IP Library Assignment 052657/0757
Patent Assignment
Reel/Frame 052657/0757

Assignment of Assignor's Interest

Recorded: 2020-05-14 Pages: 5
Assignors
AMIDI, MIKE HOSSEIN
Executed: 2004-01-05
MARINO, KELVIN A
Executed: 2004-01-05
KOLLI, SATYADEV
Executed: 2004-01-05
Assignee
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560-4809
Covered Property (1)
Multi-Rank Memory Module That Emulates a Memory Module Having a Different Number of Ranks
Application: 12/902,073 →
Publication: US 2011/0125966
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Succession of Agency Sep 22, 2014
From: JPMORGAN CHASE BANK, N.A.
To: BARCLAYS BANK PLC, AS SUCCESSOR AGENT
Reel/Frame 033792/0908 →
Security Interest Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Release of Security Interest at Reel 033792 Frame 0908 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058963/0725 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Security Interest Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →