IP Library Granted Patent US 9,576,615
Granted Patent B1
US 9,576,615 · App. 14/884,369 · Granted Feb 21, 2017

Memory module with power management system and method of operation thereof

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Quick Facts
Patent No.
US 9,576,615
App. No.
14/884,369
Granted
Feb 21, 2017
Kind
B1
Abstract

A memory module with power management system, and a method of operation of a memory module with power management system thereof, including: a base power plane; a power management circuit electrically connected to the base power plane; a managed power plane electrically connected to the base power plane only through the power management circuit; and a memory array electrically connected to the managed power plane.

Claims (43)

1. A method of operation of a memory module with power management system comprising:

providing a base power plane and a managed power plane;

electrically connecting the base power plane and the managed power plane through a power management circuit;

electrically connecting a memory array to the managed power plane;

monitoring power usage of the memory array by monitoring power usage of ranks within the memory array with at least the power management circuit and another power management circuit, the power management circuit and the another power management circuit monitoring different ranks within the memory array; and

modifying input voltage to the managed power plane based on the power usage of the memory array.

2. The method as claimed in claim 1 further comprising electrically connecting a register to the managed power plane.

3. The method as claimed in claim 1 further comprising electrically connecting the base power plane to a motherboard.

4. The method as claimed in claim 1 further comprising:

electrically connecting the base power plane to a motherboard; and

electrically connecting an EEPROM to the motherboard.

5. A method of operation of a memory module with power management system comprising:

providing a base power plane and a managed power plane;

electrically connecting the base power plane to a motherboard;

electrically connecting an EEPROM to the motherboard;

electrically connecting the base power plane and the managed power plane through a power management circuit;

electrically connecting a memory array to the managed power plane;

electrically connecting a register to the managed power plane;

monitoring power usage of the memory array by monitoring power usage of ranks within the memory array with at least the power management circuit and another power management circuit, the power management circuit and the another power management circuit monitoring different ranks within the memory array; and

modifying input voltage to the managed power plane based on the power usage of the memory array.

6. The method as claimed in claim 5 further comprising stacking the power management circuit on the register.

7. The method as claimed in claim 5 further comprising stacking the power management circuit on the EEPROM.

8. The method as claimed in claim 5 further comprising providing a printed circuit board having the power management circuit embedded within the printed circuit board.

9. The method as claimed in claim 5 further comprising connecting test points to the power management circuit for programming the power management circuit.

10. A memory module with power management system comprising:

a base power plane;

a power management circuit electrically connected to the base power plane;

a managed power plane electrically connected to the base power plane through the power management circuit;

a memory array electrically connected to the managed power plane; and

another power management circuit electrically connected to the base power plane wherein the power management circuit and the another power management circuit are monitoring the power usage of the memory array by monitoring power usage of ranks within the memory array, and the power management circuit and the another power management circuit are monitoring different ranks within the memory array.

11. The memory module as claimed in claim 10 further comprising a register electrically connected to the managed power plane.

12. The memory module as claimed in claim 10 further comprising a motherboard electrically connected to the base power plane.

13. The memory module as claimed in claim 10 further comprising:

a motherboard electrically connected to the base power plane; and

an EEPROM electrically connected to the motherboard.

14. The memory module as claimed in claim 10 further comprising:

a motherboard electrically connected to the base power plane;

an EEPROM electrically connected to the motherboard; and

a register electrically connected to the managed power plane.

15. The memory module as claimed in claim 14 wherein the power management circuit is stacked on the register.

16. The memory module as claimed in claim 14 wherein the power management circuit is stacked on the EEPROM.

17. The memory module as claimed in claim 14 wherein the power management circuit is embedded in a printed circuit board of the memory module.

18. The memory module as claimed in claim 14 further comprising test points connected to the power management circuit for programming the power management circuit.

Assignments (8)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
RELEASE OF SECURITY INTEREST AT REEL 043495 FRAME 0397 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058963/0479 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
SECURITY AGREEMENT Recorded Aug 9, 2017
From: SMART MODULAR TECHNOLOGIES, INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 043495/0397 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2015
From: MAHRAN, VICTOR; GABRIELLI, KEVIN JAMES; CHANG, REUBEN JUN FONG
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 036825/0480 →