Power surface mount light emitting die package
View Patent ↗A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.
1. A light emitting die package, comprising:
a substrate having traces,
a light emitting diode (LED) mounted on the substrate and connected to the traces,
an encapsulant covering the LED, and
a lens sitting on and adhering to the encapsulant and substantially covering the LED, the lens free to move relative to the substrate.
2. The package of claim 1 , wherein the lens contacts only the encapsulant.
3. The package of claim 1 , wherein the encapsulant is composed of an optically clear polymer material.
4. The package of claim 1 , wherein the substrate is an electrically insulating material having high thermal conductivity.
5. The package of claim 1 , wherein
the LED sits on a mounting pad, and
at least one trace extends from the mounting pad to a side of the substrate.
6. The package of claim 2 , further comprising:
a reflector plate coupled to the substrate and substantially surrounding the mounting pad, the reflector plate defining a reflection surface.
7. The package of claim 6 , wherein the substrate includes flanges along at least one side for mechanically engaging the reflector plate.
8. The package of claim 6 , wherein the reflector plate is composed of a material having high thermal conductivity.
9. The package of claim 6 , wherein the reflector plate includes a plurality of legs, with at least one leg mechanically engaging the substrate for increased thermal transfer.
10. The package of claim 6 , wherein the reflector plate and substrate serve as heat sinks for dissipating heat generated by the LED.
11. A light emitting die package, comprising:
a substrate including traces for connecting to an LED chip on the substrate, and
an encapsulant covering the LED chip, and
a lens covering the LED chip and sitting on and adhering to the encapsulant, the lens free to move as the encapsulant expands and contracts.
12. The package of claim 11 , wherein the lens contacts only the encapsulant.
13. The package of claim 11 , wherein the encapsulant is composed of an optically clear polymer material.
14. The package of claim 11 , wherein the substrate is an electrically insulating material having high thermal conductivity.
15. The package of claim 11 , further comprising:
a reflector plate on the substrate and having a circular opening exposing the LED chip, the opening partially filled with the encapsulant which encapsulates the LED chip within the package, the opening forming a circular sidewall within the reflector plate that terminates at a ledge,
wherein the lens sits on a portion of the encapsulant which is formed on the ledge and is free to move relative to the circular sidewall of the reflector plate.
16. The package of claim 15 , wherein each of the substrate and reflector plate have a heat sink capability to draw away heat generated by the LED chip during package operation.
17. The package of claim 15 , wherein a gap is provided between the lens and the circular sidewall to permit lens movement within the reflector plate.