IP Library Granted Patent US 7,298,614
Granted Patent B2
US 7,298,614 · App. 11/287,766 · Granted Nov 20, 2007

Telco hub and method

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Quick Facts
Patent No.
US 7,298,614
App. No.
11/287,766
Granted
Nov 20, 2007
Kind
B2
Abstract

A telco hub in a chassis having a front side and a rear side, where the chassis includes a midplane having a first side and a second side, the telco hub includes an interposer module coupled to slidably insert into a switch slot on the rear side and connect to the second side of the midplane, a mezzanine module coupled to the interposer module, where the mezzanine module includes a telco I/O interface, where the mezzanine module is coupled to receive non-packetized telephony data. The telco hub is coupled to convert the non-packetized telephony data to packetized data, and communicate the packetized data to one or more of a plurality of payload modules over a switched fabric on the midplane, where each of the one or more payload modules is coupled to the first side of the midplane via a payload slot on the front side of the chassis.

Claims (42)

1. A computer system, comprising:

a chassis having a front side and a rear side, wherein the front side is opposite the rear side;

a midplane having a first side and a second side;

a plurality of payload slots on the front side, wherein each of the plurality of payload slots is coupled to receive and connect a payload module to the first side of the midplane;

a plurality of switch slots on the rear side, wherein each of the plurality of switch slots is coupled to receive and connect a switch module to the second side of the midplane;

an interposer module coupled to slidably insert into the switch slot and connect to the second side of the midplane; and

a mezzanine module coupled to the interposer module, wherein the mezzanine module includes a telco I/O interface.

2. The computer system of claim 1 , wherein the mezzanine module is an Advanced Mezzanine Card (AMC) module.

3. The computer system of claim 1 , wherein the interposer module comprises a switch.

4. The computer system of claim 1 , wherein the telco I/O interface is coupled to receive non-packetized telephony data.

5. The computer system of claim 4 , wherein the non-packetized telephony data is converted to packetized data and transmitted over the midplane to one or more of the payload module.

6. The computer system of claim 4 , wherein the non-packetized telephony data is delivered to a switched fabric directly though the mezzanine module and the interposer module.

7. The computer system of claim 1 , wherein the chassis is a BladeCenter chassis.

8. The computer system of claim 1 , wherein the I/O interface comprises a PSTN interface.

9. The computer system of claim 8 , wherein the PSTN interface consists of at least one of T1/E1/J1 interface, T2/J2 interface, T3/E3/J3 interface, OC-n DS3 interface, optical ATM interface, channelized STM-n interface and channelized STM-nc interface.

10. A method of processing non-packetized telephony data, comprising:

providing a chassis having a front side and a rear side, wherein the front side is opposite the rear side;

providing a midplane having a first side and a second side;

receiving the non-packetized telephony data at a telco I/O interface of a mezzanine module, wherein the mezzanine module is mounted to an interposer module, and wherein the interposer module is coupled to the second side of the midplane via a switch slot on the rear side of the chassis;

converting the non-packetized telephony data to packetized data;

communicating the packetized data to one or more of a plurality of payload modules over a switched fabric on the midplane, wherein each of the one or more plurality of payload modules is coupled to the first side of the midplane via a payload slot on the front side of the chassis;

the one or more plurality of payload modules processing the packetized data, thereby forming processed packetized data;

communicating the processed packetized data to the mezzanine module over the switched fabric on the midplane;

converting the processed packetized data to processed non-packetized telephony data; and

transmitting the processed non-packetized telephony data external to the chassis via the telco I/O interface of the mezzanine module.

11. The method of claim 10 , wherein the mezzanine module is an Advanced Mezzanine Card (AMC) module.

12. The method of claim 10 , further comprising communicating the non-packetized telephony data to the switched fabric directly though the mezzanine module and the interposer module.

13. The method of claim 10 , wherein the chassis is a BladeCenter chassis.

14. The method of claim 10 , wherein the I/O interface comprises a PSTN interface.

15. The method of claim 14 , wherein the PSTN interface consists of at least one of T1/E1/J1 interface, T2/J2 interface, T3/E3/J3 interface, OC-n DS3 interface, optical ATM interface, channelized STM-n interface and channelized STM-nc interface.

16. A telco hub in a chassis having a front side and a rear side, wherein the chassis includes a midplane having a first side and a second side, the telco hub, comprising:

an interposer module coupled to slidably insert into a switch slot on the rear side and connect to the second side of the midplane;

a mezzanine module coupled to the interposer module, wherein the mezzanine module includes a telco I/O interface, wherein the mezzanine module is coupled to receive non-packetized telephony data and wherein the telco hub is coupled to:

convert the non-packetized telephony data to packetized data; and

communicate the packetized data to one or more of a plurality of payload modules over a switched fabric on the midplane, wherein each of the one or more plurality of payload modules is coupled to the first side of the midplane via a payload slot on the front side of the chassis.

17. The telco hub of claim 16 , wherein the non-packetized telephony data is communicated to the switched fabric directly though the mezzanine module and the interposer module.

18. The telco hub of claim 16 , wherein the mezzanine module is an Advanced Mezzanine Card (AMC) module.

19. The telco hub of claim 16 , wherein the chassis is a BladeCenter chassis.

20. The telco hub of claim 16 , wherein the I/O interface comprises a PSTN interface.

21. The telco hub of claim 20 , wherein the PSTN interface consists of at least one of T1/E1/J1 interface, T2/J2 interface, T3/E3/J1 interface, OC-n DS3 interface, optical ATM interface, channelized STM-n interface and channelized STM-nc interface.

22. The telco hub of claim 16 , wherein the interposer module comprises a switch.

23. The telco hub of claim 16 , wherein the interposer module maps power and IPMI messages from the chassis to the mezzanine module.

Assignments (11)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
CHANGE OF NAME Recorded Jun 24, 2020
From: ARTESYN EMBEDDED COMPUTING, INC.
To: SMART EMBEDDED COMPUTING, INC.
Reel/Frame 053023/0953 →
CHANGE OF NAME Recorded Jun 18, 2020
From: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: ARTESYN EMBEDDED COMPUTING, INC.
Reel/Frame 052978/0634 →
RELEASE OF SECURITY INTEREST Recorded Jul 9, 2019
From: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049698/0222 →
PARTIAL RELEASE OF SECURITY INTEREST Recorded Jul 8, 2019
From: BANK OF AMERICA, N.A.
To: ARTESYN EMBEDDED COMPUTING, INC. (F/K/A EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.)
Reel/Frame 049694/0096 →
SECURITY AGREEMENT Recorded Nov 26, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031731/0048 →
SECURITY AGREEMENT Recorded Nov 25, 2013
From: ARTESYN TECHNOLOGIES, INC.; ARTESYN NORTH AMERICA LLC; EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT AND GRANTEE
Reel/Frame 031719/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: MOTOROLA, INC.
To: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
Reel/Frame 020540/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2005
From: HALLIDAY, DAVID J.; CARR, BRIAN A.; MOAKES, PAUL A.
To: MOTOROLA, INC.
Reel/Frame 017288/0488 →