Integrated circuit device system with elevated stacked configuration and method of manufacture thereof

1. A method of manufacture of an integrated circuit device system comprising:

providing a module interposer having a module first side and a module second side;

mounting an outer chip assembly to the module first side;

mounting a mirrored chip assembly to the module second side, the mirrored chip assembly below the outer chip assembly;

providing electrical connections for the module interposer by attaching risers to the module second side immediately adjacent to opposing edges of the mirrored chip assembly; and

coupling a carrier on the module second side by the risers, the carrier including a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

2. The method as claimed in claim 1 wherein:

providing the module interposer includes providing the module interposer having a cavity at the module second side; and

mounting the mirrored chip assembly includes mounting the mirrored chip assembly into the cavity.

3. The method as claimed in claim 1 wherein attaching risers includes:

attaching a first riser and a second riser to the module second side; and

wherein:

attaching the carrier includes the first riser and the second riser directly attached to the carrier, the first riser and the second riser between the carrier and the module interposer.

4. The method as claimed in claim 1 further comprising mounting a bottom module to the carrier second side of the carrier.

5. The method as claimed in claim 1 wherein:

providing the module interposer includes providing the module interposer having a first leg and a second leg on the module second side; and

attaching the carrier includes attaching the first leg and the second leg to the carrier first side of the carrier.

6. A method of manufacture of an integrated circuit device system comprising:

providing a module interposer having a module first side and a module second side;

mounting an outer chip assembly to the module first side, the outer chip assembly includes a first top integrated circuit device and a second top integrated circuit device;

mounting a mirrored chip assembly to the module second side;

attaching a module interconnect to the module second side;

providing electrical connections for the module interposer by attaching risers to the module second side immediately adjacent to opposing edges of the mirrored chip assembly; and

coupling a carrier to the module interconnect by the risers, the carrier including a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

7. The method as claimed in claim 6 further comprising:

attaching a first riser and a second riser to the module second side; and

wherein:

attaching the carrier includes the first riser and the second riser directly attached to the carrier, the first riser and the second riser bordering the mirrored chip assembly.

8. The method as claimed in claim 6 wherein attaching risers includes:

attaching a first riser and a second riser to the module second side; and

wherein:

attaching the carrier includes the first riser and the second riser directly on the carrier, the first riser and the second riser between the carrier and the module interposer; and

the method further comprises mounting a stacked module on the module first side.

9. The method as claimed in claim 6 wherein:

providing the module interposer includes providing the module interposer having a first leg and a second leg on the module second side;

mounting a first riser and a second riser on the module first side; and

mounting a stacked module directly on the first riser and the second riser.

10. The method as claimed in claim 6 further comprising mounting a bottom module to the carrier second side of the carrier.

11. An integrated circuit device system comprising:

a module interposer having a module first side and a module second side;

a outer chip assembly mounted to the module first side;

a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly;

risers attached to the module second side immediately adjacent to opposing edges of the mirrored chip assembly, the risers providing electrical connections for the module interposer; and

a carrier coupled to the module second side by the risers, the carrier including a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.

12. The system as claimed in claim 11 wherein:

the module interposer includes a cavity at the module second side; and

the mirrored chip assembly is mounted in the cavity.

13. The system as claimed in claim 11 wherein the risers attached to the module second side include:

a first riser directly attached to the module second side and directly attached to the carrier, the first riser between the carrier and the module interposer; and

a second riser directly attached to the module second side and directly attached to the carrier, the second riser between the carrier and the module interposer.

14. The system as claimed in claim 11 further comprising a bottom module attached to the carrier second side.

15. The system as claimed in claim 11 wherein the module interposer includes a first leg on the module second side and a second leg on the module second side, the first leg and the second leg attached to the carrier first side of the carrier.

16. The system as claimed in claim 11 further comprising a module interconnect between the module interposer and the carrier.

17. The system as claimed in claim 16 further comprising:

a first riser attached to the module second side; and

a second riser attached to the module second side, the second riser and the first riser bordering the mirrored chip assembly.

18. The system as claimed in claim 16 wherein the risers attached to the module second side include:

a first riser between the module second side and the carrier;

a second riser between the module second side and the carrier; and

the system further includes a stacked module mounted to the module first side.

19. The system as claimed in claim 16 wherein:

the module interposer includes a first leg on the module second side and a second leg on the module second side; and

further comprising:

a first riser on the module first side;

a second riser on the module first side; and

a stacked module directly on the first riser and the second riser.

20. The system as claimed in claim 16 further comprising:

a bottom module mounted to the carrier second side of the carrier; and

a stacked module mounted to the bottom module.