Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
View Patent ↗Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays are disclosed. In one aspect, an LED chip can include a body with an anode and a cathode in the form of electrically conductive bond pads. The anode and cathode can be configured to electrically communicate with more than two electrical components via electrical connectors.
1. A light emitting diode (LED) chip comprising:
a chip body comprising an anode and a cathode in the form of electrically conductive bond pads; and
wherein the anode or the cathode is configured to electrically communicate with more than two electrical components via electrical connectors, and wherein at least one of the two electrical components comprises a same electrical polarity as the anode or the cathode to which it is connected.
2. The LED chip of claim 1 , wherein the anode and cathode are disposed on a same surface of the body.
3. The LED chip of claim 1 , wherein the anode comprises a single bond pad and the cathode comprises a plurality of bond pads.
4. The LED chip of claim 3 , wherein each bond pad of the plurality of bond pads is configured to electrically communicate with a different electrical component via electrical connectors.
5. The LED chip of claim 3 , wherein the plurality of bond pads comprises a first bond pad, a second bond pad, and a third bond pad.
6. The LED chip of claim 1 , wherein the LED chip is configured to emit red, green, or blue light.
7. The LED chip of claim 1 , wherein the electrical components are selected from the group consisting of an adjacent LED chip, a first electrical terminal, and a second electrical terminal.
8. The LED chip of claim 1 , wherein the electrical connectors comprise wirebonds.
9. The LED chip of claim 1 , further comprising an active area, where the active area does not extend equally in length as measured from an edge of the LED chip.
10. The LED chip of claim 1 , further comprising a first side, a second side, a third side, and a fourth side, where at least one electrical connector is configured to extend from each of the first, second, third, and fourth sides, respectively, to an adjacent electrical component.
11. The LED chip of claim 10 , where at least one electrical connector extending from any of the first, second, third, and fourth sides is orthogonal with respect to another electrical connector.
12. A lighting device incorporating a plurality of the LED chips of claim 1 in an array.
13. A light emitting device comprising:
a submount; and
at least one light emitting diode (LED) chip selectively positioned at one of several locations over the submount, the at least one LED comprising:
a chip body comprising an anode and a cathode in the form of electrically conductive bond pads;
wherein either one of the anode or the cathode comprises a plurality of bond pads that are configured to electrically communicate with more than two electrical components via electrical connectors.
14. The device of claim 13 , wherein the anode and cathode are disposed on a same surface of the LED chip.
15. The device of claim 13 , wherein the anode comprises a single bond pad and the cathode comprises the plurality of bond pads.
16. The device of claim 15 , wherein each bond pad of the plurality of bond pads is configured to electrically communicate with a different electrical component via electrical connectors.
17. The device of claim 15 , wherein the plurality of bond pads comprises a first bond pad, a second bond pad, and a third bond pad.
18. The device of claim 13 , wherein the LED chip is configured to emit red, green, or blue light.
19. The device of claim 13 , wherein the electrical components are selected from the group consisting of an adjacent LED chip, a first electrical terminal, and a second electrical terminal.
20. The device of claim 13 , wherein the electrical connectors are wirebonds.
21. The device of claim 20 , further comprising a plurality of LED chips electrically connected in an array.
22. The device of claim 21 , wherein the array comprises a combination LED chips electrically connected in series and parallel.
23. The device of claim 21 , wherein the array comprises at least a first LED chip electrically connected to four other adjacent LED chips.
24. The device of claim 23 , wherein the first LED chip comprises a first side, a second side, a third side, and a fourth side, where at least one wirebond is configured to extend from each of the first, second, third, and fourth sides, respectively, to electrically connect to the four other adjacent LED chips.
25. The device of claim 24 , where the at least one wirebond extending from any of the first, second, third, and fourth sides is orthogonal with respect to another wirebond extending from a different side.
26. The device of claim 21 , where the array comprises a plurality of rows and a plurality of columns, where a first row is electrically connected in parallel with a second row of the plurality of rows.
27. The device of claim 21 , where the array comprises a plurality of rows and a plurality of columns of LED chips electrically connected in series, where a first column is electrically connected in parallel with a second column of the plurality of columns.
28. The device of claim 13 , further comprising a retention material dispensed over the submount and at least partially over the electrical connectors.
29. The device of claim 13 , further comprising a filling material disposed over the at least one LED chip.
30. The device of claim 29 , wherein the filling material comprises an encapsulant having a selective amount of phosphors contained therein in an amount suitable for producing a desired color point or light emission.