Extended capacity memory system with load relieved memory and method of manufacture thereof

1. A method of manufacture of an enhanced capacity memory system comprising:

coupling a memory expansion board, having a supplementary memory module, to a dual in-line memory module carrier including attaching a bridge transposer, the dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module, the memory expansion board held in place by mounting screws adjacent the bridge transposer and the integrated memory buffer, the bridge transposer attached directly to the memory expansion board and the dual in-line memory module carrier for installing the enhanced capacity memory system into a single dual in-line memory module socket.

2. The method as claimed in claim 1 further comprising mounting a heat spreader sheet between the memory module and the supplementary memory module.

3. The method as claimed in claim 1 further comprising:

mounting a micro jack in a corner of the dual in-line memory module carrier; and

mounting a micro pin in the corner of the memory expansion board including engaging the micro pin in the micro jack.

4. The method as claimed in claim 1 wherein attaching the bridge transposer includes:

coupling a contact on a back side to the memory expansion board; and

coupling a through substrate conductor to the dual in-line memory module carrier through the contact on a front side.

5. A method of manufacture of an enhanced capacity memory system comprising:

assembling a dual in-line memory module carrier by:

attaching a memory module to the dual in-line memory module carrier, and

mounting an integrated memory buffer, on the dual in-line memory module carrier, coupled to the memory module; and

coupling a memory expansion board to the dual in-line memory module carrier including:

attaching a bridge transposer directly to the dual in-line memory module carrier and the memory expansion board for installing the enhanced capacity memory system into a single dual in-line memory module socket, and

coupling a supplementary memory module, on the memory expansion board, to the integrated memory buffer through the bridge transposer, the memory expansion board held in place by mounting screws adjacent the bridge transposer and the integrated memory buffer.

6. The method as claimed in claim 5 further comprising mounting a heat spreader sheet between the memory module on the dual in-line memory module carrier and the supplementary memory module on the memory expansion board.

7. The method as claimed in claim 5 further comprising:

mounting a micro jack in a corner of the dual in-line memory module carrier;

clamping a heat spreader sheet between the dual in-line memory module carrier and the memory expansion board; and

mounting a micro pin in the corner of the memory expansion board including engaging the micro pin through the heat spreader sheet and in the micro jack.

8. The method as claimed in claim 5 wherein attaching the bridge transposer includes:

coupling a contact on a back side of an interposer substrate to the memory expansion board; and

coupling a through substrate conductor to the dual in-line memory module carrier through the contact on a front side including coupling the integrated memory buffer to the memory expansion board.

9. An enhanced capacity memory system comprising:

a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module;

a memory expansion board, having a supplementary memory module, coupled to the dual in-line memory module carrier;

a bridge transposer attached directly to the memory expansion board and the dual in-line memory module carrier for installing the enhanced capacity memory system into a single dual in-line memory module socket; and

mounting screws adjacent the bridge transposer and the integrated memory buffer that hold the memory expansion board in place.

10. The system as claimed in claim 9 further comprising a heat spreader sheet mounted on the memory module and the supplementary memory module.

11. The system as claimed in claim 9 further comprising:

a micro jack mounted in a corner of the dual in-line memory module carrier; and

a micro pin mounted in the corner of the memory expansion board includes the micro pin engaged in the micro jack.

12. The system as claimed in claim 9 wherein the bridge transposer includes:

a contact on a back side coupled to the memory expansion board; and

a through substrate conductor coupled to the dual in-line memory module carrier through the contact on a front side.

13. The system as claimed in claim 9 further comprising a heat spreader sheet on the memory module and the supplementary memory module includes the heat spreader sheet, the memory module and the supplementary memory module between the dual in-line memory module carrier and the memory expansion board.

14. The system as claimed in claim 13 wherein:

the memory expansion board coupled to the dual in-line memory module carrier includes:

a core heat sink on the integrated memory buffer and the dual in-line memory module carrier, and

a heat spreader plate on the memory expansion board; and

the mounting screws are near the core heat sink and the heat spreader plate and coupled to the heat spreader sheet.

15. The system as claimed in claim 13 further comprising a plurality of memory modules on the dual in-line memory module carrier and a same plurality of supplementary memory modules on the memory expansion board, the enhanced capacity memory system having a double capacity with the plurality of the memory modules and the same plurality of the supplementary memory modules.

16. The system as claimed in claim 13 further comprising:

a micro jack mounted in a corner of the dual in-line memory module carrier; and

a micro pin mounted in the corner of the memory expansion board includes the micro pin through the heat spreader sheet and engaged in the micro jack.

17. The system as claimed in claim 13 wherein the bridge transposer includes:

a contact on a back side coupled to the memory expansion board; and

a through substrate conductor coupled to the dual in-line memory module carrier through the contact on a front side includes the integrated memory buffer coupled to the memory expansion board.

18. The method as claimed in claim 1 wherein attaching the bridge transposer includes attaching a contact finger of the bridge transposer on the dual in-line memory module carrier.

19. The method as claimed in claim 5 wherein attaching the bridge transposer includes attaching a contact finger of the bridge transposer directly on the dual in-line memory module carrier.

20. The system as claimed in claim 9 wherein the bridge transposer includes a contact finger on the dual in-line memory module carrier.