Integrated circuit device system with elevated configuration and method of manufacture thereof

1. A method of manufacture of an integrated circuit device system comprising:

mounting a base device on a first side of a carrier with a carrier device interconnect;

mounting a first riser on the first side of the carrier and adjacent to the base device, the first riser having only one body portion on the carrier, the first riser having a protrusion portion extending away from the body portion and toward a peripheral end of the carrier, the body portion narrower than the protrusion portion, and the protrusion portion overhanging the base device; and

attaching a first elevated device on the first riser with a riser device interconnect, the first elevated device having a first overhang above the base device, and both the protrusion portion and the riser device interconnect directly between the first overhang and the carrier device interconnect.

2. The method as claimed in claim 1 wherein mounting the first riser includes mounting the first riser at the periphery of the carrier.

3. The method as claimed in claim 1 further comprising mounting a mirrored chip assembly to a second side of the carrier.

4. The method as claimed in claim 1 wherein mounting the first riser includes mounting the first riser having a T-shaped configuration and the first riser only partially covering the base device.

5. The method as claimed in claim 1 further comprising:

mounting a second riser on the first side of the carrier on a side of the first riser opposite the base device; and

mounting a second elevated device on the second riser, the second elevated device having a second overhang above the first elevated device.

6. The method as claimed in claim 1 further comprising mounting another base device on the first side of the carrier on a side of the first riser opposite the base device.

7. The method as claimed in claim 1 wherein attaching the first elevated device includes attaching the riser device interconnect directly over the base device.

8. A method of manufacture of an integrated circuit device system comprising:

mounting a base device on a first side of a carrier with a carrier device interconnect;

mounting a body portion of a first riser on the first side of the carrier and adjacent to the base device, the first riser having only one body portion on the carrier, the first riser having a protrusion portion extending away from the body portion and toward a peripheral end of the carrier, the body portion narrower than the protrusion portion, and the protrusion portion overhanging the base device;

attaching a first elevated device on the first riser with a riser device interconnect, the first elevated device having a first overhang above the base device, and both the protrusion portion and the riser device interconnect directly between the first overhang and the carrier device interconnect

mounting a second riser on the first side of the carrier on a side of the base device opposite the first riser; and

mounting a second elevated device on the second riser, the second elevated device having a second overhang above the base device.

9. The method as claimed in claim 8 wherein mounting the first riser includes mounting the first riser at the periphery of the carrier.

10. The method as claimed in claim 8 further comprising mounting a mirrored chip assembly to a second side of the carrier, the mirrored chip assembly includes a mirrored base device, a mirrored first riser, and a mirrored elevated device.

11. The method as claimed in claim 8 further comprising:

mounting a third riser to the first side of the carrier on a side of the second riser opposite the base device; and

mounting a third elevated device on the third riser, the third elevated device above the second elevated device.

12. The method as claimed in claim 8 further comprising mounting another base device on the first side of the carrier on a side of the first riser opposite the base device.

13. The method as claimed in claim 8 wherein attaching the first elevated device includes attaching the riser device interconnect directly over the base device.

14. The method as claimed in claim 8 wherein mounting the first riser includes mounting the first riser having a T-shaped configuration and the first riser only partially covering the base device.

15. An integrated circuit device system comprising:

a base device on a first side of a carrier with a carrier device interconnect;

a first riser on the first side of the carrier and adjacent to the base device, the first riser having only one body portion on the carrier, the first riser having a protrusion portion extending away from the body portion and toward a peripheral end of the carrier, the body portion narrower than the protrusion portion, and the protrusion portion overhanging the base device; and

a first elevated device on the first riser with a riser device interconnect, the first elevated device having a first overhang above the base device, and both the protrusion portion and the riser device interconnect directly between the first overhang and the carrier device interconnect.

16. The system as claimed in claim 15 wherein the first riser is at the periphery of the carrier.

17. The system as claimed in claim 15 further comprising a mirrored chip assembly on a second side of the carrier.

18. The system as claimed in claim 15 wherein the first riser has a T-shaped configuration, and the first riser only partially covers the base device.

19. The system as claimed in claim 15 further comprising:

a second riser on the first side of the carrier on a side of the first riser opposite the base device; and

a second elevated device on the second riser, the second elevated device having a second overhang above the first elevated device.

20. The system as claimed in claim 15 wherein the riser device interconnect is directly over the base device.