Patent Assignment
Reel/Frame 058913/0385
Release of Security Interest
Recorded: 2022-02-07
Pages: 8
Assignor
BANK OF AMERICA, N.A., AS AGENT
Executed: 2022-02-07
Assignee
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Properties
(39)
System and Method for Translation of Sdram and Ddr Signals
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Extended Universal Serial Bus Connectivity
Clock and Power Fault Detection for Memory Modules
Memory Modules with Error Detection and Correction
Multi-Chip Package
Memory Module with Vertically Accessed Interposer Assemblies
Clock and Power Fault Detection for Memory Modules
Clock and Power Fault Detection for Memory Modules
Dynamic Back-Up Storage System with Rapid Restore and Method of Operation Thereof
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Non-Volatile Dynamic Random Access Memory System with Non-Delay-Lock-Loop Mechanism and Method of Operation Thereof
Computing System with Non-Disruptive Fast Memory Restore Mechanism and Method of Operation Thereof
Non-Volatile Memory Packaging System with Caching and Method of Operation Thereof
Memory Management System with Power Source and Method of Manufacture Thereof
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Computing System with Backup and Recovery Mechanism and Method of Operation Thereof
Patent:
9,779,016 →
Application:
13/940,118 →
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Patent:
8,626,998 →
Application:
13/972,337 →
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
9,603,252 →
Application:
14/077,908 →
Integrated Circuit Device System with Elevated Stacked Configuration and Method of Manufacture Thereof
Patent:
9,648,754 →
Application:
14/231,622 →
Data Storage System with Information Exchange Mechanism and Method of Operation Thereof
Memory Module with Power Management System and Method of Operation Thereof
Patent:
9,576,615 →
Application:
14/884,369 →
Extended Capacity Memory System with Load Relieved Memory and Method of Manufacture Thereof
Memory Management System with Backup System and Method of Operation Thereof
Memory Management System with Multiple Boot Devices and Method of Operation Thereof
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Interconnected Memory System and Method of Operation Thereof
High Density Memory Module System
Memory Controller for High Latency Memory Devices
Flash-Based Block Storage System with Trimmed Space Management and Method of Operation Thereof
Virtual Timer for Data Retention
Integrated Circuit Device System with Elevated Configuration and Method of Manufacture Thereof
Patent:
10,529,688 →
Application:
15/462,885 →
Memory Module Test Adapter
Patent:
10,510,432 →
Application:
15/659,420 →
Centralized Backup Power Module
Patent:
10,551,892 →
Application:
15/709,257 →
Portable Module System
Patent:
10,488,892 →
Application:
15/789,041 →
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Memory Centric Computing Storage Controller System
Patent:
11,182,325 →
Application:
16/889,727 →
Catastrophic Event Memory Backup System
Patent:
11,561,739 →
Application:
16/889,729 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Notice of Succession of Agency
Sep 22, 2014
From: JPMORGAN CHASE BANK, N.A.
To: BARCLAYS BANK PLC, AS SUCCESSOR AGENT
Reel/Frame 033792/0908 →
Security Agreement
Oct 23, 2014
From: SMART MODULAR TECHNOLOGIES, INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 034036/0779 →
Assignment of Assignor's Interest
Jul 28, 2017
From: SHEN, JINYING; FREY, ROBERT TOWER; MARINO, KELVIN; BROOKS, JOSHUA HARRIS
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043124/0483 →
Assignment of Assignor's Interest
May 14, 2020
From: AMIDI, MIKE HOSSEIN; MARINO, KELVIN A; KOLLI, SATYADEV
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 052657/0757 →
Security Interest
Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Release of Security Interest at Reel 034036 Frame 0779
Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058960/0876 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Security Interest at Reel 033792 Frame 0908
Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058963/0725 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
Nunc Pro Tunc Assignment
Jul 9, 2025
From: AMIDI, MIKE H.; KOLLI, SATYADEV
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 071648/0345 →