IP Library › Assignment 043495/0397
Patent Assignment
Reel/Frame 043495/0397

Security Agreement

Recorded: 2017-08-09 Pages: 7
Assignor
SMART MODULAR TECHNOLOGIES, INC.
Executed: 2017-08-09
Assignee
BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
745 SEVENTH AVENUE, NEW YORK, NEW YORK, 10019
Covered Properties (17)
Memory Management System with Multiple Boot Devices and Method of Operation Thereof
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Interconnected Memory System and Method of Operation Thereof
Computing System with Backup and Recovery Mechanism and Method of Operation Thereof
Patent: 9,779,016 →
Application: 13/940,118 →
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent: 9,603,252 →
Application: 14/077,908 →
Integrated Circuit Device System with Elevated Stacked Configuration and Method of Manufacture Thereof
Patent: 9,648,754 →
Application: 14/231,622 →
Memory Module with Power Management System and Method of Operation Thereof
Patent: 9,576,615 →
Application: 14/884,369 →
Memory Management System with Backup System and Method of Operation Thereof
Application: 14/994,065 →
Publication: US 2017/0199684
Memory Management System with Multiple Boot Devices and Method of Operation Thereof
Application: 15/055,448 →
Publication: US 2017/0249156
Memory Module Repair System with Failing Component Detection and Method of Operation Thereof
Application: 15/066,728 →
Publication: US 2017/0262337
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Patent: 9,946,469 →
Application: 15/076,433 →
Publication: US 2017/0269852
Interconnected Memory System and Method of Operation Thereof
Application: 15/141,757 →
Publication: US 2017/0315949
High Density Memory Module System
Application: 15/273,385 →
Publication: US 2018/0081554
Memory Controller for High Latency Memory Devices
Application: 15/285,305 →
Publication: US 2018/0095661
Flash-Based Block Storage System with Trimmed Space Management and Method of Operation Thereof
Application: 15/294,678 →
Publication: US 2018/0107400
Virtual Timer for Data Retention
Application: 15/388,704 →
Publication: US 2018/0181454
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Application: 15/462,885 →
Related Assignments (22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2013
From: SHEN, JINGYING; FREY, ROBERT TOWER; MARINO, KELVIN
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 030782/0362 →
Assignment of Assignor's Interest Nov 12, 2013
From: IYER, SATYANARAYAN SHIVKUMAR; CHANG, REUBEN J.; MAHRAN, VICTOR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 031586/0282 →
Assignment of Assignor's Interest Mar 31, 2014
From: IYER, SATYANARAYAN SHIVKUMAR; PAULEY JR., ROBERT S.; MAHRAN, VICTOR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 032568/0001 →
Assignment of Assignor's Interest Oct 19, 2015
From: MAHRAN, VICTOR; GABRIELLI, KEVIN JAMES; CHANG, REUBEN JUN FONG
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 036825/0480 →
Assignment of Assignor's Interest Jan 12, 2016
From: ALAVI, AMIR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 037469/0926 →
Assignment of Assignor's Interest Feb 26, 2016
From: FREY, ROBERT T.
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 037844/0388 →
Assignment of Assignor's Interest Mar 10, 2016
From: CHANG, REUBEN J.; IYER, SATYANARAYAN S.; RUBINO, MICHAEL
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 037949/0304 →
Assignment of Assignor's Interest Mar 21, 2016
From: LIN, FONG-LONG; LIN, SHU-CHENG
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 038055/0527 →
Assignment of Assignor's Interest Apr 28, 2016
From: ANANTHANARAYANAN, RAJESH
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 038415/0479 →
Assignment of Assignor's Interest Sep 27, 2016
From: IYER, SATYANARAYAN SHIVKUMAR; PAULEY, ROBERT S., JR.
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 039866/0001 →
Assignment of Assignor's Interest Oct 25, 2016
From: TSAI, VICTOR Y.; FILLION, ROBERT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 040118/0018 →
Assignment of Assignor's Interest Oct 25, 2016
From: ANANTHANARAYANAN, RAJESH; SHEN, JINGYING; ALAVI, AMIR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 040117/0821 →
Assignment of Assignor's Interest Jan 6, 2017
From: LIN, SHU-CHENG
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 040878/0131 →
Assignment of Assignor's Interest Jul 24, 2017
From: ANANTHANARAYANAN, RAJESH; SHEN, JINYING; ALAVI, AMIR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043075/0293 →
Assignment of Assignor's Interest Jul 26, 2017
From: SHEN, JINYING; FREY, ROBERT TOWER; MARINO, KELVIN
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043101/0101 →
Assignment of Assignor's Interest Aug 29, 2019
From: IYER, SATYANARAYAN SHIVKUMAR; CHANG, REUBEN J.; MAHRAN, VICTOR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 050211/0605 →
Security Interest Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Release of Security Interest Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
Release of Security Interest at Reel 043495 Frame 0397 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058963/0479 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →