IP Library › Assignment 045988/0931
Patent Assignment
Reel/Frame 045988/0931

Assignment of Assignor's Interest

Recorded: 2018-06-05 Pages: 3
Assignors
PARK, BUM WOOK
Executed: 2018-05-25
JUNG, HYUN
Executed: 2018-05-28
Assignee
SMART MODULAR TECHNOLOGIES LX S.A.R.L.
#712, 69, SEONGNAM-DAERO, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Bump of Semiconductor Package
Application: 15/629,234 →
Publication: US 2018/0174990
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 21, 2017
From: PARK, BUM WOOK; JUNG, HYUN
To: SMART MODULAR TECHNOLOGIES LX S.A.R.L; PARK, BUM WOOK; JUNG, HYUN
Reel/Frame 042772/0527 →
Security Agreement Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
Release of Security Interest at Reel 052134 Frame 0717 Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.; SMART MODULAR TECHNOLOGIES (LX) S.À. R.L; SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058963/0661 →