IP Library Granted Patent US 11,430,769
Granted Patent B2
US 11,430,769 · App. 17/092,939 · Granted Aug 30, 2022

Tunable integrated optics LED components and methods

Inventors: Troy Gould (Raleigh, NC); Colin Kelly Blakely (Raleigh, NC); Jesse Colin Reiherzer (Raleigh, NC); Joseph G. Clark (Raleigh, NC)
Assignee: CreeLED, Inc.
H01L25/075H01L33/502H01L33/54H01L33/58H01L33/60H01L33/62H01L33/46H01L2933/0058
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Quick Facts
Patent No.
US 11,430,769
App. No.
17/092,939
Granted
Aug 30, 2022
Kind
B2
Abstract

Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

Claims (24)

1. A light emitting diode (LED) apparatus, comprising:

a substrate;

one or more light emitting diodes (LEDs) disposed over the substrate;

a light-transmissive encapsulation material disposed over the one or more LEDs; and

a black material disposed on or over a portion of the encapsulation material such that the black material defines an opening where the encapsulation material is not covered by the black material, and wherein the opening comprises an area smaller than an area of the encapsulation material at the substrate.

2. The LED apparatus of claim 1 , wherein the encapsulation material is molded.

3. The LED apparatus of claim 2 , wherein the molded encapsulation material is formed in a conical, dome, hemispherical, bullet, or pyramidal shape.

4. The LED apparatus of claim 1 , wherein the encapsulation material and the black material extend to the edges of the substrate and form a continuous surface with the substrate.

5. The LED apparatus of claim 1 , wherein the opening area is greater than a surface area of the one or more LEDs.

6. The LED apparatus of claim 1 , wherein the opening area is substantially a same size as a surface area of the one or more LEDs.

7. The LED apparatus of claim 1 , wherein the opening area is smaller than a surface area of the one or more LEDs.

8. The LED apparatus of claim 1 , wherein the black material comprises a material to act as a reflective surface.

9. The LED apparatus of claim 1 , wherein a portion of the black material is removed from a region of the encapsulation material to result in an increased size of the opening.

10. The LED apparatus of claim 1 , comprising a plurality of LEDs, wherein the plurality of LEDs are configured to emit light that is a same color or different colors.

11. A light emitting diode (LED) apparatus, comprising:

a substrate;

one or more light emitting diodes (LEDs) disposed over the substrate;

a light-transmissive encapsulation material disposed on or over the one or more LEDs; and

a black material disposed against one or more lateral surface of the encapsulation material and in contact with the substrate such that the black material forms wall along the one or more lateral surfaces of the encapsulation material and at least a portion of the encapsulation material is arranged between the black material and the substrate in a vertical direction from the substrate.

12. The LED apparatus of claim 11 , wherein the encapsulation material is molded.

13. The LED apparatus of claim 11 , wherein the encapsulation material is formed at least partially in a dome or pyramidal shape disposed asymmetrically over the substrate.

14. The LED apparatus of claim 11 , wherein the encapsulation material and the black material extend to the edges of the substrate and form a continuous surface with the substrate.

15. The LED apparatus of claim 11 , wherein a portion of the wall of the black material is substantially perpendicular to the substrate.

16. The LED apparatus of claim 11 , comprising a plurality of LEDs, wherein the plurality of LEDs are configured to emit light that is a same color or different colors.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2020
From: GOULD, TROY; BLAKELY, COLIN KELLY; REIHERZER, JESSE COLIN; CLARK, JOSEPH G.
To: CREE, INC.
Reel/Frame 054320/0380 →