Patent Assignment
Reel/Frame 071725/0207
Release of Patent Security Interest Recorded at R/F 058983/0001
Recorded: 2025-06-25
Pages: 100
Assignor
CITIZENS BANK, N.A.
Executed: 2025-06-24
Assignees
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
SMART EMBEDDED COMPUTING, INC.
2900 SOUTH DIABLO WAY, SUITE 190, TEMPE, ARIZONA, 85282
SMART HIGH RELIABILITY SOLUTIONS LLC
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
CREELED, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Properties
(927)
Method for Failover Management in a Synchronous Optical Network Using Standard Protocols
Patent:
6,738,345 →
Application:
09/598,090 →
Apparatus and Method for Electrically Coupling a Bezel
System and Method for Translation of Sdram and Ddr Signals
Method of Operating a Storage Device
Multi-Service Platform Module
Group Iii Nitride Based Light Emitting Diode Structures with a Quantum Well and Superlattice, Group Iii Nitride Based Quantum Well Structures and Group Iii Nitride Based Superlattice Structures
Multi-Service Platform System and Method
Flip-Chip Bonding of Light Emitting Devices and Light Emitting Devices Suitable for Flip-Chip Bonding
Collets for Bonding of Light Emitting Diodes Having Shaped Substrates
Cabinet for Cooling Electronic Modules
Patent:
6,611,428 →
Application:
10/216,955 →
Method of Flow Control
Light Emitting Device Incorporating a Luminescent Material
Configurable Baseboard to Power a Mezzanine Card and Method
Methods and Systems for Fabricating Broad Spectrum Light Emitting Devices
Methods and Apparatus for Filtering Electromagnetic Interference from a Signal in an Input/Output Port
Rear Interconnect Blade for Rack Mounted Systems
Systems for Assembling Components on Submounts and Methods Therefor
Group Iii Nitride Led with Silicon Carbide Cladding Layer
Group Iii Nitride Contact Structures for Light Emitting Devices
A Communications System Embedding Communications Session into Atm Virtual Circuit at Line Interface Card and Routing the Virtual Circuit to a Processor Card via a Backplane
Inverted Light Emitting Diode on Conductive Substrate
Reflective Ohmic Contacts for Silicon Carbide Including a Layer Consisting Essentially of Nickel, Methods of Fabricating Same, and Light Emitting Devices Including the Same
Light Emitting Devices for Light Conversion and Methods and Semiconductor Chips for Fabricating the Same
Latching Apparatus for Mounting a Computer Module
Multiple Component Solid State White Light
N/2 Slot Switch Module
Power Surface Mount Light Emitting Die Package
Solid Metal Block Mounting Substrates for Semiconductor Light Emitting Devices
Transmissive Optical Elements Including Transparent Plastic Shell Having a Phosphor Dispersed Therein, and Methods of Fabricating Same
Phosphor-Coated Light Emitting Diodes Including Tapered Sidewalls, and Fabrication Methods Therefor
Molded Chip Fabrication Method
Subnet Replicated Database Elements
Light Emitting Diode with Porous Sic Substrate and Method for Fabricating
Power Surface Mount Light Emitting Die Package
Led Package Die Having a Small Footprint
Composite Leadframe Led Package and Method of Making the Same
Methods of Forming Semiconductor Devices Including Mesa Structures and Multiple Passivation Layers
Methods of Forming Semiconductor Devices Having Self Aligned Semiconductor Mesas and Contact Layers
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Composite White Light Source and Method for Fabricating
Etching of Substrates of Light Emitting Devices
Semiconductor Light Emitting Devices Including Flexible Film Having Therein an Optical Element
Light-Emitting Devices Having Coplanar Electrical Contacts Adjacent to a Substrate Surface Opposite an Active Region and Methods of Forming the Same
Methods of Forming Light-Emitting Devices Having an Active Region with Electrical Contacts Coupled to Opposing Surfaces Thereof
Methods of Forming Light-Emitting Devices Having an Antireflective Layer That Has a Graded Index of Refraction
Light-Emitting Devices Having Multiple Encapsulation Layers with at Least One of the Encapsulation Layers Including Nanoparticles and Methods of Forming the Same
Method of Discovering and Operating a Payload Node
Methods of Fabricating Light Emitting Devices Using Mesa Regions and Passivation Layers
Bonding of Light Emitting Diodes Having Shaped Substrates
Method of Vme Module Transfer Speed Auto-Negotiation
High powered light emitter packages with compact optics
Vxs Payload Module and Method
Led Fabrication via Ion Implant Isolation
Iii-Nitride Optoelectronic Device Structure with High Al Algan Diffusion Barrier
Lift-Off Process for Gan Films Formed on Sic Substrates and Devices Fabricated Using the Method
Method for Fabricating Group-Iii Nitride Devices and Devices Fabricated Using Method
Light Emitting Device Incorporating a Luminescent Material
Full-Span Switched Fabric Carrier Module and Method
Composite Optical Lens with an Integrated Reflector
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Integrally Embedded Backplane Data Device and Method
Reflective Optical Elements for Semiconductor Light Emitting Devices
Method of Vmebus Split-Read Transaction
Vmebus Split-Read Transaction
Group Iii Nitride Based Quantum Well Light Emitting Device Structures with an Indium Containing Capping Structure
Light Emitting Devices Having a Reflective Bond Pad and Methods of Fabricating Light Emitting Devices Having Reflective Bond Pads
Stacked 3U Payload Module Unit
Methods of Assembly for a Semiconductor Light Emitting Device Package
Integrated Power Supply and Air Inlet Unit
Method and Apparatus for Cooling a Module Portion
Methods of Coating Semiconductor Light Emitting Elements by Evaporating Solvent from a Suspension
Semiconductor Light Emitting Devices Including Patternable Films Comprising Transparent Silicone and Phosphor
Switched Fabric Mezzanine Storage Module
Payload Module Having a Switched Fabric Enabled Mezzanine Card
Fabric Enabled Storage Module
Switch Module Having One of 3U and 9U Form Factor
Multi-Network Modules with Hot-Swap Capability
High Efficiency Group Iii Nitride-Silicon Carbide Light Emitting Diode
Group Iii Nitride Based Superlattice Structures
3U Payload Module Configurations
Methods of Processing Semiconductor Wafer Backsides Having Light Emitting Devices (Leds) Thereon
Light Emitting Devices with Self Aligned Ohmic Contacts
Semiconductor Light Emitting Devices and Submounts
Method of Communicating a Vmebus Signal Over Ip Packet Network
Method of Transporting a Rapidio Packet Over an Ip Packet Network
Light Emitting Devices for Light Conversion and Methods and Semiconductor Chips for Fabricating the Same
Light Emission Device and Method Utilizing Multiple Emitters and Multiple Phosphors
Solid Colloidal Dispersions for Backlighting of Liquid Crystal Displays
Led Package Die Having a Small Footprint
Semiconductor Light Emitting Device Mounting Substrates Including a Conductive Lead Extending Therein
High Output Small Area Group Iii Nitride Leds
Light Emitting Diodes Including Barrier Layers/Sublayers
Led with Current Confinement Structure and Surface Roughening
Method for Packaging a Light Emitting Device by One Dispense Then Cure Step Followed by Another
Methods for Packaging of a Semiconductor Light Emitting Device
Semiconductor Light Emitting Devices Including a Luminescent Conversion Element
Substrate Removal Process for High Light Extraction Leds
Boundary Scan Testing System
High Efficiency Group Iii Nitride Led with Lenticular Surface
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
High Density Power Distribution Unit
Highly Available Power Distribution System
Method of Monitoring a Power Distribution Unit
Semiconductor Light Emitting Circuits Including Light Emitting Diodes and Four Layer Semiconductor Shunt Devices
Substrate Buffer Structure for Group Iii Nitride Devices
Led Bonding Structures and Methods of Fabricating Led Bonding Structures
Light Emitting Devices with Active Layers That Extend into Opened Pits
Power lamp package
High power solid-state lamp
Led Fabrication via Ion Implant Isolation
Chip-Scale Methods for Packaging Light Emitting Devices and Chip-Scale Packaged Light Emitting Devices
Roughened High Refractive Index Layer/Led for High Light Extraction
Ultra-Thin Ohmic Contacts for P-Type Nitride Light Emitting Devices
Packages for Semiconductor Light Emitting Devices Utilizing Dispensed Encapsulants
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
High Efficacy White Led
Side-Emitting Optical Coupling Device
Laser Diode Backlighting of Lc Display with at Least One Diode Generating Light Beam Having Divergence Angle and with Display Panel Having Beam Spreader to Increase Divergence
Power Distribution System
Monolithic Backplane Having a First and Second Portion
Telco Hub and Method
Method for Coating Semiconductor Device Using Droplet Deposition
Method of Latent Fault Checking a Cooling Module
Packages for Semiconductor Light Emitting Devices Utilizing Dispensed Reflectors and Methods of Forming the Same
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Multiple Component Solid State White Light
High Efficiency Led with Tunnel Junction Layer
Re-Configurable Pci-Express Switching Device
Light Emitting Diode Packages
Apparatus and Method for Use in Mounting Electronic Elements
Uniform Emission Led Package
Submounts for Semiconductor Light Emitting Device Packages and Semiconductor Light Emitting Device Packages Including the Same
Multi-Element Led Lamp Package
Nickel Tin Bonding System for Semiconductor Wafers and Devices
Ultraviolet Light Emitting Diode
Patent:
43,725 →
Application:
11/432,793 →
Thermocompression Molding of Plastic Optical Elements
Embedded Computer Chassis with Redundant Fan Trays
Packaged Light Emitting Devices Including Multiple Index Lenses and Multiple Index Lenses for Packaged Light Emitting Devices
Blade Circuit Cross-Connection Adapted for Peer-to-Peer Backplanes
Patent:
7,136,290 →
Application:
11/443,784 →
Method of Forming Three-Dimensional Features on Light Emitting Diodes for Improved Light Extraction
System for and Method for Closed Loop Electrophoretic Deposition of Phosphor Materials on Semiconductor Devices
Efficient Emitting Led Package and Method for Efficiently Emitting Light
Led Package with Flexible Polyimide Circuit and Method of Manufacturing Led Package
Light-emitting devices having an antireflective layer that has a graded index of refraction and methods of forming the same
Leadframe-Based Packages for Solid State Emitting Devices
Light Emitting Diode Package Element with Internal Meniscus for Bubble Free Lens Placement
Light emitting diode package with optical element
Light Emitting Diode with High Aspect Ratio Submicron Roughness for Light Extraction and Methods of Forming
Methods of Forming Semiconductor Light Emitting Device Packages by Liquid Injection Molding
Semiconductor Devices Having Self Aligned Semiconductor Mesas and Contact Layers
Modified Gold-Tin System with Increased Melting Temperature for Wafer Bonding
Quantum wells for light conversion
Clock and Power Fault Detection for Memory Modules
Semiconductor Devices Having Low Threading Dislocations and Improved Light Extraction and Methods of Making the Same
Alternative Doping for Group Iii Nitride Leds
Permanent wafer bonding using metal alloy preform discs
Systems for Assembling Components on Submounts and Methods Therefor
Integrated Heat Spreaders for Light Emitting Devices (Leds) and Related Assemblies
Expandable Led Array Interconnect
Laser Diode and Method for Fabricating Same
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Self Aligned Diode Fabrication Method and Self Aligned Laser Diode
Led Lighting Units and Assemblies with Edge Connectors
Multiple Color Lighting Element Cluster Tiles for Solid State Lighting Panels
Reflective Mounting Substrates For Light Emitting Diodes
Lighting Device
High Performance Led Package
Light Emitting Diode Wth Degenerate Coupling Structure
Light Emitting Diode with Metal Coupling Structure
Memory Modules with Error Detection and Correction
Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method
Leadframe-Based Packages for Solid State Light Emitting Devices
Transparent Led Chip
Thermal Transfer in Solid State Light Emitting Apparatus and Methods of Manufacturing
Partially Filterless Liquid Crystal Display Devices and Methods of Operating the Same
Graded Dielectric Layer
Methods of Manufacturing Light Emitting Diodes Including Barrier Layers/Sublayers
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Methods of Forming Packaged Semiconductor Light Emitting Devices Having Front Contacts by Compression Molding
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements
Etching of Substrates of Light Emitting Devices
Light Emitting Devices Having Current Reducing Structures and Methods of Forming Light Emitting Devices Having Current Reducing Structures
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management
Undoped and Unintentionally Doped Buffer Structures
Transparent ohmic Contacts on Light Emitting Diodes with Carrier Substrates
Side-View Surface Mount White Led
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Side Mountable Semiconductor Light Emitting Device Packages and Panels
Lighting Device
Lighting Device and Method of Making
Solid State Light Emitting Device and Method of Making Same
Microscale Optoelectronic Device Packages
Light Emitting Devices Suitable for Flip-Chip Bonding
LED Chip Design for White Conversion
Semiconductor Light Emitting Device Packages and Methods
Methods of Coating Semiconductor Light Emitting Elements by Evaporating Solvent from a Suspension
Encapsulant with Scatterer to Tailor Spatial Emission Pattern and Color Uniformity in Light Emitting Diodes
Coating method utilizing phosphor containment structure and devices fabricated using same
Optoelectronic Device with Upconverting Luminophoric Medium
Semiconductor Light Emitting Devices with Applied Wavelength Conversion Materials
Phosphor Position in Light Emitting Diodes
Encapsulant Profile for Light Emitting Diodes
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Partially Filterless and Two-Color Subpixel Liquid Crystal Display Devices, Mobile Electronic Devices Including the Same, and Methods of Operating the Same
Packaged Light Emitting Devices
Lighting Device Having Luminescent Material Between a Reflective Cup and a Solid State Light Emitter
Methods of Fabricating Group Iii Nitride Based Light Emitting Diode Structures with a Quantum Well and Superlattice, Group Iii Nitride Based Quantum Well Structures and Group Iii Nitride Based Superlattice Structures
Led with Integrated Constant Current Driver
Method of Uniform Phosphor Chip Coating and Led Package Fabricated Using Method
Light Emitting Device Packages Using Light Scattering Particles of Different Size
Light Emitting Device Packages, Light Emitting Diode (Led) Packages and Related Methods
Wafer level phosphor coating method and devices fabricated utilizing method
Polarization Doping in Nitride Based Diodes
Methods of Manufacturing Semiconductor Light Emitting Devices Including Patternable Films Comprising Phosphor
Lighting Device and Lighting Method
Reflector Packages and Semiconductor Light Emitting Devices Including the Same
Phosphor Distribution in Led Lamps Using Centrifugal Force
Semiconductor Devices Including Mesa Structures and Multiple Passivation Layers
Multiple Conversion Material Light Emitting Diode Package and Method of Fabricating Same
Light Emitting Diode Package and Method for Fabricating Same
LED array and method for fabricating same
Led with Current Confinement Structure and Surface Roughening
Wire bond free wafer level LED
Laser Diode Orientation on Mis-Cut Substrates
Textured encapsulant surface in LED packages
Flip-Chip Phosphor Coating Method and Devices Fabricated Utilizing Method
Ohmic Contacts to Nitrogen Polarity Gan
Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating
Fault Tolerant Light Emitters, Systems Incorporating Fault Tolerant Light Emitters and Methods of Fabricating Fault Tolerant Light Emitters
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Semiconductor Light Emitting Devices with High Color Rendering
Chip-Scale Methods for Packaging Light Emitting Devices and Chip-Scale Packaged Light Emitting Devices
Three Dimensional Features on Light Emitting Diodes for Improved Light Extraction
Deep Ultraviolet Light Emitting Devices and Methods of Fabricating Deep Ultraviolet Light Emitting Devices
Semiconductor Light Emitting Devices Including Flexible Silicone Film Having a Lens Therein
Light Emitting Diodes with Light Filters
Apparatus and Methods for Combining Light Emitters
Low Index Spacer Layer in Led Devices
Led with a Current Confinement Structure Aligned with a Contact
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
Tile for Solid State Lighting
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Light Emitting Devices Having a Roughened Reflective Bond Pad and Methods of Fabricating Light Emitting Devices Having Roughened Reflective Bond Pads
Apparatus and Methods for Selecting Light Emitters
Indium Gallium Nitride-Based Ohmic Contact Layers for Gallium Nitride-Based Devices
Methods of Assembly for a Semiconductor Light Emitting Device Package
Encapsulation for phosphor-converted white light emitting diode
Solid State Lighting Component
Light Emitting Devices for Light Conversion and Semiconductor Chips for Fabricating the Same
Improved Bond Pad Design for Enhancing Light Extraction from Led Chips
Droop-Free High Output Light Emitting Devices and Methods of Fabricating and Operating Same
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
LED chips having fluorescent substrates with microholes and methods for fabricating
Forming Light Emitting Devices Including Custom Wavelength Conversion Structures
Methods of Forming Light Emitting Devices with Active Layers That Extend into Opened Pits
Cerium and Europium Doped Single Crystal Phosphors
Led Bonding Structures and Methods of Fabricating Led Bonding Structures
Phosphor Composition
Wafer Level Phosphor Coating Technique for Warm Light Emitting Diodes
Light Emitter Array
Composite High Reflectivity Layer
Color Correction for Wafer Level White Leds
Led Fabrication via Ion Implant Isolation
Light Emitting Diode with Improved Light Extraction
Light Emitting Diode with a Dielectric Mirror Having a Lateral Configuration
Light Emitting Diodes Including Two Reflector Layers
Solid Metal Block Semiconductor Light Emitting Device Mounting Substrates and Packages
Broadband Light Emitting Device Lamps for Providing White Light Output
Led with substrate modifications for enhanced light extraction and method of making same
Methods for Forming Semiconductor Light Emitting Devices and Submounts
Semiconductor Light Emitting Devices Including a Luminescent Conversion Element and Methods for Packaging the Same
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Efficiency Group Iii Nitride Led with Lenticular Surface
Emission Tuning Methods and Devices Fabricated Utilizing Methods
Multi-Chip Package
High Voltage Low Current Surface-Emitting Led
Semiconductor Light Emitting Circuits Including Light Emitting Diodes and Semiconductor Shunt Devices
Light Emission Device and Method Utilizing Multiple Emitters
Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
Methods of Fabricating Light Emitting Devices by Selective Deposition of Light Conversion Materials Based on Measured Emission Characteristics
Semiconductor Light Emitting Diodes Having Reflective Structures and Methods of Fabricating Same
Light-Emitting Devices Having an Active Region with Electrical Contacts Coupled to Opposing Surfaces Thereof
Memory Module with Vertically Accessed Interposer Assemblies
Luminescent Particles, Methods and Light Emitting Devices Including the Same
Light Source with Near Field Mixing
Light Emitting Devices Having Roughened/Reflective Contacts and Methods of Fabricating Same
Solid State Lighting Device
Front End Scribing of Light Emitting Diode (Led) Wafers and Resulting Devices
Semiconductor Light Emitting Devices Including Multiple Semiconductor Light Emitting Elements in a Substrate Cavity
Solid Metal Block Semiconductor Light Emitting Device Mounting Substrates
Method for Coating Semiconductor Device Using Droplet Deposition
Led Packages with Scattering Particle Regions
Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials
Molded Chip Fabrication Method and Apparatus
Led Fabrication via Ion Implant Isolation
Light Emitting Diodes Including Integrated Backside Reflector and Die Attach
Independent Control of Light Emitting Diodes
High Reflectivity Mirrors and Method for Making Same
Hardware Description Language (Hdl) Generation Systems and Methods for Custom Circuit Boards
Light Emitting Diodes Including Barrier Layers/Sublayers and Manufacturing Methods Therefor
Lighting Device
Apparatus for Mounting and Electrical Connection of a Connector Between a Package Led Lamp and a Pcb
System and Method for Blocking Lateral Airflow Paths Between Modules in an Electronic Equipment Enclosure
System and Method for Restricting Airflow Through a Portion of an Electronics Enclosure
System and Method for Supplying Power to Electronics Enclosures Utilizing Distributed Dc Power Architectures
Led with Current Confinement Structure and Surface Roughening
Led Lighting Units and Assemblies with Edge Connectors
Solid State Emitter Package Including Red and Blue Emitters
Led with Conductively Joined Bonding Structure
Apparatus and Method for Use in Mounting Electronic Elements
Luminescent Particles, Methods of Identifying Same and Light Emitting Devices Including the Same
Packaged Light Emitting Devices Including Multiple Index Lenses and Methods of Fabricating the Same
Solid State Light Emitting Apparatus with Thermal Management Structures and Methods of Manufacturing
Light Emitter Array Layout for Color Mixing
Light Emitting Diode Packages
Side-View Surface Mount White Led
Saturated Yellow Phosphor Converted Led and Blue Converted Red Led
Semiconductor Light Emitting Device Packages Including Submounts
Group Iii Nitride Based Quantum Well Light Emitting Device Structures with an Indium Containing Capping Structure
Group Iii Nitride Based Light Emitting Diode Structures with Multiple Quantum Well Structures Having Varying Well Thicknesses
Lighting Devices That Comprise One or More Solid State Light Emitters
Systems and Methods for Application of Optical Materials to Optical Elements
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Photonic Crystal Phosphor Light Conversion Structures for Light Emitting Devices
High Cri Lighting Device with Added Long-Wavelength Blue Color
Warm White Leds Having High Color Rendering Index Values and Related Luminophoric Mediums
Efficient Emitting Led Package and Method for Efficiently Emitting Light
Light Emitting Devices and Systems Having Tunable Chromaticity
High Reflective Substrate of Light Emitting Devices with Improved Light Output
Led Package with Increased Feature Sizes
Solid State Light Emitting Diode Packages with Leadframes and Ceramic Material
Lighting Device
Clock and Power Fault Detection for Memory Modules
Clock and Power Fault Detection for Memory Modules
White-Emitting Led Chips and Method for Making Same
High Efficiency Leds with Tunnel Junctions
High Output Group Iii Nitride Light Emitting Diodes
High Voltage Low Current Surface Emitting Led
Led with Substrate Modifications for Enhanced Light Extraction and Method of Making Same
Light Emitting Device Packages with Improved Heat Transfer
Laser Diode and Method for Fabricating Same
External Extraction Light Emitting Diode Based Upon Crystallographic Faceted Surfaces
Semiconductor Light Emitting Device Substrate Strips and Packaged Semiconductor Light Emitting Devices
Methods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
Light Transmission Control for Masking Appearance of Solid State Light Sources
Multiple Component Solid State White Light
Indium Gallium Nitride-Based Ohmic Contact Layers for Gallium Nitride-Based Devices
Led Package with Efficient, Isolated Thermal Path
Power Surface Mount Light Emitting Die Package
Molded Chip Fabrication Method and Apparatus
Dynamic Back-Up Storage System with Rapid Restore and Method of Operation Thereof
Methods of Forming Light Emitting Devices Having Current Reducing Structures
Group-Iii Nitride Based Laser Diode and Method for Fabricating Same
Solid State Lighting Component
Semiconductor Light Emitting Devices Including an Optically Transmissive Element
Semiconductor Light Emitting Devices with Optical Coatings and Methods of Making Same
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Multi-Element Led Lamp Package
Led with Self Aligned Bond Pad
Patent:
43,412 →
Application:
12/899,228 →
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
High Voltage Wire Bond Free Leds
Three Dimensional Features on Light Emitting Diodes for Improved Light Extraction
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Semiconductor Light Emitting Diodes Including Multiple Bond Pads on a Single Semiconductor Die
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Methods of Selectively Applying Luminous Material to Light Emitting Devices Based on Measured Output Thereof
Light-Emitting Devices Having Multiple Encapsulation Layers with at Least One of the Encapsulation Layers Including Nanoparticles and Methods of Forming the Same
Leds Using Single Crystalline Phosphor and Methods of Fabricating Same
Solid State Lighting Devices and Methods
Patent:
8,686,445 →
Application:
12/969,267 →
High Power Leds with Non-Polymer Material Lenses and Methods of Making the Same
Orientation of Electronic Devices on Mis-Cut Substrates
Electronic Device Submounts Including Substrates with Thermally Conductive Vias
Semiconductor Light Emitting Devices with Applied Wavelength Conversion Materials and Methods for Forming the Same
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements
Solid State Emitter Packages Including Accessory Leads
Light Emitting Diodes with Low Junction Temperature and Solid State Backlight Components Including Light Emitting Diodes with Low Junction Temperature
Light Emitting Diode (Led) Devices, Systems, and Methods
Methods, Systems, and Apparatus for Determining Optical Properties of Elements of Lighting Components Having Similar Color Points
Multi-Chip Led Devices
High Density Multi-Chip Led Devices
Multiple Configuration Light Emitting Devices and Methods
Structures and Substrates for Mounting Optical Elements and Methods and Devices for Providing the Same Background
Solid State Lighting Component Package with Reflective Layer
Conformally Coated Light Emitting Devices and Methods for Providing the Same
Horizontal Light Emitting Diodes Including Phosphor Particles
Color Correction for Wafer Level White Leds
Light Emitting Device Packages, Systems and Methods
Light-Emitting Diode Component
Power Surface Mount Light Emitting Die Package
Lighting Device with Flexibly Coupled Heatsinks
Lighting Devices That Comprise One or More Solid State Light Emitters
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Light Emitting Devices for Light Emitting Diodes (Leds)
High Cri Lighting Device with Added Long-Wavelength Blue Color
Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures
Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices
Solid State Light Emitting Devices Including Nonhomogeneous Luminophoric Particle Size Layers
Side Mountable Semiconductor Light Emitting Device Packages and Panels
Encapsulant Profile for Light Emitting Diodes
Lighting Apparatus Providing Increased Luminous Flux While Maintaining Color Point and Cri
Light Emitting Diode with High Aspect Ratio Submicron Roughness for Light Extraction and Methods of Forming
Side View Surface Mount Led
Methods for Combining Light Emitting Devices in a White Light Emitting Apparatus That Mimics Incandescent Dimming Characteristics and Solid State Lighting Apparatus for General Illumination That Mimic Incandescent Dimming Characteristics
Encapsulant with Index Matched Thixotropic Agent
Composite High Reflectivity Layer
Thermal Transfer in Solid State Light Emitting Apparatus and Methods of Manufacturing
Molded Chip Fabrication Method and Apparatus
Packaged Light Emitting Devices
Methods of Fabricating Light Emitting Devices Including Multiple Sequenced Luminophoric Layers
Solid State Lighting Device
Led Array Having Embedded Led and Method Therefor
Light Emitting Device Array Assemblies and Related Methods
Substrate Removal Process for High Light Extraction Leds
Light-Emitting Diode (Led) for Achieving an Asymmetric Light Output
Recipient Luminophoric Mediums Having Narrow Spectrum Luminescent Materials and Related Semiconductor Light Emitting Devices and Methods
Light Emitting Devices
Gap Engineering for Flip-Chip Mounted Horizontal Leds
Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants
Coated Phosphors and Light Emitting Devices Including the Same
Red Nitride Phosphors
Methods of Determining and Making Red Nitride Compositions
Leadframe-Based Packages for Solid State Light Emitting Devices and Methods of Forming Leadframe-Based Packages for Solid State Light Emitting Devices
Galium-Substituted Yttrium Aluminum Garnet Phosphor and Light Emitting Devices Including the Same
Conformal Gel Layers for Light Emitting Diodes
Semiconductor Light Emitting Device Packages and Methods
Led Structure with Enhanced Mirror Reflectivity
Compact Optically Efficient Solid State Light Source with Integrated Thermal Management
Reflective Mounting Substrates for Flip-Chip Mounted Horizontal Leds
Light Emitting Die (Led) Packages and Related Methods
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Voltage Low Current Surface Emitting Light Emitting Diode
High Voltage Low Current Surface Emitting LED
Non-Volatile Dynamic Random Access Memory System with Non-Delay-Lock-Loop Mechanism and Method of Operation Thereof
Broadband Light Emitting Device Lamps for Providing White Light Output
White Leds with Emission Wavelength Correction
Light Emitting Devices, Systems, and Methods
Light Emitting Devices and Methods
Lighting Device
Method for Coating Semiconductor Device Using Droplet Deposition
Leadframe-Based Packages for Solid State Light Emitting Devices Having Heat Dissipating Regions in Packaging
High Efficiency Leds
Group Iii Nitride Based Quantum Well Light Emitting Device Structures with an Indium Containing Capping Structure
Light Emitting Devices with Low Packaging Factor
Semiconductor Light Emitting Device Substrate Strips and Packaged Semiconductor Light Emitting Devices
Ultra-Thin Ohmic Contacts for P-Type Nitride Light Emitting Devices
Packaged Light Emitting Diodes Including Phosphor Coating and Phosphor Coating Systems
Light Emission Device
Computing System with Non-Disruptive Fast Memory Restore Mechanism and Method of Operation Thereof
Solid State Drive Architecture
Attachment Devices and Methods for Light Emitting Devices
Solid State Lighting Device Including Multiple Wavelength Conversion Materials
Methods of Forming Optical Conversion Material Caps
Light Emitting Diode (Led) Packages and Related Methods
Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
Non-Volatile Memory Packaging System with Caching and Method of Operation Thereof
Memory Management System with Power Source and Method of Manufacture Thereof
Complex Primary Optics with Intermediate Elements
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Light Emitter Devices and Methods, Utilizing Light Emitting Diodes (Leds), for Improved Light Extraction
Light Emitter Devices and Methods with Reduced Dimensions and Improved Light Output
Light Emitting Devices Having Roughened/Reflective Contacts and Methods of Fabricating Same
Usb Receptacle with a Riser at Its End
Light Emitting Devices
Led with Integrated Constant Current Driver
Side View Surface Mount Led
Semiconductor Light Emitting Devices Including Flexible Unitary Film on Aluminum Nitride Substrate
Methods of Determining and Making Red Nitride Compositions
Low Temperature High Strength Metal Stack for Die Attachment
High Brightness Light Emitting Diode (Led) Packages, Systems and Methods with Improved Resin Filling and High Adhesion
Cerium and Europium Doped Phosphor Compositions and Light Emitting Devices Including the Same
Light Emitter Device Packages, Modules and Methods
Components and Methods for Light Emitting Diode (Led) Lighting
Gel Underfill Layers for Light Emitting Diodes
High Reflective Board or Substrate for Leds
Lighting Device Including Multiple Wavelength Conversion Material Layers
Lighting Device Including Multiple Encapsulant Material Layers
Semiconductor Light Emitting Devices and Submounts
Methods of Forming Light Emitting Devices Having Current Reducing Structures
Composite High Reflectivity Layer
Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies
Phosphor Distribution in Led Lamps Using Centrifugal Force
Light Emitting Devices for Light Emitting Diodes (Leds)
Ceramic-Based Light Emitting Diode (Led) Devices, Components and Methods
Solid State Lighting Device Including Green Shifted Red Component
LED-Array Light Source with Aspect Ratio Greater Than 1
Multi-Die Led Package
Light Emitter Devices Having Improved Chemical and Physical Resistance and Related Methods
Light Emitter Devices Having Improved Light Output and Related Methods
Light Emitting Diode (Led) Packages, Systems, Devices and Related Methods
Light Emitting Diode (Led) Arrays Including Direct Die Attach and Related Assemblies
Light Emitting Diode (Led) Contact Structures and Process for Fabricating the Same
Light Emitting Devices Including Multiple Anodes and Cathodes
Power Surface Mount Light Emitting Die Package
Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements and Methods of Forming the Same
Solid State Lighting Component
Led with Integrated Constant Current Driver
Group Iii Nitride Based Light Emitting Diode Structures with a Quantum Well and Superlattice, Group Iii Nitride Based Quantum Well Structures and Group Iii Nitride Based Superlattice Structures
Light Emitting Diode Primary Optic for Beam Shaping
Apparatus and Methods for Selecting Light Emitters
Solid State Lighting Component Package with Reflective Polymer Matrix Layer
Light Emitter Device Packages, Components, and Methods for Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods Having Improved Performance
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Light Emitting Diodes Including Barrier Sublayers
Multi-Segment Led Components and Led Lighting Apparatus Including the Same
Led Based Lighting System
Light Emitter Packages and Devices Having Improved Wire Bonding and Related Methods
Wafer Level Packaging of Light Emitting Diodes (Leds)
Luminescent Particles, Methods and Light Emitting Devices Including the Same
Led Package with Efficient, Isolated Thermal Path
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Led Package with Encapsulant Having Planar Surfaces
Led Package with Multiple Element Light Source and Encapsulant Having Planar Surfaces
Lighting Device
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Multi-Segment Led Lighting Apparatus Configurations
Multi-Element Led Lamp Package
Led with Integrated Constant Current Driver
Light Emitting Devices and Systems Having Tunable Chromaticity and Methods of Tuning the Chromaticity of Light Emitting Devices and Systems
Light Emitter Devices and Components with Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods
Apparatus and Methods for Combining Light Emitters
Yellow Phosphor Having an Increased Activator Concentration and a Method of Making a Yellow Phosphor
Apparatus for Flexible Mounting and Electrical Connection
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Configurable Cooling For Rugged Environments
Integrated Thermal Inserts And Cold Plate
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Method and Device to Provide Uniform Cooling in Rugged Environments
Submount-Free Light Emitting Diode (Led) Components and Methods of Fabricating Same
Light Emitting Devices and Packages and Related Methods with Electrode Marks on Leads
Solid State Lighting Apparatuses and Related Methods
Solid State Lighting Apparatuses and Related Methods
Light Emitter Components and Methods Having Improved Performance
Light Emitter Packages and Methods
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Semiconductor Light Emitting Diodes with Crack-Tolerant Barrier Structures and Methods of Fabricating the Same
Light Emitting Diode (Led) Chips and Devices for Providing Failure Mitigation in Led Arrays
Multi-Chip Light Emitter Packages and Related Methods
Multi-Chip Light Emitter Packages and Related Methods
Solid State Lighting Apparatus and Methods of Forming
High Precision Timer in CPU Cluster
Light Emitter Components and Methods Having Improved Electrical Contacts
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Wafer Level Packaging of Multiple Light Emitting Diodes (Leds) on a Single Carrier Die
Led Dome with Improved Color Spatial Uniformity
Application:
13/804,309 →
Publication:
US 2014/0159084
Light Emitting Devices and Substrates with Improved Plating
Submount Based Light Emitter Components and Methods
Fabric-Based Solid State Drive Architecture
Tilted Emission Led Array
Substrate Based Light Emitter Devices, Components, and Related Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs
Light Emitter Components, Systems, and Related Methods
Connector Devices, Systems, and Related Methods for Light Emitter Components
Multi-Chip Light Emitting Device Lamps for Providing High-Cri Warm White Light and Light Fixtures Including the Same
Light Emitting Devices Having Current Reducing Structures
Led Assembly
Light Emitting Diodes Having Group Iii Nitride Surface Features Defined by a Mask and Crystal Planes
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Solid State Lighting Component Package with Conformal Reflective Coating
Method of Providing Light Emitting Device
Light Emitting Diode Dielectric Mirror
Computing System with Backup and Recovery Mechanism and Method of Operation Thereof
Patent:
9,779,016 →
Application:
13/940,118 →
Solid State Lighting Devices and Fabrication Methods Including Deposited Light-Affecting Elements
Electrostatic Phosphor Coating Systems and Methods for Light Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating
Solid State Lighting Device
Light Emitter Devices and Methods for Light Emitting Diode (Led) Chips
Led Package with Encapsulant Having Curved and Planar Surfaces
Solid State Lighting Component
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Patent:
8,626,998 →
Application:
13/972,337 →
Led with Surface Roughening
Side-Emitting Optical Coupling Device
Group Iii Nitride Based Quantum Well Light Emitting Device Structures with an Indium Containing Capping Structure
Extended Heat Frame For Printed Circuit Board
Light Emitting Devices for Light Emitting Diodes (Leds)
Solid State Lighting Apparatus with High Scotopic / Photopic (S/P) Ratio
Composite High Reflectivity Layer
High Voltage Monolithic Led Chip
Light Emitting Devices for Light Emitting Diodes (Leds)
Chip with Integrated Phosphor
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
9,603,252 →
Application:
14/077,908 →
Light Emitting Device Packages with Improved Heat Transfer
Phosphor-converted light emitting device
Multi-Element Led Lamp
Fault-Tolerant Failsafe Computer System Using COTS Components
Safety Relay Box System
Task Based Voting For Fault-Tolerant Fail Safe Computer Systems
Silazane-Containing Materials for Light Emitting Diodes
Compute Engine in a Smart Ssd Exploiting Locality of Data
Patent:
8,935,463 →
Application:
14/147,462 →
Light Emitting Devices for Light Emitting Diodes (Leds)
Wafer Level Contact Pad Solder Bumping for Surface Mount Devices with Non-Planar Recessed Contacting Surfaces
Lateral Semiconductor Light Emitting Diodes Having Large Area Contacts
Light Emitter Devices
Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface
Compact Led Package with Reflectivity Layer
High Efficiency Group Iii Nitride Led with Lenticular Surface
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Molded Chip Fabrication Method and Apparatus
Ceramic Based Light Emitting Diode (Led) Devices and Methods
Operation of I/O in a Safe System
Reliable, Low Latency Hardware And Software Inter-Process Communication Channel For Safety Critical System
Voting Architecture for Safety and Mission Critical Systems
Integrated Circuit Device System with Elevated Stacked Configuration and Method of Manufacture Thereof
Patent:
9,648,754 →
Application:
14/231,622 →
Coated Phosphors and Light Emitting Devices Including the Same
Direct Connect Algorithm
Method And System Of Synchronizing Processors To The Same Computational Point
Semiconductor Light Emitting Devices Including Red Phosphors That Exhibit Good Color Rendering Properties and Related Red Phosphors
Solid State Lighting Devices Incorporating Notch Filtering Materials
Solid State Light-Emitting Devices with Improved Contrast
Optical Element with Integrated Indicator
Application:
14/271,116 →
Publication:
US 2015/0325759
Solid State Lighting Devices with Color Point Non-Coincident with Blackbody Locus
Light Engine Module with Removable Circuit Board
Multiple Voltage Light Emitter Packages, Systems, and Related Methods
Submount Based Light Emitter Components and Methods
Submount Based Light Emitter Components and Methods
Light Emitting Diode (Led) Components Including Contact Expansion Frame
Method to Form Primary Optic with Variable Shapes and/or Geometries Without a Substrate
Solder Pads, Methods, and Systems for Circuitry Components
Nanocomposite Compositions and Methods of Making
Application:
14/447,357 →
Publication:
US 2015/0054425
Multi-Layer Conversion Material for Down Conversion in Solid State Lighting
Light Emitting Diode (Led) Component Comprising a Phosphor with Improved Excitation Properties
Semiconductor Light Emitting Devices Including Multiple Red Phosphors That Exhibit Good Color Rendering Properties with Increased Brightness
Light Emitting Diode (Led) Component Comprising a Phosphor with Improved Excitation Properties
Wire Bonded Light Emitting Diode (Led) Components Including Reflective Layer
Patent:
9,214,607 →
Application:
14/478,147 →
Led Packages with Chips Having Insulated Surfaces
Time-Division Multiplexing Data Aggregation Over High Speed Serializer/Deserializer Lane
Modular Electronics for Cylinders
Thermal Conduction To A Cylindrical Shaft
Alignment Mechanism for Cabling to a Cylinder Head
Data Storage System with Information Exchange Mechanism and Method of Operation Thereof
Methods of Fabricating Light Emitting Diodes by Masking and Wet Chemical Etching
Blue Light Emitting Devices That Include Phosphor-Converted Blue Light Emitting Diodes
Patent:
9,219,201 →
Application:
14/529,327 →
Light Emitting Diode (Led) Components and Methods
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Patent:
9,985,168 →
Application:
14/546,524 →
Light Emitting Diode (Led) Components Including Led Dies That Are Directly Attached to Lead Frames
Leadframe Based Light Emitter Components and Related Methods
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
Enhanced interface to firmware operating in a Solid State Drive
High Efficiency Leds and Methods of Manufacturing
Methods for Combining Light Emitting Devices in a White Light Emitting Apparatus that Mimics Incandescent Dimming Characteristics and Solid State Lighting Apparatus for General Illumination that Mimic Incandescent Dimming Characteristics
Non-Magnified Led for High Center-Beam Candle Power
Application:
14/633,734 →
Publication:
US 2016/0254423
Solid State Lighting Apparatuses, Systems, and Related Methods
Led Package with Encapsulant Having Planar Surfaces
Graded Vias for Led Chip P- and N- Contacts
Patent:
9,412,907 →
Application:
14/690,284 →
Multi-Segment Monolithic Led Chip
High Voltage Monolithic Led Chip with Improved Reliability
Light Emitting Diode Package and Method for Fabricating Same
Solid State Light Emitter Devices and Methods
Self-Aligned Floating Mirror for Contact Vias
Enhanced Interface to Firmware Operating in a Solid State Drive
Memory Module with Power Management System and Method of Operation Thereof
Patent:
9,576,615 →
Application:
14/884,369 →
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Voltage Configurable Solid State Lighting Apparatuses, Systems, and Related Methods
Solid State Lighting Apparatuses with Non-Uniformly Spaced Emitters for Improved Heat Distribution, Sysytem Having the Same, and Methods Having the Same
Memory Management System with Backup System and Method of Operation Thereof
Memory Management System with Multiple Boot Devices and Method of Operation Thereof
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Light Emitting Diodes and Methods with Encapsulation
Interconnected Memory System and Method of Operation Thereof
Solid State Lighting Components
Method And System of Synchronizing Processors To The Same Computational Point
Light Emitting Devices Having Closely-Spaced Broad-Spectrum and Narrow-Spectrum Luminescent Materials and Related Methods
Light Emitter Components and Related Methods
Stabilized Quantum Dot Structure and Method of Making a Stabilized Quantum Dot Structure
Phosphor Composition
Light Emitting Diodes, Components and Related Methods
High Density Memory Module System
Low Optical Loss Flip Chip Solid State Lighting Device
Memory Controller for High Latency Memory Devices
Flash-Based Block Storage System with Trimmed Space Management and Method of Operation Thereof
Light Emitting Diode (Led) Devices, Components and Methods
Virtual Timer for Data Retention
High Density Pixelated Led and Devices and Methods Thereof
High Density Pixelated Led and Devices and Methods Thereof
Light Emitting Diode (Led) Components Including Multiple Led Dies That Are Attached to Lead Frames
Light Engine Modules Including a Support and a Solid State Light Emitter
Wire Bond Free Wafer Level Led
Substrates for Light Emitting Diodes and Related Methods
FPGA Mismatched Packet Stop For A Safety System
End To End FPGA Diagnostics For A Safety System
Formation of Nitride-Based Optoelectronic and Electronic Device Structures on Lattice-Matched Substrates
Application:
15/459,161 →
Publication:
US 2017/0186913
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
10,529,688 →
Application:
15/462,885 →
Illumination Devices, and Methods of Fabricating Same
High Brightness, Low-Cri Semiconductor Light Emitting Devices Including Narrow-Spectrum Luminescent Materials
Patent:
9,905,735 →
Application:
15/475,366 →
Wafer Level Packaging of Light Emitting Diodes (Leds)
Tunable Integrated Optics Led Components and Methods
Integrated Thermal Inserts and Cold Plate
Daisy-Chain of Safety Systems
High Voltage Monolithic Led Chip
Operation of I/O in a Safe System
Led Apparatuses and Methods for High Lumen Output Density
Light Emitting Diodes, Components and Related Methods
Memory Module Test Adapter
Patent:
10,510,432 →
Application:
15/659,420 →
Substrate Based Light Emitter Devices, Components, and Related Methods
Light Emitting Diodes and Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diodes, Components and Related Methods
Signal Pairing for Module Expansion of a Failsafe Computing System
Centralized Backup Power Module
Patent:
10,551,892 →
Application:
15/709,257 →
Lighting Devices That Comprise One or More Solid State Light Emitters
Portable Module System
Patent:
10,488,892 →
Application:
15/789,041 →
Stabilized Luminescent Nanoparticles Comprising a Perovskite Semiconductor and Method of Fabrication
Stabilized Quantum Dot Composite and Method of Making a Stabilized Quantum Dot Composite
Light Emitting Devices Including Narrowband Converters for Outdoor Lighting Applications
Configurable Circuit Layout for Leds
Light Emitting Devices Having Closely-Spaced Broad-Spectrum and Narrow-Spectrum Luminescent Materials and Related Methods
Reflective Layers for Light-Emitting Diodes
Solid State Lighting Component Package with Conformal Reflective Coating
Solid State Lighting Devices with Opposing Emission Directions
Clear Coating for Light Emitting Device Exterior Having Chemical Resistance and Related Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diode (Led) Components and Methods
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Light-Emitting Diode Package with Light-Altering Material
Apparatus and Methods for Mass Transfer of Electronic Die
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Led Apparatuses and Methods
Patent:
10,453,827 →
Application:
15/993,540 →
Stabilized Fluoride Phosphor for Light Emitting Diode (Led) Applications
Led Systems, Apparatuses, and Methods
High Density Pixelated-Led Chips and Chip Array Devices
Led Device, System, and Method with Adaptive Patterns
Light-Emitting Diode Packages
Light-Emitting Diode Packages with Individually Controllable Light-Emitting Diode Chips
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Group Iii Nitride Led Structures with Improved Electrical Performance
High Voltage Monolithic Led Chip
High Density Pixelated-Led Chips and Chip Array Devices
Light Emitting Diode Packages
Indicia for Light Emitting Diode Chips
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Lighting Devices That Comprise One or More Solid State Light Emitters
Light Emitting Diode Packages
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Voltage Monolithic Led Chip with Improved Reliability
Molded Chip Fabrication Method and Apparatus
Application:
16/293,267 →
Publication:
US 2019/0198725
Phosphor Composition
Contact Structures for Light Emitting Diode Chips
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light Emitting Diodes, Components and Related Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Semiconductor Light Emitting Devices Including Superstrates with Patterned Surfaces
High Density Pixelated Led and Devices and Methods Thereof
Stabilized Quantum Dot Composite and Method of Making a Stabilized Quantum Dot Composite
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Solid-State Light Emitting Devices Including Light Emitting Diodes in Package Structures
Tunable Integrated Optics Led Components and Methods
Universal Bracket for Multiple Form Factors of PCIe Cards in OCP Sled Environments
Light-Emitting Diode Chip Structures
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light-Emitting Diodes, Light-Emitting Diode Arrays and Related Devices
Lumiphoric Arrangements for Light Emitting Diode Packages
Lighting Devices That Comprise One or More Solid State Light Emitters
Light Emitting Diode (Led) Components and Methods
Led Package with Multiple Element Light Source and Encapsulant Having Curved and/or Planar Surfaces
Carrier for One or More Solid State Drives (SSDs)
Printed Circuit Board Electrical Connector Locking Via Threaded Fasteners
Lumiphoric Material Region Arrangements for Light Emitting Diode Packages
Light-Emitting Diode Package with Light-Altering Material
Submount Structures for Light Emitting Diode Packages
Stabilized Fluoride Phosphor for Light Emitting Diode (Led) Applications
Apparatus and Methods for Mass Transfer of Electronic Die
Light Emitting Diodes, Components and Related Methods
Illumination Devices Using Externally Interconnected Arrays of Light Emitting Devices, and Methods of Fabricating Same
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Light Emitting Diode Packages
Light-Altering Material Arrangements for Light-Emitting Devices
Light-Emitting Diode Chip with Electrical Overstress Protection
Memory Centric Computing Storage Controller System
Patent:
11,182,325 →
Application:
16/889,727 →
Catastrophic Event Memory Backup System
Patent:
11,561,739 →
Application:
16/889,729 →
Solid State Lighting Components
Active Electrical Elements with Light-Emitting Diodes
Lens Arrangements for Light-Emitting Diode Packages
High Voltage Monolithic Led Chip with Improved Reliability
Phosphor Composition
High Density Pixelated Led and Devices and Methods Thereof
Reflective Layers for Light-Emitting Diodes
High Density Pixelated-Led Chips and Chip Array Devices
Light-Altering Particle Arrangements for Light-Emitting Devices
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
Binder Materials for Light-Emitting Devices
Interconnects for Light Emitting Diode Chips
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Light-Emitting Diode Package with Light-Altering Material
Spacer Layer Arrangements for Light-Emitting Diodes
High Voltage Monolithic Led Chip
Pixelated-Led Chips with Inter-Pixel Underfill Materials, and Fabrication Methods
Active Control of Light Emitting Diodes and Light Emitting Diode Displays
Texturing for High Density Pixelated-Led Chips and Chip Array Devices
Tunable Integrated Optics Led Components and Methods
Cover Structure Arrangements for Light Emitting Diode Packages
Application:
17/103,121 →
Publication:
US 2022/0165923
Wafer Level Packaging of Light Emitting Diodes (Leds)
Light Emitting Diodes, Components and Related Methods
Support Structures for Light Emitting Diode Packages
Light Emitting Diode Package and Method for Fabricating Same
Pixelated-Led Chips and Chip Array Devices, and Fabrication Methods
Optical Arrangements in Cover Structures for Light Emitting Diode Packages and Related Methods
Application:
17/173,735 →
Publication:
US 2022/0254962
Solid-State Light Emitting Device with Improved Color Emission
Contact Structures for Light Emitting Diode Chips
Light-Emitting Diode Packages
Wafer Level Packaging of Multiple Light Emitting Diodes (Leds) on a Single Carrier Die
Application:
17/325,970 →
Publication:
US 2021/0367112
Reflective Layers for Light-Emitting Diodes
Led Chips with Irregular Microtextured Light Extraction Surfaces, and Fabrication Methods
Lumiphoric Arrangements for Light Emitting Diode Packages
Group Iii Nitride Based Led Structures Including Multiple Quantum Wells with Barrier-Well Unit Interface Layers
High Power Light-Emitting Diode Arrays and Related Devices
Patent:
11,405,996 →
Application:
17/383,923 →
Edge Structures for Light Shaping in Light-Emitting Diode Chips
Localized Surface Plasmon Resonance for Enhanced Photoluminescence of Lumiphoric Materials
Lumiphoric Material Arrangements for Multiple-Junction Light-Emitting Diodes
Application:
17/494,264 →
Publication:
US 2023/0106479
Broad Electromagnetic Spectrum Light-Emitting Diode Packages
Integrated Warning Structures for Energized Ultraviolet Light-Emitting Diode Packages
Light Emitting Diode Packages
Application:
17/507,201 →
Publication:
US 2022/0045253
Polarization Structures for Light-Emitting Diodes
Led Chips and Devices with Textured Light-Extracting Portions, and Fabrication Methods
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,628 →
Publication:
US 2023/0170447
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,671 →
Publication:
US 2023/0170335
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,678 →
Publication:
US 2023/0170449
Light-Emitting Diode Chips and Manufacturing Processes Thereof
Application:
17/539,685 →
Publication:
US 2023/0170445
Stabilized Fluoride Phosphor for Light Emitting Diode (Led) Applications
Application:
17/540,510 →
Publication:
US 2022/0093830
Lamp Package
Patent:
591,697 →
Application:
29/248,311 →
Led Lighting Tile
Patent:
585,847 →
Application:
29/248,867 →
Led
Patent:
606,948 →
Application:
29/249,263 →
Lamp Packages
Patent:
594,827 →
Application:
29/250,973 →
Led Chip
Patent:
566,056 →
Application:
29/275,303 →
Led Chip
Patent:
566,057 →
Application:
29/275,362 →
Led
Patent:
595,673 →
Application:
29/276,271 →
Led Chip
Patent:
582,865 →
Application:
29/280,949 →
Led Chip
Patent:
582,866 →
Application:
29/284,431 →
Led Chip
Patent:
583,338 →
Application:
29/284,434 →
Lamp Packages
Patent:
623,607 →
Application:
29/284,854 →
Emitter Package
Patent:
615,504 →
Application:
29/292,900 →
Led
Patent:
608,739 →
Application:
29/306,991 →
Light Emitting Diode
Patent:
608,307 →
Application:
29/323,659 →
Led Chip
Patent:
602,450 →
Application:
29/327,786 →
Led Chip
Patent:
616,839 →
Application:
29/327,793 →
Led Chip
Patent:
593,968 →
Application:
29/328,502 →
Lamp Package
Patent:
640,645 →
Application:
29/328,924 →
Light Emitting Diode
Patent:
621,799 →
Application:
29/330,657 →
Led
Patent:
605,612 →
Application:
29/331,898 →
Light Emitting Diode
Patent:
621,802 →
Application:
29/334,956 →
Led Chip
Patent:
635,525 →
Application:
29/335,819 →
Light Emitting Diode
Patent:
641,719 →
Application:
29/338,186 →
Light Emitting Diode
Patent:
614,592 →
Application:
29/342,451 →
Light Emitting Diode
Patent:
635,527 →
Application:
29/353,652 →
Light Emitting Diode (Led) Package
Patent:
648,686 →
Application:
29/360,791 →
Light Emitting Diode
Patent:
669,040 →
Application:
29/365,193 →
Package for Light Emitting Diode (Led) Lighting
Patent:
643,819 →
Application:
29/365,939 →
Light Emitting Device Package
Patent:
650,760 →
Application:
29/379,636 →
Light Emitting Device Package
Patent:
676,000 →
Application:
29/380,387 →
Light Emitting Device Package
Patent:
648,687 →
Application:
29/380,549 →
High Brightness Led Package
Patent:
679,842 →
Application:
29/382,394 →
Light Emitting Diode
Patent:
672,731 →
Application:
29/383,906 →
Light Emitting Diode
Patent:
689,830 →
Application:
29/383,908 →
Light Emitting Diode
Patent:
682,225 →
Application:
29/383,910 →
High-Density Emitter Package
Patent:
658,139 →
Application:
29/384,360 →
Emitter Package
Patent:
660,257 →
Application:
29/384,363 →
Multiple Configuration Light Emitting Device Package
Patent:
650,343 →
Application:
29/384,476 →
Light Emitting Diode
Patent:
675,580 →
Application:
29/386,077 →
Light Emitting Diode
Patent:
673,125 →
Application:
29/386,078 →
Led Chip
Patent:
691,569 →
Application:
29/388,240 →
Lamp Package
Patent:
681,573 →
Application:
29/392,801 →
Led Component
Patent:
700,584 →
Application:
29/396,759 →
Light Emitting Diode
Patent:
675,581 →
Application:
29/396,907 →
Lamp Packages
Patent:
691,973 →
Application:
29/396,909 →
Led Chip
Patent:
673,126 →
Application:
29/396,911 →
Package for Light Emitting Diode (Led) Lighting
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667,801 →
Application:
29/397,017 →
Light Emitting Diode (Led) Package
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659,657 →
Application:
29/401,692 →
Lamp Packages
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689,209 →
Application:
29/402,571 →
Lamp Packages
Patent:
689,210 →
Application:
29/402,573 →
Light Emitting Device Package
Patent:
661,264 →
Application:
29/403,433 →
Light Emitting Device Component
Patent:
702,653 →
Application:
29/404,913 →
Light Emitting Device Package
Patent:
667,803 →
Application:
29/407,084 →
Light Emitting Device Package
Patent:
676,395 →
Application:
29/408,955 →
Light Emitting Device Component
Patent:
705,181 →
Application:
29/412,166 →
Light Emitting Device
Patent:
707,192 →
Application:
29/412,168 →
Light Emitting Device
Patent:
706,231 →
Application:
29/417,220 →
Led-Array Package
Patent:
703,624 →
Application:
29/417,704 →
Solid State Lighting Apparatus
Patent:
708,155 →
Application:
29/418,797 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
712,849 →
Application:
29/420,874 →
Light Emitting Diode (Led) Package with Multiple Anodes and Cathodes
Patent:
713,804 →
Application:
29/420,876 →
Light Emitting Diode (Led) Package
Patent:
709,464 →
Application:
29/423,422 →
Led Package
Patent:
711,840 →
Application:
29/424,353 →
Led Package
Patent:
725,613 →
Application:
29/424,861 →
Light Emitter Device
Patent:
721,339 →
Application:
29/425,831 →
Lamp Package
Patent:
703,348 →
Application:
29/426,661 →
Light Emitting Diode (Led) Package
Patent:
711,841 →
Application:
29/430,291 →
Led Package
Patent:
718,258 →
Application:
29/431,064 →
Light Emitter Device
Patent:
753,612 →
Application:
29/431,542 →
Package for Light Emitting Diode (Led) Lighting
Patent:
708,156 →
Application:
29/432,988 →
Light Emitter Package
Patent:
704,154 →
Application:
29/433,842 →
Led Chip
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689,031 →
Application:
29/436,228 →
Light Emitting Diode (Led) Package
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749,051 →
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29/439,629 →
Light Emitting Diode (Led) Package
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738,832 →
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Light Emitter Device
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712,850 →
Application:
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High Brightness Led Package
Patent:
704,358 →
Application:
29/451,761 →
Light Emitting Unit
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738,542 →
Application:
29/452,692 →
Led Package
Patent:
735,683 →
Application:
29/453,958 →
Light Emitter Unit
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739,565 →
Application:
29/459,231 →
Light Emitter Unit
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740,453 →
Application:
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Led Package with Encapsulant
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718,725 →
Application:
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Led Package
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758,976 →
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Led Package
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Light Emitting Device Component
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Led Package with Truncated Encapsulant
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Light Emitting diode device
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Led Package
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Solid State Light Emitter Component
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Led Package
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Light Emitting Device
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Light Emitting Device
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Led Package
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Light Emitting Diode Chip
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Light Emitting Diode Package
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Light Emitting Device
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Light Emitting Diode Package
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Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
Security Agreement
Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
Security Agreement
Oct 23, 2014
From: SMART MODULAR TECHNOLOGIES, INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 034036/0779 →
Partial Release of Security Interest
Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
Release of Security Interest
Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
Change of Name
Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
Change of Name
Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
Security Interest
Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Security Interest
Dec 23, 2020
From: SMART EMBEDDED COMPUTING INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054739/0137 →
Assignment of Assignor's Interest
Mar 30, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055837/0129 →
Assignment of Assignor's Interest
Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
Release of Security Interest
Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058913/0097 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Security Interest at Reel 034036 Frame 0779
Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058960/0876 →
Release of Security Interest
Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 56012 Frame 200. Assignor(S) Hereby Confirms the Assignment.
Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →