IP Library Granted Patent US 8,957,430
Granted Patent B2
US 8,957,430 · App. 13/369,996 · Granted Feb 17, 2015

Gel underfill layers for light emitting diodes

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Quick Facts
Patent No.
US 8,957,430
App. No.
13/369,996
Granted
Feb 17, 2015
Kind
B2
Abstract

A light emitting device is fabricated by providing a mounting substrate and an array of light emitting diode dies adjacent the mounting substrate to define gaps. A gel that is diluted in a solvent is applied on the substrate and on the array of light emitting dies. At least some of the solvent is evaporated so that the gel remains in the gaps, but does not completely cover the light emitting diode dies. For example, the gel substantially recedes from the substrate beyond the array of light emitting diode dies and also substantially recedes from an outer face of the light emitting diode dies. Related light emitting device structures are also described.

Claims (31)

1. A light emitting device comprising:

a mounting substrate;

an array of light emitting diode dies adjacent the mounting substrate;

an array of bond regions, a respective one of which connects a respective light emitting diode die to the mounting substrate, a respective bond region being recessed from an edge of a respective light emitting diode die to define a respective gap between a respective light emitting diode die and the mounting substrate that is adjacent thereto; and

a gel layer on the mounting substrate that fills the gaps between the light emitting diode dies and the substrate adjacent thereto but does not completely cover the light emitting diode dies;

wherein the gel layer also extends between adjacent light emitting diode dies in the array.

2. A light emitting device comprising:

a mounting substrate;

an array of light emitting diode dies adjacent the mounting substrate to define a gap between a respective light emitting diode die and the mounting substrate that is adjacent thereto; and

a gel layer on the mounting substrate that extends at least partially in the gaps between the light emitting diode dies and the substrate adjacent thereto but does not completely cover the light emitting diode dies;

wherein the gel layer also extends between adjacent light emitting diode dies in the array.

3. A light emitting device according to claim 2 wherein the gel layer does not extend on the substrate substantially beyond the array of light emitting diode dies and also does not extend substantially on an outer face of the light emitting diode dies.

4. A light emitting device according to claim 3 wherein the gel does not extend on reflective areas of the substrate substantially beyond the array of light emitting diode dies.

5. A light emitting device according to claim 2 further comprising a phosphor layer directly on the substrate that extends beyond the array of light emitting diode dies and that also extends directly on the outer faces of the light emitting diode dies.

6. A light emitting device according to claim 2 further comprising a lens that spans the array of light emitting diode dies and that extends directly on the substrate beyond the array of light emitting diode dies and directly on the outer faces of the light emitting diode dies.

7. A light emitting device comprising:

a mounting substrate;

an array of light emitting diode dies adjacent the mounting substrate to define a gap between a respective light emitting diode die and the mounting substrate that is adjacent thereto; and

a gel layer on the mounting substrate that extends at least partially in the gaps between the light emitting diode dies and the substrate adjacent thereto but does not completely cover the light emitting diode dies;

wherein the gel layer does not extend on the substrate substantially beyond the array of light emitting diode dies and also does not extend substantially on an outer face of the light emitting diode dies, and

wherein the gel layer also extends at least partially on sidewalls of the light emitting diode dies.

8. A light emitting device comprising:

a mounting substrate;

a light emitting diode die adjacent the mounting substrate to define a gap between the light emitting diode die and the mounting substrate that is adjacent thereto; and

a gel layer on the mounting substrate that extends at least partially in the gap between the light emitting diode die and the substrate adjacent thereto but does not completely cover the light emitting diode die;

wherein the gel layer does not extend on the substrate substantially beyond the light emitting diode die and also does not extend substantially on an outer face of the light emitting diode die, and

wherein the gel layer also extends at least partially on sidewalls of the light emitting diode die.

9. A light emitting device according to claim 8 wherein the gel layer fills the gap.

10. A light emitting device according to claim 8 further comprising a phosphor layer directly on the substrate beyond the light emitting diode die and directly on the outer face of the light emitting diode die.

11. A light emitting device according to claim 8 further comprising a lens that spans the light emitting diode die and that extends directly on the substrate beyond the light emitting diode die and directly on the outer face of the light emitting diode die.

12. A light emitting device according to claim 8 wherein the gel does not extend on reflective areas of the substrate substantially beyond the light emitting diode die.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →