IP Library Granted Patent US 10,321,601
Granted Patent B2
US 10,321,601 · App. 12/580,477 · Granted Jun 11, 2019

System and method for restricting airflow through a portion of an electronics enclosure

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Quick Facts
Patent No.
US 10,321,601
App. No.
12/580,477
Granted
Jun 11, 2019
Kind
B2
Abstract

An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.

Claims (41)

1. An apparatus for restricting air flow through an electronics enclosure having a rear transition module (RTM) disposed therein, the apparatus comprising:

the electronics enclosure;

a removable panel having at least one edge adapted to be secured to a surface of the electronics enclosure to place the panel in a path of a cooling air flow flowing through a rear card cage area within the enclosure containing the RTM, the panel being located external to the rear card cage area within the enclosure and the panel being oriented orthogonally to cards supported by the card cage;

the panel having a footprint that completely fills an opening through which said cooling air flow flows through said rear card cage area of the enclosure such that no portion of the cooling air flow in the rear card cage area flows around the panel; and

the panel being formed as a plate having a plurality of openings selectively arranged therein having all of the cooling air flow flowing through the openings, wherein the openings form a pattern of perforations grouped into spaced apart clusters, the panel reducing a volume of the cooling air flow that is able to flow through the panel by a predetermined desired degree, and thus limits a portion of said cooling air flow flowing to said RTM to a predetermined subquantity of said cooling air flow, and thereby restricting the subquantity of the cooling air flow directed through the rear card cage area such that a greater portion of a total volume of air flow being output from a cooling system of the electronics enclosure is directed through a front board area partitioned by a backplane from the rear card cage area of the electronics enclosure.

2. The apparatus of claim 1 , wherein the openings form a pattern of perforations or slots.

3. The apparatus of claim 1 , wherein the openings are all uniformly shaped.

4. The apparatus of claim 1 , wherein the openings comprise at least one of:

circular shaped holes;

square shaped holes;

triangular shaped holes;

diamond shaped holes;

elliptical shaped holes;

hexagonal shaped holes; and

pentagonal shaped holes.

5. The apparatus of claim 1 , wherein the panel is secured adjacent one of:

an upper area of the card cage; and

a lower area of the card cage.

6. A method for restricting air flow through a portion of an electronics enclosure, the method comprising:

forming a removable panel having at least one edge adapted to be secured to a surface of the electronics enclosure to place the panel in a path of a cooling air flow flowing through a card cage portion of the enclosure, the panel being located external to the card cage portion of the enclosure;

further forming the panel to have a footprint that completely fills an opening through which said cooling air flow flows through said card cage portion of the enclosure;

forming the panel as a plate having a plurality of openings in the panel having all of the cooling air flow flowing through the openings, wherein the openings form a pattern of perforations grouped into spaced apart clusters, the panel openings restricting a volume of cooling air flow flowing through the panel by a predetermined degree, and thus allowing only a predetermined subportion of said volume of cooling airflow to flow through the panel into the card cage portion of the enclosure; and

placing the panel in the enclosure in the path of the cooling air flow so as to at least partially block the cooling air flow flowing through the card cage portion of the electronics enclosure, wherein the panel restricts a subquantity of the cooling air flow directed through a rear board area of the electronics enclosure such that a greater portion of a total volume of the cooling air flow output from a cooling system of the electronics enclosure is directed through a front board area of the electronics enclosure, wherein the rear board area is separated from the front board are by a backplane.

7. The method of claim 6 , wherein said forming a plurality of openings in the panel comprises forming a plurality of groups of perforations in the panel.

8. The method of claim 6 , wherein said forming a plurality of openings in the panel comprises forming one or more slots in the panel.

9. The method of claim 6 , wherein said forming a plurality of openings in the panel comprises forming openings having at least one of:

circular shaped holes;

square shaped holes;

triangular shaped holes;

diamond shaped holes;

elliptical shaped holes;

hexagonal shaped holes; and

pentagonal shaped holes.

10. An electronics enclosure, comprising:

a first card cage area being a front card cage area located within the electronics enclosure;

a second card cage area being a rear card cage area located within the electronics enclosure, the first card cage area and second card cage area being separated by a backplane;

an air flow source providing air flow to the first card cage area and to the second card cage area; and

a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to place the panel in a path of a cooling air flow flowing through a selected card cage area of the second card cage area;

the panel having a footprint that completely fills an opening through which said cooling air flow flows through the selected one card cage area;

the panel being formed as a plate having a plurality of openings, wherein the openings form a pattern of perforations grouped into spaced apart clusters, so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of said air flow through the selected card cage area to a desired volume, the panel footprint in substantially filling the opening thereby preventing the cooling air flow from flowing around the panel such that no portion of the cooling air flow in the selected card cage area flows around the panel thereby forcing all of the cooling air flow through the openings; and

the panel being arranged so that the panel restricts the cooling air flow flowing through the selected card cage area, while the cooling air flow flowing through the other of the first card cage area or the second card cage area is increased as a result of the restriction of the cooling air flow to the one of the first area or the second area.

Assignments (13)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2022
From: BANK OF AMERICA, N.A., AS AGENT
To: SMART EMBEDDED COMPUTING INC. (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
Reel/Frame 058913/0421 →
RELEASE OF SECURITY INTEREST AT REEL 052134 FRAME 0717 Recorded Feb 7, 2022
From: BARCLAYS BANK PLC
To: SMART MODULAR TECHNOLOGIES, INC.; SMART MODULAR TECHNOLOGIES (LX) S.À. R.L; SMART EMBEDDED COMPUTING, INC.
Reel/Frame 058963/0661 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
SECURITY INTEREST Recorded Mar 3, 2021
From: SMART EMBEDDED COMPUTING, INC., (F/K/A ARTESYN EMBEDDED COMPUTING, INC.)
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 055481/0435 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
SECURITY AGREEMENT Recorded Mar 10, 2020
From: SMART MODULAR TECHNOLOGIES (LX) S.À.R.L.; SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.
To: BARCLAYS BANK PLC
Reel/Frame 052134/0717 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →