IP Library Granted Patent US 11,026,347
Granted Patent B2
US 11,026,347 · App. 13/724,952 · Granted Jun 1, 2021

Configurable cooling for rugged environments

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Quick Facts
Patent No.
US 11,026,347
App. No.
13/724,952
Granted
Jun 1, 2021
Kind
B2
Abstract

A configurable electronics cabinet cooling system includes a cabinet having multiple walls including at least one universal cabinet wall. The universal cabinet wall has a planar outward facing surface and multiple apertures. A heat transfer component is releasably connected to the universal cabinet wall. The heat transfer component is selected from either a conductive cooling member or a convective cooling member each adapted to be interchangeably and releasably connected to the universal cabinet wall using fasteners extending through same ones of the apertures. Each of the conductive cooling member and the convective cooling member includes a planar surface, the planar surface adapted to directly contact the outward facing surface of the universal cabinet wall.

Claims (29)

1. A configurable electronics cabinet cooling system, comprising:

a cabinet including at least one universal cabinet wall having a planar outward facing surface and multiple apertures; and

a conductive cooling member that primarily dissipates absorbed heat through conduction and a convective cooling member that primarily dissipates absorbed heat through convection, the universal cabinet wall configured so that both the conductive cooling member and the convective cooling member may be connected to the universal cabinet wall using same ones of the apertures, the conductive cooling member and the convective cooling member including a respective planar surface, the respective planar surface being coupled to directly contact the outward facing surface of the universal cabinet wall,

wherein in a first configuration, one of the conductive cooling member and convective cooling member is connected to the universal cabinet wall and in a second configuration, the other of the conductive cooling member and convective cooling member is connected to the universal cabinet wall, where the electronics cabinet can be reconfigured between the first configuration and the second configuration, and wherein the universal cabinet wall is configured to receive either the conductive cooling member or the convective cooling member,

wherein the conductive cooling member and the convective cooling member are adapted to be releasably connected to the universal cabinet wall, and

wherein the conductive cooling member includes multiple conductive cooling channels projecting from a base and tapering to unconnected ends opposite the base, each of the multiple conductive cooling channels being contained entirely within the conductive cooling member and each of the multiple conductive cooling channels being spaced apart from an adjacent cooling channel by an air gap external to each projecting channel along the universal cabinet wall which when connected to a cooling header provides conduction cooling of the cabinet.

2. The configurable electronics cabinet cooling system of claim 1 , wherein the conductive cooling member is in fluid communication with all of the conductive cooling channels.

3. The configurable electronics cabinet cooling system of claim 1 , wherein each of the conductive cooling channels has a common channel width, a common channel base depth and a common channel end depth.

4. The configurable electronics cabinet cooling system of claim 3 , wherein the channel end depth is less than the channel base depth.

5. The configurable electronics cabinet cooling system of claim 1 , wherein the conductive cooling member includes first, second, third and fourth conductive cooling channels defining individual ones of the planar surface each aligned coplanar to the other cooling members.

6. The configurable electronics cabinet cooling system of claim 5 , wherein each of the first, second, third and fourth conductive cooling channels has a common channel width, a common channel base depth and a common channel end depth.

7. A configurable electronics cabinet cooling system, comprising:

a cabinet having multiple walls including at least one universal cabinet wall, the universal cabinet wall having a planar outward facing surface and multiple apertures; and

a heat transfer component releasably connected to the universal cabinet wall, the heat transfer component including one of a conductive cooling member that substantially dissipates absorbed heat through conduction or a convective cooling member that substantially dissipates absorbed heat through convection, each of the conductive cooling member and the convective cooling member including a planar surface,

wherein the planar surface is coupled to directly contact the outward facing surface of the universal cabinet wall, wherein the conductive cooling member is interchangeable with the convective cooling member,

wherein the heat transfer component is adapted to be releasably connected to the universal cabinet wall and wherein in a first configuration, one of the conductive cooling member or convective cooling member is connected to the universal cabinet wall and in a second configuration, the other of the conductive cooling member or convective cooling member is connected to the universal cabinet wall, where the electronics cabinet can be reconfigured between the first configuration and the second configuration, and

wherein the conductive cooling member includes multiple conductive cooling channels projecting from a base and tapering to unconnected ends opposite the base, each of the multiple conductive cooling channels being contained entirely within the conductive cooling member and each of the multiple conductive cooling channels being spaced apart from an adjacent cooling channel by an air gap external to each projecting channel and along the universal cabinet wall which when connected to a cooling header provides conduction cooling of the cabinet.

8. The configurable electronics cabinet cooling system of claim 7 , wherein the convective cooling member includes a support plate having the planar surface oppositely directed with respect to multiple cooling fins.

9. The configurable electronics cabinet cooling system of claim 8 , wherein the cooling fins are substantially identical to each other.

10. The configurable electronics cabinet cooling system of claim 7 , wherein the universal cabinet wall further includes multiple component spacing members oppositely facing with respect to the planar surface.

11. The configurable electronics cabinet cooling system of claim 7 , wherein each of the multiple conductive cooling channels has a channel planar face all aligned coplanar with each other such that each of the channel planar faces simultaneously contact the planar surface of the universal cabinet wall, each of the multiple conductive cooling channels being self contained and spaced apart by the air gap from the adjacent cooling channel along the universal cabinet wall.

12. A configurable electronics cabinet cooling system, comprising:

a cabinet having multiple walls; and

a cooling assembly, including:

a universal cabinet wall defining one of the multiple walls, the universal cabinet wall having a planar outward facing surface and multiple component spacing members oppositely facing with respect to the outward facing surface; and

a heat transfer component releasably connected to the outward facing surface of the universal cabinet wall, the heat transfer component including one of a conductive cooling member that substantially dissipates absorbed heat through conduction and a convective cooling member that substantially dissipates absorbed heat through convection, wherein the conductive cooling member is interchangeable with the convective cooling member to releasably connect to the universal cabinet wall in a same manner as the convective cooling member,

wherein the convective cooling member and the conductive cooling member are adapted to be releasably connected to the universal cabinet wall and wherein in a first configuration, one of the conductive cooling member and convective cooling member is connected to the universal cabinet wall and in a second configuration, the other of the conductive member and convective cooling member is connected to the universal cabinet wall, where the electronics cabinet can be reconfigured between the first configuration and the second configuration; and

wherein the conductive cooling member includes multiple conductive cooling channels projecting from a base and tapering to unconnected ends opposite the base, each of the multiple conductive cooling channels being contained entirely within the conductive cooling member and each of the multiple conductive cooling channels being spaced apart from an adjacent cooling channel by an air gap external to each projecting channel along the universal cabinet wall which when connected to a cooling header provides conduction cooling of the cabinet.

13. The configurable electronics cabinet cooling system of claim 12 , wherein the multiple conductive cooling channels each have a planar face, all of the conductive cooling channel planar faces being in coplanar alignment with each other such that the coplanar faces all directly contact the outward facing surface of the universal cabinet wall.

Assignments (13)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058913/0097 →
RELEASE OF SECURITY INTEREST AT REEL 050471 FRAME 0912 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058961/0005 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Dec 23, 2020
From: SMART EMBEDDED COMPUTING INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054739/0137 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
SECURITY AGREEMENT Recorded Sep 24, 2019
From: SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 050471/0912 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
CHANGE OF NAME Recorded Aug 25, 2017
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 043678/0114 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →