Stabilized fluoride phosphor for light emitting diode (LED) applications
A stabilized fluoride phosphor for light emitting diode (LED) applications includes a particle comprising manganese-activated potassium fluorosilicate and an inorganic coating on each of the particles. The inorganic coating comprises a silicate. A method of making a stabilized fluoride phosphor comprises forming a reaction mixture that includes particles comprising a manganese-activated potassium fluorosilicate; a reactive silicate precursor; a catalyst; a solvent; and water in an amount no greater than about 10 vol. %. The reaction mixture is agitated to suspend the particles therein. As the reactive silicate precursor undergoes hydrolysis and condensation in the reaction mixture, an inorganic coating comprising a silicate is formed on the particles. Thus, a stabilized fluoride phosphor is formed.
1. A stabilized salt comprising:
particles comprising a water-soluble salt;
an inorganic coating on each of the particles, the inorganic coating comprising a silicate, and
a fluoride coating under the inorganic coating.
2. The stabilized salt of claim 1 , wherein the silicate comprises SiO x , where 0.5≤x≤2.5.
3. The stabilized salt of claim 1 having a chemical formula A x B y C z , where x is from about 1 to about 2, y is from about 1 to about 2, and z is about 6, and where A is selected from Na, Cs, Ca, Sr, and Ba, B is selected from Si, Ge, Sn, Ti, and Al, and C is selected from F and Cl.
4. The stabilized salt of claim 1 , wherein the water-soluble salt is selected from the group consisting of: NaCl, Na 2 SiF 6 , KF, K 2 TiF 6 , Rb 2 SiF 6 , Cs 2 GeF 6 , Cs 2 SiF 6 , Cs 2 MnF 6 , Cs 2 SnF 6 , and MgCl 2 .
5. The stabilized salt of claim 1 , wherein the water-soluble salt comprises K 2 SiF 6 .
6. The stabilized salt of claim 5 , wherein the K 2 SiF 6 includes a manganese activator, the stabilized salt being a stabilized fluoride phosphor.
7. The stabilized salt of claim 1 , wherein the inorganic coating comprises a thickness in a range from about 5 nm to about 2 microns.
8. The stabilized salt of claim 7 , wherein the thickness is in the range from about 0.1 micron to about 2 microns.
9. The stabilized salt of claim 1 , wherein the inorganic coating further comprises Si—OH groups.
10. The stabilized salt of claim 1 , wherein the silicate comprises a multicomponent silicate including aluminum, boron, and/or titanium.
11. The stabilized salt of claim 1 , wherein the inorganic coating further comprises an oxide of aluminum, boron, and/or titanium.
12. The stabilized salt of claim 1 , wherein the inorganic coating further comprises carbon.
13. The stabilized salt of claim 1 , wherein the inorganic coating further comprises nitrogen or sulfur.
14. The stabilized salt of claim 1 , wherein the particles have a nominal size in a range from about 5 microns to about 30 microns.