Patent Assignment
Reel/Frame 040276/0724
Assignment of Assignor's Interest
Recorded: 2016-11-10
Pages: 3
Assignor
LOH, BAN P.
Executed: 2005-01-19
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(8)
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Power Surface Mount Light Emitting Die Package
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 23, 2021
From: ANDREWS, PETER SCOTT; LOH, BAN P.
To: CREE, INC.
Reel/Frame 055373/0218 →
Assignment of Assignor's Interest
Feb 23, 2021
From: ANDREWS, PETER SCOTT; LOH, BAN P.
To: CREE, INC.
Reel/Frame 055373/0052 →
Assignment of Assignor's Interest
Feb 23, 2021
From: ANDREWS, PETER SCOTT; LOH, BAN P.
To: CREE, INC.
Reel/Frame 055373/0326 →
Assignment of Assignor's Interest
Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Patent Security Agreement
Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →