IP Library Granted Patent US 9,923,132
Granted Patent B2
US 9,923,132 · App. 13/902,411 · Granted Mar 20, 2018

Solid state lighting component package with conformal reflective coating

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Quick Facts
Patent No.
US 9,923,132
App. No.
13/902,411
Granted
Mar 20, 2018
Kind
B2
Abstract

A solid state lighting package is provided. The package comprising at least one LED element positioned on a top surface of a substrate and a conformal reflective layer of inorganic particles, whereby at least of portion of the light emitted by the LED element is reflected by the conformal reflective layer. A method of manufacturing a solid state lighting package comprising the distribution of inorganic particles, and a method of increasing the luminous flux thereof, is also provided.

Claims (14)

1. A solid state lighting package comprising:

a substrate or a submount with at least one vertical surface that absorbs at least one wavelength emitted by at least one LED element, a metal contact or pad deposited directly on the substrate or the submount, the metal contact or pad having at least one side surface projecting from the substrate or the submount; and

the at least one LED deposited directly on the metal contact or pad, the at least one LED having a light emitting surface at least partially overhanging the side surface of the metal contact or pad by a height;

a conformal reflective layer having a thickness, the conformal reflective layer at least partially coating the light emitting surface that overhangs the side surface of the metal contact or pad, wherein the height is greater than the thickness, the conformal reflective layer conformally attached to the at least one side surface of the metal contact or pad, the conformal reflective layer conformally covering the at least one vertical surface of the substrate or submount and the light emitting surface that is at least partially overhanging the side surface of the metal contact or pad, without covering any remaining surfaces of the at least one LED.

2. The solid state lighting package of claim 1 , further comprising a transparent matrix deposited on or under the conformal reflective layer.

3. The solid state lighting package of claim 2 , wherein the transparent matrix is at least one of a polydialkylsiloxane, polydialkylphenylsiloxane, polydialkylalkylphenylsiloxane, and polyalklyphenylsiloxanes, or blends thereof.

4. The solid state lighting package of claim 2 , wherein the transparent matrix further comprises a highly reflective material that is dispersed, distributed, or suspended therein, the highly reflective material being the same or different from that of the conformal reflective layer.

5. The solid state lighting package of claim 2 , wherein the transparent matrix is directly deposited on the conformal reflective layer.

6. The solid state lighting package of claim 1 , further comprising a color shifting element, a diffusing material, or a diffractive material.

7. The solid state lighting package of claim 1 , wherein the height is greater than the twice the thickness.

8. The solid state lighting package of claim 1 , wherein the substrate or submount absorbs at least one wavelength emitted by the at least one LED element.

9. The solid state lighting package of claim 8 , wherein the substrate or submount comprises aluminum oxide or aluminum nitride, and the at least one LED comprises sapphire.

10. The solid state lighting package of claim 1 , wherein the substrate or submount comprises aluminum oxide or aluminum nitride and the at least one LED comprises silicon carbide.

11. The solid state lighting package of claim 1 , wherein the thickness of the conformal layer at least partially positioned beneath the light emitting surface at least partially overhanging the side surface of the metal contact or pad and the thickness of the conformal layer attached to the at least one side surface of the metal contact or pad; are substantially uniform with the thickness of the conformal reflective layer covering the at least one vertical surface of the substrate or submount.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2013
From: ANDREWS, PETER
To: CREE, INC.
Reel/Frame 030491/0416 →