IP Library › Assignment 042772/0527
Patent Assignment
Reel/Frame 042772/0527

Assignment of Assignor's Interest

Recorded: 2017-06-21 Pages: 4
Assignors
PARK, BUM WOOK
Executed: 2017-06-09
JUNG, HYUN
Executed: 2017-06-09
Assignees
SMART MODULAR TECHNOLOGIES LX S.A.R.L
#712,69,SEONGNAM-DAERO, BUNDANG-GU,, SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
PARK, BUM WOOK
16, YANGJAE-DAERO 47-GIL, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
JUNG, HYUN
#1404-1405,23, DONGIL-RO 228-GIL, NOWON-GU,, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Bump of Semiconductor Package
Application: 15/629,234 →
Publication: US 2018/0174990
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 5, 2018
From: PARK, BUM WOOK; JUNG, HYUN
To: SMART MODULAR TECHNOLOGIES LX S.A.R.L.
Reel/Frame 045988/0931 →
Security Agreement Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
Release of Security Interest at Reel 052134 Frame 0717 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.; SMART MODULAR TECHNOLOGIES (LX) S.À. R.L; SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058963/0661 →