IP Library › Assignment 043678/0114
Patent Assignment
Reel/Frame 043678/0114

Change of Name

Recorded: 2017-08-25 Pages: 5
Assignor
Assignee
ARTESYN EMBEDDED COMPUTING, INC.
2900 SOUTH DIABLO WAY, SUITE 190, TEMPE, ARIZONA, 85282
Covered Properties (5)
Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
Patent: 8,937,807 →
Application: 13/300,871 →
Publication: US 2013/0128452
Configurable Cooling For Rugged Environments
Application: 13/724,952 →
Publication: US 2014/0174693
Integrated Thermal Inserts And Cold Plate
Patent: 9,713,287 →
Application: 13/741,710 →
Publication: US 2014/0198457
Method and Device to Provide Uniform Cooling in Rugged Environments
Application: 13/757,038 →
Publication: US 2014/0217870
High Precision Timer in CPU Cluster
Application: 13/799,167 →
Publication: US 2014/0056319
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2013
From: WONG, SUZANNE MARYE; CORNES, MARTIN PETER JOHN; TUFFORD, ROBERT CHARLES
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING INC.
Reel/Frame 029630/0578 →
Assignment of Assignor's Interest Feb 1, 2013
From: WONG, SUZANNE MARYE; CORNES, MARTIN PETER JOHN; TUFFORD, ROBERT CHARLES
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 029740/0556 →
Assignment of Assignor's Interest Feb 6, 2013
From: WONG, SUZANNE MARYE; CORNES, MARTIN PETER JOHN; TUFFORD, ROBERT CHARLES
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 029761/0701 →
Assignment of Assignor's Interest Sep 4, 2013
From: HELLWIG, MATHIAS
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 031133/0864 →
Security Agreement Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
Security Agreement Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
Partial Release of Security Interest Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
Release of Security Interest Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
Security Agreement Sep 24, 2019
From: SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 050471/0912 →
Security Agreement Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
Change of Name Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
Security Interest Dec 23, 2020
From: SMART EMBEDDED COMPUTING INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054739/0137 →
Security Interest Mar 3, 2021
From: SMART EMBEDDED COMPUTING, INC., (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 055481/0435 →
Release of Security Interest at Reel 052134 Frame 0717 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.; SMART MODULAR TECHNOLOGIES (LX) S.À. R.L; SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058963/0661 →
Release of Security Interest Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING INC. (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
Reel/Frame 058913/0421 →
Release of Security Interest Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058913/0097 →
Security Interest Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Security Interest at Reel 050471 Frame 0912 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058961/0005 →
Release of Patent Security Interest Recorded at R/F 058983/0001 Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →