IP Library Granted Patent US 10,551,892
Granted Patent B1
US 10,551,892 · App. 15/709,257 · Granted Feb 4, 2020

Centralized backup power module

Inventor: Jinying Shen (San Ramon, CA)
Assignee: SMART Modular Technologies, Inc.
G06F1/263G06F1/266G06F1/3287
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Quick Facts
Patent No.
US 10,551,892
App. No.
15/709,257
Granted
Feb 4, 2020
Kind
B1
Abstract

Approaches, techniques, and mechanisms are disclosed for a centralized backup power support system that improves testability of non-volatile dual in-line memory modules (NVDIMM) on Automatic Test Equipment (ATE) testers and in-system tests. An NVDIMM includes both volatile memories and non-volatile memories. According to an embodiment, a compact backup power distribution board is powered with an external power supply with an individual protection circuit. The backup power distribution board has an unlimited energy capacity for any density of NVDIMM and zero charge waiting time. According to an embodiment, instead of using an electric double-layer capacitor (EDLC) to support backup power, a resistor is used instead of an EDLC on each backup power module. There is no charging time when the backup power module does not have EDLC cells, resulting in significant reduction in test time and production cost and increase in production output.

Claims (38)

1. An apparatus comprising:

a distribution board;

a power supply connector on the distribution board that connects to an external power supply;

a backup power connector on the distribution board for connecting to a memory module inserted into a memory socket; and

a backup power module attached to the distribution board, the backup power module having a circuit with a resistor instead of a capacitor, the circuit configured to generate a backup voltage to supply power through the backup power connector to the memory module, the backup voltage based on an input voltage supplied from the external power supply through the power supply connector, the backup power module including a fuse directly connected to the resistor for generation of a fuse voltage based on the input voltage, and the fuse voltage is available at the backup power connector for the memory module to use as the backup voltage.

2. The apparatus as recited in claim 1 , wherein the distribution board includes a trace connected to the backup power module and the backup power connector for communication between the backup power module and the memory module using a serial protocol.

3. The apparatus as recited in claim 1 , wherein the backup power connector is a vertical connector.

4. The apparatus as recited in claim 1 , further comprising backup power sockets on the distribution board, one of the backup power sockets at an offset vertically away from another of the backup power sockets.

5. The apparatus as recited in claim 1 , further comprising:

backup power sockets on the distribution board; and

wherein the backup power module is inserted into one of the backup power sockets.

6. The apparatus as recited in claim 5 , wherein the backup power module includes a supercapacitor charger that receives the input voltage and generates a charger voltage, the supercapacitor charger is directly connected to the one of the backup power sockets, the charger voltage is less than the input voltage, and the backup voltage is generated based on the charger voltage.

7. An apparatus comprising:

a system board;

a distribution board attached to the system board;

a power supply connector on the distribution board;

a backup power connector on the distribution board that connects to a memory module inserted into a memory socket on the system board;

a backup power module attached to the distribution board, the backup power module having a circuit with a resistor instead of capacitor, the circuit configured to generate a backup voltage for supplying power through the backup power connector to the memory module, the backup power module including a fuse directly connected to the resistor for generation of a fuse voltage based on the input voltage, and the fuse voltage is available at the backup power connector for the memory module to use as the backup voltage;

a power cable connected to an external power supply and the power supply connector; and

a backup cable connected to the backup power connector and the module connector.

8. The apparatus as recited in claim 7 , wherein:

the distribution board includes a backup power socket at an interior portion of the distribution board; and

the backup power module is inserted into the backup power socket.

9. The apparatus as recited in claim 7 , wherein the distribution board is perpendicular to the system board.

10. The apparatus as recited in claim 7 , wherein the backup power module is parallel to the system board.

11. The apparatus as recited in claim 7 , wherein the distribution board includes backup power sockets mounted at an interior portion of the distribution board.

12. The apparatus as recited in claim 7 , wherein the distribution board includes backup power sockets arranged in multiple rows, and in each of the rows, one of the backup power sockets is adjacent to and vertically at an offset from another of the backup power sockets.

13. The apparatus as recited in claim 7 , wherein the backup power module includes the circuit with a second resistor in series with the resistor for generation of the backup voltage.

14. A method of manufacture of a backup power support system, comprising:

mounting a power supply connector on a distribution board for connecting to an external power supply;

mounting a backup power connector on the distribution board for connecting to a memory module inserted into a memory socket; and

attaching a backup power module to the distribution board, the backup power module having a circuit with a resistor instead of a capacitor, the circuit generates a backup voltage for supplying power through the backup power connector to the memory module, the backup voltage based on an input voltage supplied from the external power supply through the power supply connector, the backup power module including a fuse directly connected to the resistor for generation of a fuse voltage based on the input voltage, and the fuse voltage is available at the backup power connector for the memory module to use as the backup voltage.

15. The method as recited in claim 14 , wherein the distribution board includes a trace connected to the backup power module and the backup power connector for communication between the backup power module and the memory module using a serial protocol.

16. The method as recited in claim 14 , wherein the backup power connector is a vertical connector.

17. The method as recited in claim 14 , further comprising mounting backup power sockets on the distribution board, one of the backup power sockets at an offset vertically away from another of the backup power sockets.

18. The method as recited in claim 14 , further comprising:

mounting backup power sockets on the distribution board; and

wherein attaching the backup power module includes inserting the backup power module into one of the backup power sockets.

Assignments (8)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
RELEASE OF SECURITY INTEREST AT REEL 052134 FRAME 0717 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.; SMART MODULAR TECHNOLOGIES (LX) S.À. R.L; SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058963/0661 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
SECURITY AGREEMENT Recorded Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2017
From: SHEN, JINYING
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043764/0782 →