High density memory module system
Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.
1. A method of manufacture of a memory module system comprising:
forming a module adapter having an adapter board with an adapter control unit and an adapter connector for connecting to a memory channel connector, the adapter control unit configured to manage a memory request received through the adapter connector;
mounting a first connector, among a plurality of connectors, directly on and over the module adapter, the first connecter configured to receive one of: a first memory module or a second memory module;
mounting a second connector, among the plurality of connectors, over the module adapter, the second connector configured to receive one of: the first memory module or the second memory module;
mounting a third connector, among the plurality of connectors, over the module adapter, wherein the first connector, the second connector, and the third connector each receive a different one of the first memory module, the second memory module, and a removable power module; and
wherein the adapter control unit is configured to, upon detecting a loss of power, electrically isolate the module adapter from the memory channel connector, power the module adapter using the removable power module, and copy at least some of the contents of the first memory module to the second memory module.
2. The method as claimed in claim 1 further comprising mounting the second memory module above the first memory module.
3. The method as claimed in claim 1 further comprising mounting a pass-through adapter between the first memory module and the second memory module.
4. The method as claimed in claim 1 further comprising mounting another module adapter between the first memory module and the second memory module.
5. The method as claimed in claim 1 wherein the first memory module is a volatile memory module and the second memory module is a non-volatile memory module.
6. The method as claimed in claim 1 further comprising mounting the first memory module adjacent to the second memory module.
7. The method as claimed in claim 1 wherein the first memory module includes a stacking connector for attaching to the module adapter.
8. A method of operation of a module adapter comprising:
configuring a module adapter having an adapter board with an adapter control unit and an adapter connector to connect to a memory channel connector, the adapter control unit configured to manage a memory request received through the adapter connector
configuring a first connector, among a plurality of connectors, to accept a first memory module, the first connector further configured to receive the removable power module, and the first connector on the adapter board of the module adapter;
configuring a second connector, among the plurality of connectors, to accept a second memory module, the second connector further configured to receive the removable power module, and the second connector on the adapter board;
configuring a third connector, among the plurality of connectors, to accept a removable power module, the third connector on the adapter board, and wherein the first connector, the second connector, and the third connector each receive a different one of the first memory module, the second memory module, and the removable power module;
detecting a loss of power at an adapter control unit of the module adapter,
electrically isolating the module adapter from the memory channel connector and powering the module adapter using the removable power module; and
copying at least some of the contents of the first memory module attached to the module adapter to the second memory module attached to the module adapter.
9. The method as claimed in claim 8 wherein configuring the second connector includes positioning the second memory module over the first memory module.
10. The method as claimed in claim 8 wherein copying the contents of first memory module includes copying some of the contents of the first memory module through a passthrough adapter between the first memory module and the second memory module.
11. The method as claimed in claim 8 further comprising mounting a pass-through adapter between the first memory module and the second memory module.
12. The method as claimed in claim 8 wherein copying the contents of the first memory module includes copying some of the contents the first memory module using a processing unit of the adapter control unit.
13. The method as claimed in claim 8 wherein mounting the first memory module includes mounting the first memory module adjacent to the second memory module.
14. The method as claimed in claim 8 wherein mounting first memory module includes mounting a volatile memory module in the first connector and mounting a non-volatile memory module in the second connector.
15. A memory module system comprising:
a module adapter having an adapter board with an adapter connector and an adapter control unit, the adapter control unit configured to manage a memory request received through the adapter connector;
a first connector, among a plurality of connectors, mounted on and over the module adapter, a first memory module attached to the first connector, and the first connector configured to receive a removable power module; and
a second connector, among the plurality of connectors, mounted over the module adapter, a second memory module attached to the second connector, the second connector configured to receive the removable power module;
a third connector, among the plurality of connectors, mounted over the module adapter, the first connector, the second connector, and the third connector each configured to receive a different one of: the first memory module, the second memory module, and the removable power module and wherein the adapter control unit is configured to, upon detecting a loss of power, electrically isolate the module adapter from the memory channel connector and copy at least some of the contents of the first memory module to the second memory module.
16. The system as claimed in claim 15 wherein the second module is above the first memory module.
17. The system as claimed in claim 15 further comprising a pass-through adapter between the first memory module and the second memory module.
18. The system as claimed in claim 15 further comprising another module adapter between the first memory module and the second memory module.
19. The system as claimed in claim 15 wherein the first memory module is a volatile memory module and the second memory module is a non-volatile memory module.
20. The system as claimed in claim 15 wherein the first memory module is mounted adjacent to the second memory module.