Integration of secondary optics into chip covers for improved optical emission of high intensity light-emitting diodes
Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated secondary optics into LED chip cover structures for improved optical emission of high intensity LEDs is disclosed. Optical elements are integrated as a secondary optic onto one or both surfaces of a chip cover structure, where the chip cover structure may be referred to as a primary optic. The integrated secondary optic may be formed directly on one or both surfaces of the chip cover structure. The integrated secondary optic is purposely built to be coupled with the light emission of the LED to emit a desired emission profile. In this regard, a final luminaire may be provided with increased efficiency either by improving the coupling of the LED into a conventional secondary optic or in some cases by removing the need for a conventional secondary optic all together.
1. A light-emitting diode (LED) package comprising:
an LED chip; and
a cover structure arranged over the LED chip, wherein the cover structure comprises an integrated secondary optic that comprises a liquid crystal optic that is arranged to alter an emission profile of light exiting the LED package.
2. The LED package of claim 1 , wherein the emission profile that is altered comprises at least one of an overall emission viewing angle, an emission direction, or color uniformity over angle.
3. The LED package of claim 1 , wherein the integrated secondary optic is formed on a surface of the cover structure that is in a light path of light from the LED chip.
4. The LED package of claim 1 , wherein the integrated secondary optic is a flat optic layer.
5. The LED package of claim 1 , wherein the liquid crystal optic comprises a polarization converter that converts light emitted by the LED chip into a single polarization.
6. The LED package of claim 5 , wherein the polarization converter is between the LED chip and the liquid crystal optic.
7. The LED package of claim 5 , wherein the polarization converter comprises:
a first microlens array that collimate light emitted by the LED chip and separates light into an array of discrete unpolarized light spots;
a polarization grating that splits each unpolarized light spot of the unpolarized light spots into two orthogonally polarized light spots of a first polarization and a second polarization;
a louvered multi-twist retarder that reverses a polarization of light spots of the first polarization such that each resulting light spot has a polarization of the second polarization; and
a second microlens array that homogenizes the light spots of the second polarization into a single light spot of the second polarization.
8. The LED package of claim 1 , wherein the cover structure comprises a superstrate and a layer of lumiphoric material.
9. The LED package of claim 8 , wherein the integrated secondary optic is formed on a surface of the superstrate that is between the superstrate and the lumiphoric material.
10. The LED package of claim 8 , wherein the integrated secondary optic is formed on a surface of the superstrate that is opposite the lumiphoric material.
11. The LED package of claim 1 , wherein the cover structure comprises at least one of a phosphor-in-glass structure and a ceramic phosphor plate structure.
12. A light-emitting diode (LED) cover structure that covers an LED chip, comprising:
a superstrate layer; and
a flat optic layer that comprises a liquid crystal optic that is arranged to alter an emission profile of light exiting an LED package comprised of the LED chip and the LED cover structure.
13. The LED cover structure of claim 12 , wherein the emission profile that is altered comprises at least one of an overall emission viewing angle, an emission direction, or color uniformity over angle.
14. The LED cover structure of claim 12 , wherein the liquid crystal optic comprises a polarization converter that converts light emitted by the LED chip into a single polarization.
15. The LED cover structure of claim 14 , wherein the polarization converter is between the LED chip and the liquid crystal optic.
16. The LED cover structure of claim 14 , wherein the polarization converter comprises:
a first microlens array that collimate light emitted by the LED chip and separates light into an array of discrete unpolarized light spots;
a polarization grating that splits each unpolarized light spot of the unpolarized light spots into two orthogonally polarized light spots of a first polarization and a second polarization;
a louvered multi-twist retarder that reverses a polarization of light spots of the first polarization such that each resulting light spot has a polarization of the second polarization; and
a second microlens array that homogenizes the light spots of the second polarization into a single light spot of the second polarization.
17. The LED cover structure of claim 12 , further comprising
a layer of lumiphoric material, wherein the flat optic layer is formed on at least one of a surface of the superstrate that is between the superstrate and the layer of lumiphoric material or on another surface of the superstrate that is opposite the lumiphoric material.
18. The LED cover structure of claim 12 , wherein the superstrate comprises an embedded lumiphoric material, wherein the flat optic layer is formed on a surface of the superstrate that is between the superstrate and a surface of the LED chip, or at another surface of the superstrate that is opposite the LED chip.
19. The LED cover structure of claim 12 , wherein the flat optic layer is formed on a surface of the LED cover structure that is in a light path of light from an LED chip.
20. The LED cover structure of claim 12 , further comprising at least one of a phosphor-in-glass structure and a ceramic phosphor plate structure.