Patent Assignment
Reel/Frame 032568/0001
Assignment of Assignor's Interest
Recorded: 2014-03-31
Pages: 5
Assignors
IYER, SATYANARAYAN SHIVKUMAR
Executed: 2014-03-26
PAULEY JR., ROBERT S.
Executed: 2014-03-26
MAHRAN, VICTOR
Executed: 2014-03-26
Assignee
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560-4809
Covered Property
(1)
Integrated Circuit Device System with Elevated Stacked Configuration and Method of Manufacture Thereof
Patent:
9,648,754 →
Application:
14/231,622 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Aug 9, 2017
From: SMART MODULAR TECHNOLOGIES, INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 043495/0397 →
Security Interest
Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Release of Security Interest at Reel 043495 Frame 0397
Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058963/0479 →
Release of Security Interest
Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →