Structures and substrates for mounting optical elements and methods and devices for providing the same background
View Patent ↗Methods are disclosed including generating a substrate surface topography that includes a mounting portion that is higher than a relief portion that defines a perimeter of the mounting portion.
1. A light emitting structure, comprising:
a semiconductor light emitting diode (LED) comprising a first surface and a second surface that is substantially opposite the first surface;
an encapsulant that is a conformal layer directly on the LED and including ledges that extend from the perimeter of the LED; and
a mounting structure that includes a cavity around a mounting surface,
wherein the ledges of the encapsulant extend over a portion of the cavity without extending therein.
2. The light emitting structure according to claim 1 ,
wherein the first surface includes a light emitting surface and wherein the second surface includes a mounting surface that is at a height below a height of the light emitting surface.
3. The light emitting structure according to claim 1 , wherein the encapsulant includes a plurality of light conversion particles.
4. The light emitting structure according to claim 3 , wherein at least one of the plurality of light conversion materials includes a phosphor particle.
5. The light emitting structure according to claim 1 ,
wherein the LED has a first coefficient of thermal expansion and the encapsulant has a second coefficient of thermal expansion that is greater than the first coefficient of thermal expansion, and
wherein the cavity is configured to provide relief corresponding to thermal expansion of the conformal layer.
6. The light emitting structure according to claim 1 , wherein the encapsulant comprises phosphor particles and a binder material.