Patent Assignment
Reel/Frame 058963/0661
Release of Security Interest at Reel 052134 Frame 0717
Recorded: 2022-02-07
Pages: 7
Assignor
BARCLAYS BANK PLC
Executed: 2022-01-07
Assignees
SMART MODULAR TECHNOLOGIES, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
SMART MODULAR TECHNOLOGIES (LX) S.À. R.L
63, RUE DE ROLLINGERGRUND, L-2440 LUXEMBOURG, LUXEMBOURG
SMART EMBEDDED COMPUTING, INC.
2900 S. DIABLO WAY, SUITE 190, TEMPE, ARIZONA, 85282
Covered Properties
(8)
System and Method for Restricting Airflow Through a Portion of an Electronics Enclosure
Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
High Precision Timer in CPU Cluster
Method for Forming Bump of Semiconductor Package
Memory Module Test Adapter
Patent:
10,510,432 →
Application:
15/659,420 →
Centralized Backup Power Module
Patent:
10,551,892 →
Application:
15/709,257 →
Portable Module System
Patent:
10,488,892 →
Application:
15/789,041 →
Solid State Storage System with Latency Management Mechanism and Method of Operation Thereof
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 4, 2013
From: HELLWIG, MATHIAS
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 031133/0864 →
Security Agreement
Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
Security Agreement
Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
Assignment of Assignor's Interest
Jun 21, 2017
From: PARK, BUM WOOK; JUNG, HYUN
To: SMART MODULAR TECHNOLOGIES LX S.A.R.L; PARK, BUM WOOK; JUNG, HYUN
Reel/Frame 042772/0527 →
Change of Name
Aug 25, 2017
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 043678/0114 →
Assignment of Assignor's Interest
Aug 29, 2017
From: SHEN, JINYING
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043434/0983 →
Assignment of Assignor's Interest
Oct 3, 2017
From: SHEN, JINYING
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 043764/0782 →
Assignment of Assignor's Interest
Nov 21, 2017
From: LIN, FONG-LONG; GOOI, KWANG JIN; IYER, SATYANARAYAN SHIVKUMAR
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 044193/0194 →
Assignment of Assignor's Interest
Jun 5, 2018
From: PARK, BUM WOOK; JUNG, HYUN
To: SMART MODULAR TECHNOLOGIES LX S.A.R.L.
Reel/Frame 045988/0931 →
Partial Release of Security Interest
Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
Release of Security Interest
Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
Security Agreement
Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
Change of Name
Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
Change of Name
Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
Security Interest
Dec 23, 2020
From: SMART MODULAR TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054738/0855 →
Security Interest
Mar 3, 2021
From: SMART EMBEDDED COMPUTING, INC., (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 055481/0435 →
Release of Security Interest
Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING INC. (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
Reel/Frame 058913/0421 →
Release of Security Interest
Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 058913/0385 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
Nunc Pro Tunc Assignment
Jun 30, 2025
From: LIN, FONG-LONG; LIN, SHU-CHENG
To: SMART MODULAR TECHNOLOGIES, INC.
Reel/Frame 071569/0307 →