IP Library › Patent Application 63256077
Patent Application Provisional
App. No. 63/256,077 · Confirmation No. 7349

INTEGRATION OF SECONDARY OPTICS INTO CHIP COVERS FOR IMPROVED OPTICAL EMISSION OF HIGH INTENSITY LIGHT-EMITTING DIODES

Applicant: CreeLED, Inc.
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2021-10-26 APP.FILE.REC Filing Receipt 3 View
2021-10-15 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2021-10-15 PA.. Power of Attorney 2 View
2021-10-15 SPEC Specification 16 View
2021-10-15 CLM Claims 2 View
2021-10-15 ABST Abstract 1 View
2021-10-15 DRW.NONBW Drawings-other than black and white line drawings 7 View
2021-10-15 WFEE Fee Worksheet (SB06) 2 View
2021-10-15 N417 Electronic Filing System Acknowledgment Receipt 3 View
2021-10-15 ADS Application Data Sheet 9 View
2021-10-15 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
63/256,077
Filed
2021-10-15