Patent Assignment
Reel/Frame 055780/0121
Assignment of Assignor's Interest
Recorded: 2021-03-31
Pages: 242
Assignor
CREE, INC.
Executed: 2021-03-01
Assignee
CREELED, INC.
39870 EUREKA DRIVE, NEWARK, CALIFORNIA, 94560
Covered Properties
(159)
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Led Package Die Having a Small Footprint
Composite Leadframe Led Package and Method of Making the Same
Composite Optical Lens with an Integrated Reflector
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Led Package Die Having a Small Footprint
Led Package with Flexible Polyimide Circuit and Method of Manufacturing Led Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Light Emitting Device Packages, Light Emitting Diode (Led) Packages and Related Methods
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Solid State Lighting Device
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Light Emitting Device Packages with Improved Heat Transfer
Led Package with Efficient, Isolated Thermal Path
Power Surface Mount Light Emitting Die Package
Solid State Lighting Devices and Methods
Patent:
8,686,445 →
Application:
12/969,267 →
Light Emitting Diode (Led) Devices, Systems, and Methods
Multiple Configuration Light Emitting Devices and Methods
Light Emitting Device Packages, Systems and Methods
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Light Emitting Devices for Light Emitting Diodes (Leds)
Solid State Lighting Device
Light Emitting Device Array Assemblies and Related Methods
Light Emitting Devices
Light Emitting Die (Led) Packages and Related Methods
Light Emitting Devices, Systems, and Methods
Light Emitting Devices and Methods
Attachment Devices and Methods for Light Emitting Devices
Light Emitting Diode (Led) Packages and Related Methods
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Light Emitter Devices and Methods, Utilizing Light Emitting Diodes (Leds), for Improved Light Extraction
Light Emitter Devices and Methods with Reduced Dimensions and Improved Light Output
Light Emitting Devices
High Brightness Light Emitting Diode (Led) Packages, Systems and Methods with Improved Resin Filling and High Adhesion
Light Emitter Device Packages, Modules and Methods
Components and Methods for Light Emitting Diode (Led) Lighting
Light Emitting Devices for Light Emitting Diodes (Leds)
Ceramic-Based Light Emitting Diode (Led) Devices, Components and Methods
Multi-Die Led Package
Light Emitter Devices Having Improved Chemical and Physical Resistance and Related Methods
Light Emitter Devices Having Improved Light Output and Related Methods
Light Emitting Diode (Led) Packages, Systems, Devices and Related Methods
Power Surface Mount Light Emitting Die Package
Light Emitter Device Packages, Components, and Methods for Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods Having Improved Performance
Light Emitter Packages and Devices Having Improved Wire Bonding and Related Methods
Led Package with Efficient, Isolated Thermal Path
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Light Emitter Devices and Components with Improved Chemical Resistance and Related Methods
Light Emitter Packages, Systems, and Methods
Electrical Connectors and Light Emitting Device Package and Methods of Assembling the Same
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Light Emitting Devices and Packages and Related Methods with Electrode Marks on Leads
Light Emitter Components and Methods Having Improved Performance
Light Emitter Packages and Methods
Light Emitting Diode (Led) Chips and Devices for Providing Failure Mitigation in Led Arrays
Multi-Chip Light Emitter Packages and Related Methods
Multi-Chip Light Emitter Packages and Related Methods
Light Emitter Components and Methods Having Improved Electrical Contacts
Submount Based Surface Mount Device (Smd) Light Emitter Components and Methods
Light Emitting Devices and Substrates with Improved Plating
Submount Based Light Emitter Components and Methods
Substrate Based Light Emitter Devices, Components, and Related Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Ceramic-Based Light Emitting Diode (Led) Devices, Components, and Methods
Light Emitter Components, Systems, and Related Methods
Connector Devices, Systems, and Related Methods for Light Emitter Components
Power Light Emitting Die Package with Reflecting Lens and the Method of Making the Same
Method of Providing Light Emitting Device
Solid State Lighting Device
Light Emitter Devices and Methods for Light Emitting Diode (Led) Chips
Light Emitting Devices for Light Emitting Diodes (Leds)
Light Emitting Devices for Light Emitting Diodes (Leds)
Light Emitting Devices for Light Emitting Diodes (Leds)
Light Emitter Devices
High Voltage Array Light Emitting Diode (Led) Devices and Fixtures
Ceramic Based Light Emitting Diode (Led) Devices and Methods
Multiple Voltage Light Emitter Packages, Systems, and Related Methods
Submount Based Light Emitter Components and Methods
Submount Based Light Emitter Components and Methods
Solder Pads, Methods, and Systems for Circuitry Components
Light Emitting Diode (Led) Components and Methods
Leadframe Based Light Emitter Components and Related Methods
Solid State Lighting Apparatuses, Systems, and Related Methods
Solid State Light Emitter Devices and Methods
Voltage Configurable Solid State Lighting Apparatuses, Systems, and Related Methods
Solid State Lighting Apparatuses with Non-Uniformly Spaced Emitters for Improved Heat Distribution, Sysytem Having the Same, and Methods Having the Same
Light Emitting Diodes and Methods with Encapsulation
Solid State Lighting Components
Light Emitter Components and Related Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diode (Led) Devices, Components and Methods
Substrates for Light Emitting Diodes and Related Methods
Tunable Integrated Optics Led Components and Methods
Led Apparatuses and Methods for High Lumen Output Density
Light Emitting Diodes and Methods
Light Emitting Diodes, Components and Related Methods
Light Emitting Diodes, Components and Related Methods
Configurable Circuit Layout for Leds
Light Emitting Diodes, Components and Related Methods
Light Emitting Diode (Led) Components and Methods
Apparatus and Methods for Mass Transfer of Electronic Die
Led Apparatuses and Methods
Patent:
10,453,827 →
Application:
15/993,540 →
Led Systems, Apparatuses, and Methods
Led Device, System, and Method with Adaptive Patterns
Light Emitting Devices and Components Having Improved Chemical Resistance and Related Methods
Tunable Integrated Optics Led Components and Methods
Light Emitting Diode (Led) Components and Methods
Apparatus and Methods for Mass Transfer of Electronic Die
Solid State Lighting Components
Tunable Integrated Optics Led Components and Methods
Light Emitting Diode
Patent:
608,307 →
Application:
29/323,659 →
Light Emitting Diode
Patent:
621,799 →
Application:
29/330,657 →
Led Chip
Patent:
635,525 →
Application:
29/335,819 →
Light Emitting Diode
Patent:
641,719 →
Application:
29/338,186 →
Light Emitting Diode
Patent:
614,592 →
Application:
29/342,451 →
Light Emitting Diode
Patent:
635,527 →
Application:
29/353,652 →
Light Emitting Diode (Led) Package
Patent:
648,686 →
Application:
29/360,791 →
Package for Light Emitting Diode (Led) Lighting
Patent:
643,819 →
Application:
29/365,939 →
Light Emitting Device Package
Patent:
650,760 →
Application:
29/379,636 →
Light Emitting Device Package
Patent:
676,000 →
Application:
29/380,387 →
Light Emitting Device Package
Patent:
648,687 →
Application:
29/380,549 →
High Brightness Led Package
Patent:
679,842 →
Application:
29/382,394 →
Multiple Configuration Light Emitting Device Package
Patent:
650,343 →
Application:
29/384,476 →
Led Chip
Patent:
691,569 →
Application:
29/388,240 →
Package for Light Emitting Diode (Led) Lighting
Patent:
667,801 →
Application:
29/397,017 →
Light Emitting Diode (Led) Package
Patent:
659,657 →
Application:
29/401,692 →
Light Emitting Device Package
Patent:
661,264 →
Application:
29/403,433 →
Light Emitting Device Component
Patent:
702,653 →
Application:
29/404,913 →
Light Emitting Device Package
Patent:
667,803 →
Application:
29/407,084 →
Light Emitting Device Package
Patent:
676,395 →
Application:
29/408,955 →
Light Emitting Device Component
Patent:
705,181 →
Application:
29/412,166 →
Light Emitting Device
Patent:
707,192 →
Application:
29/412,168 →
Light Emitting Device
Patent:
706,231 →
Application:
29/417,220 →
Led-Array Package
Patent:
703,624 →
Application:
29/417,704 →
Light Emitting Diode (Led) Package
Patent:
709,464 →
Application:
29/423,422 →
Light Emitter Device
Patent:
721,339 →
Application:
29/425,831 →
Light Emitter Device
Patent:
753,612 →
Application:
29/431,542 →
Package for Light Emitting Diode (Led) Lighting
Patent:
708,156 →
Application:
29/432,988 →
Light Emitter Package
Patent:
704,154 →
Application:
29/433,842 →
Light Emitting Diode (Led) Package
Patent:
749,051 →
Application:
29/439,629 →
Light Emitting Diode (Led) Package
Patent:
738,832 →
Application:
29/444,591 →
Light Emitter Device
Patent:
712,850 →
Application:
29/451,177 →
High Brightness Led Package
Patent:
704,358 →
Application:
29/451,761 →
Light Emitting Unit
Patent:
738,542 →
Application:
29/452,692 →
Light Emitter Unit
Patent:
739,565 →
Application:
29/459,231 →
Light Emitter Unit
Patent:
740,453 →
Application:
29/459,233 →
Led Package
Patent:
746,240 →
Application:
29/478,014 →
Light Emitting Device Component
Patent:
736,725 →
Application:
29/487,954 →
Solid State Light Emitter Component
Patent:
778,848 →
Application:
29/523,168 →
Light Emitting Device
Patent:
823,492 →
Application:
29/579,906 →
Light Emitting Device
Patent:
851,790 →
Application:
29/616,841 →
Light Emitting Device
Patent:
890,961 →
Application:
29/689,497 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2016
From: LOH, BAN P.
To: CREE, INC.
Reel/Frame 040276/0724 →
Assignment of Assignor's Interest
Jun 19, 2018
From: WELCH, ERIN R. F.; BLAKELY, COLIN KELLY
To: CREE, INC.
Reel/Frame 046129/0913 →
Assignment of Assignor's Interest
Dec 21, 2018
From: REIHERZER, JESSE COLIN; BLAKELY, COLIN KELLY; HARRELL, SAMUEL RICHARD, JR.; WELCH, ERIN R.F.
To: CREE, INC.
Reel/Frame 047840/0802 →
Assignment of Assignor's Interest
Jan 28, 2021
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 055061/0336 →
Assignment of Assignor's Interest
Feb 23, 2021
From: ANDREWS, PETER SCOTT; LOH, BAN P.
To: CREE, INC.
Reel/Frame 055373/0052 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →