounts for Semiconductor Light Emitting Device Packages and Semiconductor Light Emitting Device Packages Including the Same
Multi-Element Led Lamp Package
Nickel Tin Bonding System for Semiconductor Wafers and Devices
Ultraviolet Light Emitting Diode
Patent:
43,725 →
Application:
11/432,793 →
Thermocompression Molding of Plastic Optical Elements
Packaged Light Emitting Devices Including Multiple Index Lenses and Multiple Index Lenses for Packaged Light Emitting Devices
Method of Forming Three-Dimensional Features on Light Emitting Diodes for Improved Light Extraction
Apparatus, System and Method for Use in Mounting Electronic Elements
System for and Method for Closed Loop Electrophoretic Deposition of Phosphor Materials on Semiconductor Devices
Efficient Emitting Led Package and Method for Efficiently Emitting Light
Led Package with Flexible Polyimide Circuit and Method of Manufacturing Led Package
Light-emitting devices having an antireflective layer that has a graded index of refraction and methods of forming the same
Leadframe-Based Packages for Solid State Emitting Devices
Light Emitting Diode Package Element with Internal Meniscus for Bubble Free Lens Placement
Light emitting diode package with optical element
Methods of Forming Semiconductor Light Emitting Device Packages by Liquid Injection Molding
Semiconductor Devices Having Self Aligned Semiconductor Mesas and Contact Layers
Modified Gold-Tin System with Increased Melting Temperature for Wafer Bonding
Quantum wells for light conversion
Semiconductor Devices Having Low Threading Dislocations and Improved Light Extraction and Methods of Making the Same
Alternative Doping for Group Iii Nitride Leds
Permanent wafer bonding using metal alloy preform discs
Systems for Assembling Components on Submounts and Methods Therefor
Integrated Heat Spreaders for Light Emitting Devices (Leds) and Related Assemblies
Expandable Led Array Interconnect
Laser Diode and Method for Fabricating Same
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Self Aligned Diode Fabrication Method and Self Aligned Laser Diode
Led Lighting Units and Assemblies with Edge Connectors
Multiple Color Lighting Element Cluster Tiles for Solid State Lighting Panels
Reflective Mounting Substrates For Light Emitting Diodes
Lighting Device
High Performance Led Package
Light Emitting Diode Wth Degenerate Coupling Structure
Light Emitting Diode with Metal Coupling Structure
Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method
Leadframe-Based Packages for Solid State Light Emitting Devices
Transparent Led Chip
Thermal Transfer in Solid State Light Emitting Apparatus and Methods of Manufacturing
Partially Filterless Liquid Crystal Display Devices and Methods of Operating the Same
Graded Dielectric Layer
Methods of Manufacturing Light Emitting Diodes Including Barrier Layers/Sublayers
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Methods of Forming Packaged Semiconductor Light Emitting Devices Having Front Contacts by Compression Molding
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements
Etching of Substrates of Light Emitting Devices
Light Emitting Devices Having Current Reducing Structures and Methods of Forming Light Emitting Devices Having Current Reducing Structures
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
Undoped and Unintentionally Doped Buffer Structures
Transparent ohmic Contacts on Light Emitting Diodes with Carrier Substrates
Side-View Surface Mount White Led
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Side Mountable Semiconductor Light Emitting Device Packages and Panels
Lighting Device
Lighting Device and Method of Making
Solid State Light Emitting Device and Method of Making Same
Microscale Optoelectronic Device Packages
Light Emitting Devices Suitable for Flip-Chip Bonding
LED Chip Design for White Conversion
Semiconductor Light Emitting Device Packages and Methods
Methods of Coating Semiconductor Light Emitting Elements by Evaporating Solvent from a Suspension
Encapsulant with Scatterer to Tailor Spatial Emission Pattern and Color Uniformity in Light Emitting Diodes
Coating method utilizing phosphor containment structure and devices fabricated using same
Optoelectronic Device with Upconverting Luminophoric Medium
Semiconductor Light Emitting Devices with Applied Wavelength Conversion Materials
Phosphor Position in Light Emitting Diodes
Encapsulant Profile for Light Emitting Diodes
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Partially Filterless and Two-Color Subpixel Liquid Crystal Display Devices, Mobile Electronic Devices Including the Same, and Methods of Operating the Same
Packaged Light Emitting Devices
Lighting Device Having Luminescent Material Between a Reflective Cup and a Solid State Light Emitter
Led with Integrated Constant Current Driver
Method of Uniform Phosphor Chip Coating and Led Package Fabricated Using Method
Light Emitting Device Packages Using Light Scattering Particles of Different Size
Light Emitting Device Packages, Light Emitting Diode (Led) Packages and Related Methods
Wafer level phosphor coating method and devices fabricated utilizing method
Polarization Doping in Nitride Based Diodes
Methods of Manufacturing Semiconductor Light Emitting Devices Including Patternable Films Comprising Phosphor
Lighting Device and Lighting Method
Reflector Packages and Semiconductor Light Emitting Devices Including the Same
Phosphor Distribution in Led Lamps Using Centrifugal Force
Semiconductor Devices Including Mesa Structures and Multiple Passivation Layers
Multiple Conversion Material Light Emitting Diode Package and Method of Fabricating Same
Light Emitting Diode Package and Method for Fabricating Same
LED array and method for fabricating same
Led with Current Confinement Structure and Surface Roughening
Wire bond free wafer level LED
Laser Diode Orientation on Mis-Cut Substrates
Textured encapsulant surface in LED packages
Flip-Chip Phosphor Coating Method and Devices Fabricated Utilizing Method
Ohmic Contacts to Nitrogen Polarity Gan
Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating
Fault Tolerant Light Emitters, Systems Incorporating Fault Tolerant Light Emitters and Methods of Fabricating Fault Tolerant Light Emitters
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Semiconductor Light Emitting Devices with High Color Rendering
Chip-Scale Methods for Packaging Light Emitting Devices and Chip-Scale Packaged Light Emitting Devices
Three Dimensional Features on Light Emitting Diodes for Improved Light Extraction
Deep Ultraviolet Light Emitting Devices and Methods of Fabricating Deep Ultraviolet Light Emitting Devices
Semiconductor Light Emitting Devices Including Flexible Silicone Film Having a Lens Therein
Light Emitting Diodes with Light Filters
Apparatus and Methods for Combining Light Emitters
Apparatus, System and Method for Use in Mounting Electronic Elements
Low Index Spacer Layer in Led Devices
Led with a Current Confinement Structure Aligned with a Contact
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
Tile for Solid State Lighting
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Light Emitting Devices Having a Roughened Reflective Bond Pad and Methods of Fabricating Light Emitting Devices Having Roughened Reflective Bond Pads
Apparatus and Methods for Selecting Light Emitters
Indium Gallium Nitride-Based Ohmic Contact Layers for Gallium Nitride-Based Devices
Methods of Assembly for a Semiconductor Light Emitting Device Package
Encapsulation for phosphor-converted white light emitting diode
Apparatus and System for Miniature Surface Mount Devices
Solid State Lighting Component
Solid State Lighting Component
Light Emitting Devices for Light Conversion and Semiconductor Chips for Fabricating the Same
Improved Bond Pad Design for Enhancing Light Extraction from Led Chips
Droop-Free High Output Light Emitting Devices and Methods of Fabricating and Operating Same
LED chips having fluorescent substrates with microholes and methods for fabricating
Forming Light Emitting Devices Including Custom Wavelength Conversion Structures
Methods of Forming Light Emitting Devices with Active Layers That Extend into Opened Pits
Cerium and Europium Doped Single Crystal Phosphors
Led Bonding Structures and Methods of Fabricating Led Bonding Structures
Phosphor Composition
Wafer Level Phosphor Coating Technique for Warm Light Emitting Diodes
Light Emitter Array
Multi-chip light emitting diode modules
Composite High Reflectivity Layer
Color Correction for Wafer Level White Leds
Aligned Multiple Emitter Package
Led Fabrication via Ion Implant Isolation
Light Emitting Diode with Improved Light Extraction
Light Emitting Diode with a Dielectric Mirror Having a Lateral Configuration
Solid Metal Block Semiconductor Light Emitting Device Mounting Substrates and Packages
Broadband Light Emitting Device Lamps for Providing White Light Output
Methods for Forming Semiconductor Light Emitting Devices and Submounts
Semiconductor Light Emitting Devices Including a Luminescent Conversion Element and Methods for Packaging the Same
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Efficiency Group Iii Nitride Led with Lenticular Surface
Emission Tuning Methods and Devices Fabricated Utilizing Methods
High Voltage Low Current Surface-Emitting Led
Semiconductor Light Emitting Circuits Including Light Emitting Diodes and Semiconductor Shunt Devices
Light Emission Device and Method Utilizing Multiple Emitters
Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
Methods of Fabricating Light Emitting Devices by Selective Deposition of Light Conversion Materials Based on Measured Emission Characteristics
Semiconductor Light Emitting Diodes Having Reflective Structures and Methods of Fabricating Same
Luminescent Particles, Methods and Light Emitting Devices Including the Same
Light Source with Near Field Mixing
Light Emitting Devices Having Roughened/Reflective Contacts and Methods of Fabricating Same
Solid State Lighting Device
Front End Scribing of Light Emitting Diode (Led) Wafers and Resulting Devices
Solid Metal Block Semiconductor Light Emitting Device Mounting Substrates
Method for Coating Semiconductor Device Using Droplet Deposition
Led Packages with Scattering Particle Regions
Light Emitting Diode Display with Tilted Peak Emission Pattern
Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials
Led Fabrication via Ion Implant Isolation
Light Emitting Diodes Including Integrated Backside Reflector and Die Attach
Independent Control of Light Emitting Diodes
High Reflectivity Mirrors and Method for Making Same
Lighting Device
Apparatus for Mounting and Electrical Connection of a Connector Between a Package Led Lamp and a Pcb
Led with Current Confinement Structure and Surface Roughening
Led Lighting Units and Assemblies with Edge Connectors
Solid State Emitter Package Including Red and Blue Emitters
Led with Conductively Joined Bonding Structure
Apparatus and Method for Use in Mounting Electronic Elements
Luminescent Particles, Methods of Identifying Same and Light Emitting Devices Including the Same
Packaged Light Emitting Devices Including Multiple Index Lenses and Methods of Fabricating the Same
Solid State Light Emitting Apparatus with Thermal Management Structures and Methods of Manufacturing
Light Emitter Array Layout for Color Mixing
Light Emitting Diode Packages
Side-View Surface Mount White Led
Saturated Yellow Phosphor Converted Led and Blue Converted Red Led
Wide Angle Oval Light Emitting Diode Package
Semiconductor Light Emitting Device Packages Including Submounts
Apparatus, System and Method for Use in Mounting Electronic Elements
Group Iii Nitride Based Light Emitting Diode Structures with Multiple Quantum Well Structures Having Varying Well Thicknesses
Lighting Devices That Comprise One or More Solid State Light Emitters
Systems and Methods for Application of Optical Materials to Optical Elements
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Photonic Crystal Phosphor Light Conversion Structures for Light Emitting Devices
High Cri Lighting Device with Added Long-Wavelength Blue Color
Warm White Leds Having High Color Rendering Index Values and Related Luminophoric Mediums
Efficient Emitting Led Package and Method for Efficiently Emitting Light
Light Emitting Devices and Systems Having Tunable Chromaticity
High Reflective Substrate of Light Emitting Devices with Improved Light Output
Led Package with Increased Feature Sizes
Surface Mount Device Thin Package
Solid State Light Emitting Diode Packages with Leadframes and Ceramic Material
Lighting Device
White-Emitting Led Chips and Method for Making Same
High Efficiency Leds with Tunnel Junctions
High Output Group Iii Nitride Light Emitting Diodes
High Voltage Low Current Surface Emitting Led
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
Light Emitting Device Packages with Improved Heat Transfer
Laser Diode and Method for Fabricating Same
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Semiconductor Light Emitting Device Substrate Strips and Packaged Semiconductor Light Emitting Devices
Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
Light Transmission Control for Masking Appearance of Solid State Light Sources
Multiple Component Solid State White Light
Indium Gallium Nitride-Based Ohmic Contact Layers for Gallium Nitride-Based Devices
Led Package with Efficient, Isolated Thermal Path
Power Surface Mount Light Emitting Die Package
Molded Chip Fabrication Method and Apparatus
Emitter Package with Angled or Vertical Led
Methods of Forming Light Emitting Devices Having Current Reducing Structures
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Solid State Lighting Component
Semiconductor Light Emitting Devices Including an Optically Transmissive Element
Semiconductor Light Emitting Devices with Optical Coatings and Methods of Making Same
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Multi-Element Led Lamp Package
Led with Self Aligned Bond Pad
Patent:
43,412 →
Application:
12/899,228 →
High Voltage Wire Bond Free Leds
Three Dimensional Features on Light Emitting Diodes for Improved Light Extraction
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Semiconductor Light Emitting Diodes Including Multiple Bond Pads on a Single Semiconductor Die
White Ceramic Led Package
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Methods of Selectively Applying Luminous Material to Light Emitting Devices Based on Measured Output Thereof
Waterproof Surface Mount Device Package and Method
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
Solid State Lighting Devices and Methods
Patent:
8,686,445 →
Application:
12/969,267 →
High Power Leds with Non-Polymer Material Lenses and Methods of Making the Same
Orientation of Electronic Devices on Mis-Cut Substrates
Electronic Device Submounts Including Substrates with Thermally Conductive Vias
Semiconductor Light Emitting Devices with Applied Wavelength Conversion Materials and Methods for Forming the Same
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements
Solid State Emitter Packages Including Accessory Leads
Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature
Light Emitting Diode (Led) Devices, Systems, and Methods
Methods, Systems, and Apparatus for Determining Optical Properties of Elements of Lighting Components Having Similar Color Points
Multi-Chip Led Devices
High Density Multi-Chip Led Devices
Multiple Configuration Light Emitting Devices and Methods
Structures and Substrates for Mounting Optical Elements and Methods and Devices for Providing the Same Background
Solid State Lighting Component Package with Reflective Layer
Conformally Coated Light Emitting Devices and Methods for Providing the Same
Horizontal Light Emitting Diodes Including Phosphor Particles
Color Correction for Wafer Level White Leds
Light Emitting Device Packages, Systems and Methods
Light-Emitting Diode Component
Power Surface Mount Light Emitting Die Package
Lighting Device with Flexibly Coupled Heatsinks
Lighting Devices That Comprise One or More Solid State Light Emitters
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Light Emitting Devices for Light Emitting Diodes (Leds)
High Cri Lighting Device with Added Long-Wavelength Blue Color
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Solid State Light Emitting Devices Including Nonhomogeneous Luminophoric Particle Size Layers
Side Mountable Semiconductor Light Emitting Device Packages and Panels
Encapsulant Profile for Light Emitting Diodes
Lighting Apparatus Providing Increased Luminous Flux While Maintaining Color Point and Cri
Light Emitting Diode with High Aspect Ratio Submicron Roughness for Light Extraction and Methods of Forming
Side View Surface Mount Led
Methods for Combining Light Emitting Devices in a White Light Emitting Apparatus That Mimics Incandescent Dimming Characteristics and Solid State Lighting Apparatus for General Illumination That Mimic Incandescent Dimming Characteristics
Encapsulant with Index Matched Thixotropic Agent
Composite High Reflectivity Layer
Thermal Transfer in Solid State Light Emitting Apparatus and Methods of Manufacturing
Molded Chip Fabrication Method and Apparatus
Packaged Light Emitting Devices
Methods of Fabricating Light Emitting Devices Including Multiple Sequenced Luminophoric Layers
Solid State Lighting Device
Led Array Having Embedded Led and Method Therefor
Light Emitting Device Array Assemblies and Related Methods
Light-Emitting Diode (Led) for Achieving an Asymmetric Light Output
Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
Light Emitting Devices
Gap Engineering for Flip-Chip Mounted Horizontal Leds
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Coated Phosphors and Light Emitting Devices Including the Same
Red Nitride Phosphors
Methods of Determining and Making Red Nitride Compositions
Miniature Surface Mount Device with Large Pin Pads
Leadframe-Based Packages for Solid State Light Emitting Devices and Methods of Forming Leadframe-Based Packages for Solid State Light Emitting Devices
Galium-Substituted Yttrium Aluminum Garnet Phosphor and Light Emitting Devices Including the Same
Conformal Gel Layers for Light Emitting Diodes
Led Devices with Narrow Viewing Angle and an Led Display Including Same
Led Device Having a Tilted Peak Emission and an Led Display Including Such Devices
Semiconductor Light Emitting Device Packages and Methods
Led Structure with Enhanced Mirror Reflectivity
Compact Optically Efficient Solid State Light Source with Integrated Thermal Management
Reflective Mounting Substrates for Flip-Chip Mounted Horizontal Leds
Light Emitting Die (Led) Packages and Related Methods
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Voltage Low Current Surface Emitting Light Emitting Diode
High Voltage Low Current Surface Emitting LED
Water Resistant Surface Mount Device Package
Broadband Light Emitting Device Lamps for Providing White Light Output
White Leds with Emission Wavelength Correction
Light Emitting Devices, Systems, and Methods
Light Emitting Devices and Methods
Lighting Device
Method for Coating Semiconductor Device Using Droplet Deposition
Leadframe-Based Packages for Solid State Light Emitting Devices Having Heat Dissipating Regions in Packaging
High Efficiency Leds
Group Iii Nitride Based Quantum Well Light Emitting Device Structures with an Indium Containing Capping Structure
Light Emitting Devices with Low Packaging Factor
Semiconductor Light Emitting Device Substrate Strips and Packaged Semiconductor Light Emitting Devices
Ultra-Thin Ohmic Contacts for P-Type Nitride Light Emitting Devices
Packaged Light Emitting Diodes Including Phosphor Coating and Phosphor Coating Systems
Light Emission Device
Attachment Devices and Methods for Light Emitting Devices
Solid State Lighting Device Including Multiple Wavelength Conversion Materials
Methods of Forming Optical Conversion Material Caps
Light Emitting Diode (Led) Packages and Related Methods
Complex Primary Optics with Intermediate Elements
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Light Emitter Devices and Methods, Utilizing Light Emitting Diodes (Leds), for Improved Light Extraction
Light Emitter Devices and Methods with Reduced Dimensions and Improved Light Output
Light Emitting Devices Having Roughened/Reflective Contacts and Methods of Fabricating Same
Light Emitting Devices
Led with Integrated Constant Current Driver
Side View Surface Mount Led
Semiconductor Light Emitting Devices Including Flexible Unitary Film on Aluminum Nitride Substrate
Methods of Determining and Making Red Nitride Compositions
Low Temperature High Strength Metal Stack for Die Attachment
High Brightness Light Emitting Diode (Led) Packages, Systems and Methods with Improved Resin Filling and High Adhesion
Cerium and Europium Doped Phosphor Compositions and Light Emitting Devices Including the Same
Light Emitter Device Packages, Modules and Methods
Components and Methods for Light Emitting Diode (Led) Lighting
Gel Underfill Layers for Light Emitting Diodes
High Reflective Board or Substrate for Leds
Lighting Device Including Multiple Wavelength Conversion Material Layers
Lighting Device Including Multiple Encapsulant Material Layers
Semiconductor Light Emitting Devices and Submounts
Composite High Reflectivity Layer
Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
Phosphor Distribution in Led Lamps Using Centrifugal Force
Light Emitting Devices for Light Emitting Diodes (Leds)
Ceramic-Based Light Emitting Diode (Led) Devices, Components and Methods
Solid State Lighting Device Including Green Shifted Red Component
LED-Array Light Source with Aspect Ratio Greater Than 1
Multi-Die Led Package
Light Emitter Devices Having Improved Chemical and Physical Resistance and Related Methods
Light Emitter Devices Having Improved Light Output and Related Methods
Light Emitting Diode (Led) Packages, Systems, Devices and Related Methods
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Light Emitting Diode (Led) Contact Structures and Process for Fabricating the Same
Light Emitting Devices Including Multiple Anodes and Cathodes
Power Surface Mount Light Emitting Die Package
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements and Methods of Forming the Same
Solid State Lighting Component
Led with Integrated Constant Current Driver
Light Emitting Diode Primary Optic for Beam Shaping
Apparatus and Methods for Selecting Light Emitters
Solid State Lighting Component Package with Reflective Polymer Matrix Layer
Light Emitter Device Packages, Components, and Methods for Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods Having Improved Performance
Light Emitting Diodes Including Barrier Sublayers
Multi-Segment Led Components and Led Lighting Apparatus Including the Same
Led Based Lighting System
Light Emitter Packages and Devices Having Improved Wire Bonding and Related Methods
Wafer Level Packaging of Light Emitting Diodes (Leds)
Luminescent Particles, Methods and Light Emitting Devices Including the Same
Led Package with Efficient, Isolated Thermal Path
Led Package with Encapsulant Having Planar Surfaces
Led Package with Multiple Element Light Source and Encapsulant Having Planar Surfaces
Aligned Multiple Emitter Package
Lighting Device
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Multi-Segment Led Lighting Apparatus Configurations
Multi-Element Led Lamp Package
Led with Integrated Constant Current Driver
Light Emitting Devices and Systems Having Tunable Chromaticity and Methods of Tuning the Chromaticity of Light Emitting Devices and Systems
Water Resistant Led Devices and an Led Display Including Same
Light Emitter Devices and Components with Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods
Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures
Apparatus and Methods for Combining Light Emitters
Yellow Phosphor Having an Increased Activator Concentration and a Method of Making a Yellow Phosphor
Apparatus for Flexible Mounting and Electrical Connection
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Submount-Free Light Emitting Diode (Led) Components and Methods of Fabricating Same
Light Emitting Devices and Packages and Related Methods with Electrode Marks on Leads
Solid State Lighting Apparatuses and Related Methods
Solid State Lighting Apparatuses and Related Methods
Light Emitter Components and Methods Having Improved Performance
Light Emitter Packages and Methods
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Semiconductor Light Emitting Diodes with Crack-Tolerant Barrier Structures and Methods of Fabricating the Same
Light Emitting Diode (Led) Chips and Devices for Providing Failure Mitigation in Led Arrays
Multi-Chip Light Emitter Packages and Related Methods
Multi-Chip Light Emitter Packages and Related Methods
Solid State Lighting Apparatus and Methods of Forming
Light Emitter Components and Methods Having Improved Electrical Contacts
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Wafer Level Packaging of Multiple Light Emitting Diodes (Leds) on a Single Carrier Die
Light Emitting Devices and Substrates with Improved Plating
Submount Based Light Emitter Components and Methods
Tilted Emission Led Array
Substrate Based Light Emitter Devices, Components, and Related Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs
Light Emitter Components, Systems, and Related Methods
Connector Devices, Systems, and Related Methods for Light Emitter Components
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Light Emitting Devices Having Current Reducing Structures
Led Assembly
Light Emitting Diodes Having Group Iii Nitride Surface Features Defined by a Mask and Crystal Planes
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Solid State Lighting Component Package with Conformal Reflective Coating
Multiple Pixel Surface Mount Device Package
Method of Providing Light Emitting Device
Light Emitting Diode Dielectric Mirror
Solid State Lighting Devices and Fabrication Methods Including Deposited Light-Affecting Elements
Electrostatic Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating
Solid State Lighting Device
Light Emitter Devices and Methods for Light Emitting Diode (Led) Chips
Led Package with Encapsulant Having Curved and Planar Surfaces
Solid State Lighting Component
Led with Surface Roughening
Side-Emitting Optical Coupling Device
Miniature Surface Mount Device
Light Emitting Devices for Light Emitting Diodes (Leds)
Solid State Lighting Apparatus with High Scotopic / Photopic (S/P) Ratio
Composite High Reflectivity Layer
High Voltage Monolithic Led Chip
Light Emitting Devices for Light Emitting Diodes (Leds)
Chip with Integrated Phosphor
Led Mini-Linear Light Engine
Light Emitting Device Packages with Improved Heat Transfer
Phosphor-converted light emitting device
Multi-Element Led Lamp
Silazane-Containing Materials for Light Emitting Diodes
Light Emitting Devices for Light Emitting Diodes (Leds)
Wafer Level Contact Pad Solder Bumping for Surface Mount Devices with Non-Planar Recessed Contacting Surfaces
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
Light Emitter Devices
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Compact Led Package with Reflectivity Layer
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Molded Chip Fabrication Method and Apparatus
Ceramic Based Light Emitting Diode (Led) Devices and Methods
Coated Phosphors and Light Emitting Devices Including the Same
Semiconductor Light Emitting Devices Including Red Phosphors That Exhibit Good Color Rendering Properties and Related Red Phosphors
Solid State Lighting Devices Incorporating Notch Filtering Materials
Solid State Light-Emitting Devices with Improved Contrast
Solid State Lighting Devices with Color Point Non-Coincident with Blackbody Locus
Light Engine Module with Removable Circuit Board
Multiple Voltage Light Emitter Packages, Systems, and Related Methods
Submount Based Light Emitter Components and Methods
Submount Based Light Emitter Components and Methods
Led Devices with Reduced Reflection and an Led Display Including Same
Tiny 6 Pin Side View Surface Mount Led
Light Emitting Diode (Led) Components Including Contact Expansion Frame
Method to Form Primary Optic with Variable Shapes and/or Geometries Without a Substrate
Solder Pads, Methods, and Systems for Circuitry Components
Multi-Layer Conversion Material for Down Conversion in Solid State Lighting
Light Emitting Diode (Led) Component Comprising a Phosphor with Improved Excitation Properties
Semiconductor Light Emitting Devices Including Multiple Red Phosphors That Exhibit Good Color Rendering Properties with Increased Brightness
Light Emitting Diode (Led) Component Comprising a Phosphor with Improved Excitation Properties
Wire Bonded Light Emitting Diode (Led) Components Including Reflective Layer
Patent:
9,214,607 →
Application:
14/478,147 →
Led Packages with Chips Having Insulated Surfaces
Methods of Fabricating Light Emitting Diodes by Masking and Wet Chemical Etching
Blue Light Emitting Devices That Include Phosphor-Converted Blue Light Emitting Diodes
Patent:
9,219,201 →
Application:
14/529,327 →
Light Emitting Diode (Led) Components and Methods
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Patent:
9,985,168 →
Application:
14/546,524 →
Light Emitting Diode (Led) Components Including Led Dies That Are Directly Attached to Lead Frames
Leadframe Based Light Emitter Components and Related Methods
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
High Efficiency Leds and Methods of Manufacturing
Methods for Combining Light Emitting Devices in a White Light Emitting Apparatus that Mimics Incandescent Dimming Characteristics and Solid State Lighting Apparatus for General Illumination that Mimic Incandescent Dimming Characteristics
Solid State Lighting Apparatuses, Systems, and Related Methods
Led Package with Encapsulant Having Planar Surfaces
Graded Vias for Led Chip P- and N- Contacts
Patent:
9,412,907 →
Application:
14/690,284 →
Multi-Segment Monolithic Led Chip
High Voltage Monolithic Led Chip with Improved Reliability
Light Emitting Diode Package and Method for Fabricating Same
Solid State Light Emitter Devices and Methods
Self-Aligned Floating Mirror for Contact Vias
Voltage Configurable Solid State Lighting Apparatuses, Systems, and Related Methods
Solid State Lighting Apparatuses with Non-Uniformly Spaced Emitters for Improved Heat Distribution, Sysytem Having the Same, and Methods Having the Same
Light Emitting Diodes and Methods with Encapsulation
Smart Pixel Surface Mount Device Package
Solid State Lighting Components
Light Emitting Devices Having Closely-Spaced Broad-Spectrum and Narrow-Spectrum Luminescent Materials and Related Methods
Light Emitter Components and Related Methods
Stabilized Quantum Dot Structure and Method of Making a Stabilized Quantum Dot Structure
Phosphor Composition
Light Emitting Diodes, Components and Related Methods
Low Optical Loss Flip Chip Solid State Lighting Device
Light Emitting Diode (Led) Devices, Components and Methods
High Density Pixelated Led and Devices and Methods Thereof
High Density Pixelated Led and Devices and Methods Thereof
Light Emitting Diode (Led) Components Including Multiple Led Dies That Are Attached to Lead Frames
Light Engine Modules Including a Support and a Solid State Light Emitter
Wire Bond Free Wafer Level Led
Substrates for Light Emitting Diodes and Related Methods
Illumination Devices, and Methods of Fabricating Same
High Brightness, Low-Cri Semiconductor Light Emitting Devices Including Narrow-Spectrum Luminescent Materials
Patent:
9,905,735 →
Application:
15/475,366 →
Wafer Level Packaging of Light Emitting Diodes (Leds)
Multiple Led Light Source Lens Design in an Integrated Package
Tunable Integrated Optics Led Components and Methods
Multiple Pixel Surface Mount Device Package
High Voltage Monolithic Led Chip
Led Apparatuses and Methods for High Lumen Output Density
Light Emitting Diodes, Components and Related Methods
Substrate Based Light Emitter Devices, Components, and Related Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diodes, Components and Related Methods
Lighting Devices That Comprise One or More Solid State Light Emitters
Stabilized Luminescent Nanoparticles Comprising a Perovskite Semiconductor and Method of Fabrication
Stabilized Quantum Dot Composite and Method of Making a Stabilized Quantum Dot Composite
Light Emitting Devices Including Narrowband Converters for Outdoor Lighting Applications
Configurable Circuit Layout for Leds
Light Emitting Devices Having Closely-Spaced Broad-Spectrum and Narrow-Spectrum Luminescent Materials and Related Methods
Reflective Layers for Light-Emitting Diodes
Solid State Lighting Component Package with Conformal Reflective Coating
Solid State Lighting Devices with Opposing Emission Directions
Clear Coating for Light Emitting Device Exterior Having Chemical Resistance and Related Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diode (Led) Components and Methods
Light-Emitting Diode Package with Light-Altering Material
Apparatus and Methods for Mass Transfer of Electronic Die
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Led Apparatuses and Methods
Patent:
10,453,827 →
Application:
15/993,540 →
Stabilized Fluoride Phosphor for Light Emitting Diode (Led) Applications
Led Systems, Apparatuses, and Methods
High Density Pixelated-Led Chips and Chip Array Devices
Led Device, System, and Method with Adaptive Patterns
Light-Emitting Diode Packages
Light-Emitting Diode Packages with Individually Controllable Light-Emitting Diode Chips
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Group Iii Nitride Led Structures with Improved Electrical Performance
High Voltage Monolithic Led Chip
High Density Pixelated-Led Chips and Chip Array Devices
Light Emitting Diode Packages
Indicia for Light Emitting Diode Chips
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Lighting Devices That Comprise One or More Solid State Light Emitters
Light Emitting Diode Packages
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Voltage Monolithic Led Chip with Improved Reliability
Phosphor Composition
Contact Structures for Light Emitting Diode Chips
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light Emitting Diodes, Components and Related Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Semiconductor Light Emitting Devices Including Superstrates with Patterned Surfaces
High Density Pixelated Led and Devices and Methods Thereof
Stabilized Quantum Dot Composite and Method of Making a Stabilized Quantum Dot Composite
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Solid-State Light Emitting Devices Including Light Emitting Diodes in Package Structures
Tunable Integrated Optics Led Components and Methods
Light-Emitting Diode Chip Structures
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Lumiphoric Arrangements for Light Emitting Diode Packages
Lighting Devices That Comprise One or More Solid State Light Emitters
Light Emitting Diode (Led) Components and Methods
Rgb Led Package with Bsy Emitter
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
Lumiphoric Material Region Arrangements for Light Emitting Diode Packages
Light-Emitting Diode Package with Light-Altering Material
Submount Structures for Light Emitting Diode Packages
Stabilized Fluoride Phosphor for Light Emitting Diode (Led) Applications
Apparatus and Methods for Mass Transfer of Electronic Die
Light Emitting Diodes, Components and Related Methods
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light Emitting Diode Packages
Light-Altering Material Arrangements for Light-Emitting Devices
Light-Emitting Diode Chip with Electrical Overstress Protection
Solid State Lighting Components
Active Electrical Elements with Light-Emitting Diodes
Lens Arrangements for Light-Emitting Diode Packages
High Voltage Monolithic Led Chip with Improved Reliability
Phosphor Composition
High Density Pixelated Led and Devices and Methods Thereof
Reflective Layers for Light-Emitting Diodes
High Density Pixelated-Led Chips and Chip Array Devices
Light-Altering Particle Arrangements for Light-Emitting Devices
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Binder Materials for Light-Emitting Devices
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Light-Emitting Diode Package with Light-Altering Material
Spacer Layer Arrangements for Light-Emitting Diodes
High Voltage Monolithic Led Chip
Pixelated-Led Chips with Inter-Pixel Underfill Materials, and Fabrication Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Texturing for High Density Pixelated-Led Chips and Chip Array Devices
Tunable Integrated Optics Led Components and Methods
Wafer Level Packaging of Light Emitting Diodes (Leds)
Light Emitting Diodes, Components and Related Methods
Support Structures for Light Emitting Diode Packages
Light Emitting Diode Package and Method for Fabricating Same
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Solid-State Light Emitting Device with Improved Color Emission
Contact Structures for Light Emitting Diode Chips
Light-Emitting Diode Packages
Led Chips with Irregular Microtextured Light Extraction Surfaces, and Fabrication Methods
Lumiphoric Arrangements for Light Emitting Diode Packages
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Power Light-Emitting Diode Arrays and Related Devices
Patent:
11,405,996 →
Application:
17/383,923 →
Edge Structures for Light Shaping in Light-Emitting Diode Chips
Localized Surface Plasmon Resonance for Enhanced Photoluminescence of Lumiphoric Materials
Broad Electromagnetic Spectrum Light-Emitting Diode Packages
Integrated Warning Structures for Energized Ultraviolet Light-Emitting Diode Packages
Polarization Structures for Light-Emitting Diodes
Led Chips and Devices with Textured Light-Extracting Portions, and Fabrication Methods
Multi-Segment Monolithic Led Chip
Arrangements of Light-Altering Coatings in Light-Emitting Diode Packages
Arrangements for Light Emitting Diode Packages
Light-Emitting Devices for Horticulture Applications
Patent:
11,547,063 →
Application:
17/663,940 →
Phosphor Composition
Interconnects for Light Emitting Diode Chips
High Density Pixelated Led and Devices and Methods Thereof
Reflective Layers for Light-Emitting Diodes
Integration of Secondary Optics into Chip Covers for Improved Optical Emission of High Intensity Light-Emitting Diodes
Light-Emitting Diodes with Mixed Clock Domain Signaling
Rgb Led Package with Bsy Emitter
High Voltage Monolithic Led Chip with Improved Reliability
Three Dimensional Led Device and Method of Manufacture
Patent:
12,078,300 →
Application:
18/198,339 →
Asymmetric Led Optic for Asymmetric Luminaire Applications
Patent:
12,018,833 →
Application:
18/216,879 →
Light-Emitting Diode Packages with Transformation and Shifting of Pulse Width Modulation Signals and Related Methods
Patent:
12,014,677 →
Application:
18/298,049 →
Lamp Package
Patent:
640,645 →
Application:
29/328,924 →
Light Emitting Diode
Patent:
641,719 →
Application:
29/338,186 →
Light Emitting Diode (Led) Package
Patent:
648,686 →
Application:
29/360,791 →
Light Emitting Diode
Patent:
669,040 →
Application:
29/365,193 →
Package for Light Emitting Diode (Led) Lighting
Patent:
643,819 →
Application:
29/365,939 →
Led Package
Patent:
662,902 →
Application:
29/377,708 →
Light Emitting Device Package
Patent:
650,760 →
Application:
29/379,636 →
Light Emitting Device Package
Patent:
676,000 →
Application:
29/380,387 →
Light Emitting Device Package
Patent:
648,687 →
Application:
29/380,549 →
Led Package
Patent:
656,906 →
Application:
29/380,636 →
High Brightness Led Package
Patent:
679,842 →
Application:
29/382,394 →
Light Emitting Diode
Patent:
672,731 →
Application:
29/383,906 →
Light Emitting Diode
Patent:
689,830 →
Application:
29/383,908 →
Light Emitting Diode
Patent:
682,225 →
Application:
29/383,910 →
High-Density Emitter Package
Patent:
658,139 →
Application:
29/384,360 →
Emitter Package
Patent:
660,257 →
Application:
29/384,363 →
Light Emitting Diode
Patent:
675,580 →
Application:
29/386,077 →
Light Emitting Diode
Patent:
673,125 →
Application:
29/386,078 →
Miniature Surface Mount Device
Patent:
684,545 →
Application:
29/386,582 →
Miniature Surface Mount Device
Patent:
691,100 →
Application:
29/386,583 →
Led Chip
Patent:
691,569 →
Application:
29/388,240 →
Lamp Package
Patent:
681,573 →
Application:
29/392,801 →
Led Component
Patent:
700,584 →
Application:
29/396,759 →
Light Emitting Diode
Patent:
675,581 →
Application:
29/396,907 →
Lamp Packages
Patent:
691,973 →
Application:
29/396,909 →
Led Chip
Patent:
673,126 →
Application:
29/396,911 →
Package for Light Emitting Diode (Led) Lighting
Patent:
667,801 →
Application:
29/397,017 →
Light Emitting Diode (Led) Package
Patent:
659,657 →
Application:
29/401,692 →
Lamp Packages
Patent:
689,209 →
Application:
29/402,571 →
Lamp Packages
Patent:
689,210 →
Application:
29/402,573 →
Light Emitting Device Package
Patent:
661,264 →
Application:
29/403,433 →
Light Emitting Device Component
Patent:
702,653 →
Application:
29/404,913 →
Light Emitting Device Package
Patent:
667,803 →
Application:
29/407,084 →
Light Emitting Device Package
Patent:
676,395 →
Application:
29/408,955 →
Light Emitting Device Component
Patent:
705,181 →
Application:
29/412,166 →
Light Emitting Device
Patent:
707,192 →
Application:
29/412,168 →
Led Package
Patent:
671,661 →
Application:
29/412,854 →
Light Emitting Device
Patent:
706,231 →
Application:
29/417,220 →
Led-Array Package
Patent:
703,624 →
Application:
29/417,704 →
Solid State Lighting Apparatus
Patent:
708,155 →
Application:
29/418,797 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
712,849 →
Application:
29/420,874 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
713,804 →
Application:
29/420,876 →
Light Emitting Diode (Led) Package
Patent:
709,464 →
Application:
29/423,422 →
Led Package
Patent:
711,840 →
Application:
29/424,353 →
Led Package
Patent:
725,613 →
Application:
29/424,861 →
Light Emitter Device
Patent:
721,339 →
Application:
29/425,831 →
Lamp Package
Patent:
703,348 →
Application:
29/426,661 →
Light Emitting Diode (Led) Package
Patent:
711,841 →
Application:
29/430,291 →
Led Package
Patent:
718,258 →
Application:
29/431,064 →
Light Emitter Device
Patent:
753,612 →
Application:
29/431,542 →
Package for Light Emitting Diode (Led) Lighting
Patent:
708,156 →
Application:
29/432,988 →
Light Emitter Package
Patent:
704,154 →
Application:
29/433,842 →
Led Chip
Patent:
689,031 →
Application:
29/436,228 →
Light Emitting Diode (Led) Package
Patent:
749,051 →
Application:
29/439,629 →
Light Emitting Diode (Led) Package
Patent:
738,832 →
Application:
29/444,591 →
Light Emitter Device
Patent:
712,850 →
Application:
29/451,177 →
High Brightness Led Package
Patent:
704,358 →
Application:
29/451,761 →
Light Emitting Unit
Patent:
738,542 →
Application:
29/452,692 →
Led Package
Patent:
735,683 →
Application:
29/453,958 →
Light Emitter Unit
Patent:
739,565 →
Application:
29/459,231 →
Light Emitter Unit
Patent:
740,453 →
Application:
29/459,233 →
Led Package with Encapsulant
Patent:
718,725 →
Application:
29/462,353 →
Led Package
Patent:
758,976 →
Application:
29/462,795 →
Led Package
Patent:
746,240 →
Application:
29/478,014 →
Light Emitting Device Component
Patent:
736,725 →
Application:
29/487,954 →
Led Package with Truncated Encapsulant
Patent:
790,486 →
Application:
29/503,928 →
Light Emitting diode device
Patent:
826,871 →
Application:
29/511,587 →
Led Package
Patent:
777,122 →
Application:
29/518,882 →
Solid State Light Emitter Component
Patent:
778,848 →
Application:
29/523,168 →
Led Package
Patent:
783,547 →
Application:
29/529,243 →
Light Emitting Device
Patent:
823,492 →
Application:
29/579,906 →
Light Emitting Device
Patent:
851,790 →
Application:
29/616,841 →
Led Package
Patent:
908,929 →
Application:
29/628,363 →
Led Package
Patent:
892,066 →
Application:
29/655,949 →
Light Emitting Diode Chip
Patent:
920,934 →
Application:
29/658,067 →
Light Emitting Diode Package
Patent:
902,448 →
Application:
29/661,900 →
Light Emitting Device
Patent:
890,961 →
Application:
29/689,497 →
Light Emitting Diode Package
Patent:
926,714 →
Application:
29/711,302 →
Light Emitting Diode Package
Patent:
1,000,400 →
Application:
29/779,119 →
Light-Emitting Diode Package
Patent:
996,377 →
Application:
29/827,155 →
Light-Emitting Diode Package
Patent:
996,378 →
Application:
29/829,994 →
Light-Emitting Diode Package
Patent:
1,070,144 →
Application:
29/876,406 →
Light-Emitting Diode Package
Patent:
1,060,278 →
Application:
29/877,879 →
Light-Emitting Diode Package
Patent:
1,036,711 →
Application:
29/877,887 →
Ultra-Low Latency Remote Application Access
Secure, Anonymous Browsing with a Remote Browsing Server
Secure, Anonymous Browsing with a Remote Browsing Server
Secure, Anonymous Browsing with a Remote Browsing Server
Ultra-Low Latency Remote Application Access
Multi-Service Platform System and Method
Method of Flow Control
Method of Discovering and Operating a Payload Node
Method of Vmebus Split-Read Transaction
Payload Module Having a Switched Fabric Enabled Mezzanine Card
Switched Fabric Mezzanine Storage Module
Multi-Network Modules with Hot-Swap Capability
Fabric Enabled Storage Module
Method of Transporting a Rapidio Packet Over an Ip Packet Network
Method of Monitoring a Power Distribution Unit
High Density Power Distribution Unit
Telco Hub and Method
Monolithic Backplane Having a First and Second Portion
Power Distribution System
Method of Latent Fault Checking a Cooling Module
Re-Configurable Pci-Express Switching Device
Embedded Computer Chassis with Redundant Fan Trays
Blade Circuit Cross-Connection Adapted for Peer-to-Peer Backplanes
Patent:
7,136,290 →
Application:
11/443,784 →
Hardware Description Language (Hdl) Generation Systems and Methods for Custom Circuit Boards
System and Method for Supplying Power to Electronics Enclosures Utilizing Distributed Dc Power Architectures
System and Method for Restricting Airflow Through a Portion of an Electronics Enclosure
System and Method for Blocking Lateral Airflow Paths Between Modules in an Electronic Equipment Enclosure
Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
Usb Receptacle with a Riser at Its End
Configurable Cooling For Rugged Environments
Integrated Thermal Inserts And Cold Plate
Method and Device to Provide Uniform Cooling in Rugged Environments
High Precision Timer in CPU Cluster
Extended Heat Frame For Printed Circuit Board
Fault-Tolerant Failsafe Computer System Using COTS Components
Task Based Voting For Fault-Tolerant Fail Safe Computer Systems
Safety Relay Box System
Voting Architecture for Safety and Mission Critical Systems
Reliable, Low Latency Hardware And Software Inter-Process Communication Channel For Safety Critical System
Operation of I/O in a Safe System
Direct Connect Algorithm
Method And System Of Synchronizing Processors To The Same Computational Point
Time-Division Multiplexing Data Aggregation Over High Speed Serializer/Deserializer Lane
Alignment Mechanism for Cabling to a Cylinder Head
Thermal Conduction To A Cylindrical Shaft
Modular Electronics for Cylinders
Method And System of Synchronizing Processors To The Same Computational Point
End To End FPGA Diagnostics For A Safety System
FPGA Mismatched Packet Stop For A Safety System
Integrated Thermal Inserts and Cold Plate
Daisy-Chain of Safety Systems
Operation of I/O in a Safe System
Signal Pairing for Module Expansion of a Failsafe Computing System
Universal Bracket for Multiple Form Factors of PCIe Cards in OCP Sled Environments
Printed Circuit Board Electrical Connector Locking Via Threaded Fasteners
Carrier for One or More Solid State Drives (SSDs)
Solid State Drive Architecture
Fabric-Based Solid State Drive Architecture
Compute Engine in a Smart Ssd Exploiting Locality of Data
Patent:
8,935,463 →
Application:
14/147,462 →
Enhanced interface to firmware operating in a Solid State Drive
Enhanced Interface to Firmware Operating in a Solid State Drive
Clock and Power Fault Detection for Memory Modules
Memory Modules with Error Detection and Correction
Multi-Chip Package
Memory Module with Vertically Accessed Interposer Assemblies
Clock and Power Fault Detection for Memory Modules
Clock and Power Fault Detection for Memory Modules
Dynamic Back-Up Storage System with Rapid Restore and Method of Operation Thereof
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Non-Volatile Dynamic Random Access Memory System with Non-Delay-Lock-Loop Mechanism and Method of Operation Thereof
Computing System with Non-Disruptive Fast Memory Restore Mechanism and Method of Operation Thereof
Memory Management System with Power Source and Method of Manufacture Thereof
Non-Volatile Memory Packaging System with Caching and Method of Operation Thereof
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Computing System with Backup and Recovery Mechanism and Method of Operation Thereof
Patent:
9,779,016 →
Application:
13/940,118 →
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Patent:
8,626,998 →
Application:
13/972,337 →
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
9,603,252 →
Application:
14/077,908 →
Integrated Circuit Device System with Elevated Stacked Configuration and Method of Manufacture Thereof
Patent:
9,648,754 →
Application:
14/231,622 →
Data Storage System with Information Exchange Mechanism and Method of Operation Thereof
Memory Module with Power Management System and Method of Operation Thereof
Patent:
9,576,615 →
Application:
14/884,369 →
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Memory Management System with Backup System and Method of Operation Thereof
Memory Management System with Multiple Boot Devices and Method of Operation Thereof
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Interconnected Memory System and Method of Operation Thereof
High Density Memory Module System
Memory Controller for High Latency Memory Devices
Flash-Based Block Storage System with Trimmed Space Management and Method of Operation Thereof
Virtual Timer for Data Retention
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
10,529,688 →
Application:
15/462,885 →
Memory Module Test Adapter
Patent:
10,510,432 →
Application:
15/659,420 →
Centralized Backup Power Module
Patent:
10,551,892 →
Application:
15/709,257 →
Portable Module System
Patent:
10,488,892 →
Application:
15/789,041 →
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Catastrophic Event Memory Backup System
Patent:
11,561,739 →
Application:
16/889,729 →
Memory Centric Computing Storage Controller System
Patent:
11,182,325 →
Application:
16/889,727 →
Serial Attached Non-Volatile Memory
Systems and Methods for Memory Snapshotting
Storage System with Data Management Mechanism and Method of Operation Thereof
Storage System with Load Balancing Mechanism and Method of Operation Thereof
Storage System with Load Balancing Mechanism and Method of Operation Thereof
Storage System with Data Management and Protection Mechanism and Method of Operation Thereof
Storage System with Allocated Storage Device Mechanism and Method of Operation Thereof
Storage System with File Priority Mechanism and Method of Operation Thereof
Methods for Packaging of a Semiconductor Light Emitting Device
Multiple Component Solid State White Light
High Efficiency Led with Tunnel Junction Layer
Light Emitting Diode Packages
Multiple Configuration Light Emitting Device Package
Patent:
650,343 →
Application:
29/384,476 →
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 2019
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 048235/0006 →
Assignment of Assignor's Interest
Jan 28, 2021
From: KAMP, ERIC; MILLER, DEREK; BLAKELY, COLIN
To: CREE, INC.
Reel/Frame 055065/0989 →
Assignment of Assignor's Interest
Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
Assignment of Assignor's Interest
Jul 29, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 057017/0311 →
Assignment of Assignor's Interest
Oct 21, 2021
From: MEADOWS DAVIS, MORGAN; BLAKELY, COLIN; DAMBORSKY, KYLE; CHECK, MICHAEL
To: CREELED, INC.
Reel/Frame 057861/0422 →
Assignment of Assignor's Interest
Dec 22, 2021
From: SUICH, DAVID; HUSSELL, CHRISTOPHER P.; CHECK, MICHAEL; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 058455/0725 →
Assignment of Assignor's Interest
Feb 3, 2022
From: DZYUBENKO, BORIS; HUSSELL, CHRISTOPHER P.; TUDORICA, FLORIN A.
To: CREELED, INC.
Reel/Frame 058876/0126 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Assignment of Assignor's Interest
Feb 11, 2022
From: BALKEY, SETH JOSEPH; WUESTER, STEVEN; CHECK, MICHAEL
To: CREELED, INC.
Reel/Frame 058989/0273 →
Assignment of Assignor's Interest
Feb 17, 2022
From: CELANO, THOMAS; RILE, ALEXIS; MILLER, DEREK; SUICH, DAVID
To: CREELED, INC.
Reel/Frame 059038/0486 →
Assignment of Assignor's Interest
Feb 24, 2022
From: BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 059085/0632 →
Assignment of Assignor's Interest
Mar 4, 2022
From: FAVALE, JOSEPH M., JR.; SCHMIDT, ROBERT DAVID
To: CREELED, INC.
Reel/Frame 059173/0575 →
Assignment of Assignor's Interest
Mar 30, 2022
From: FRANCIS, AARON; MILLER, DEREK
To: CREELED, INC.
Reel/Frame 059445/0425 →
Assignment of Assignor's Interest
Apr 4, 2022
From: TRINKLE, SARAH; RILE, ALEXIS; WILCOX, ROBERT; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 059487/0235 →
Assignment of Assignor's Interest
Apr 6, 2022
From: LING, TIMOTHY; MOHN, RYAN; RANDOLPH, DAVID N.; PEOPLES, DAVID
To: CREELED, INC.
Reel/Frame 059513/0418 →
Assignment of Assignor's Interest
Apr 21, 2022
From: RILE, ALEXIS; WILCOX, ROBERT; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 059668/0677 →
Assignment of Assignor's Interest
May 31, 2022
From: PICKETT, GUY; SUICH, DAVID; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 060055/0384 →
Assignment of Assignor's Interest
Jun 9, 2022
From: BLAKELY, COLIN; CHECK, MICHAEL; WILCOX, ROBERT; SUICH, DAVID
To: CREELED, INC.
Reel/Frame 060151/0503 →
Assignment of Assignor's Interest
Jun 21, 2022
From: CHECK, MICHAEL; BERGMANN, MICHAEL JOHN; DILLON, ALAN WELLFORD; HABERERN, KEVIN
To: CREELED, INC.
Reel/Frame 060257/0858 →
Assignment of Assignor's Interest
Jun 27, 2022
From: WILCOX, ROBERT; BLAKELY, COLIN
To: CREELED, INC.
Reel/Frame 060322/0223 →
Assignment of Assignor's Interest
Aug 3, 2022
From: CHECK, MICHAEL; WUESTER, STEVEN; CELANO, THOMAS; SUICH, DAVID
To: CREELED, INC.
Reel/Frame 060710/0659 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →