IP Library Granted Patent US 10,964,866
Granted Patent B2
US 10,964,866 · App. 16/107,030 · Granted Mar 30, 2021

LED device, system, and method with adaptive patterns

Inventor: Christopher P. Hussell (Cary, NC)
Assignee: Cree, Inc.
H01L33/62G06T7/70H01L21/77H01L33/52H04N5/2256
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Quick Facts
Patent No.
US 10,964,866
App. No.
16/107,030
Granted
Mar 30, 2021
Kind
B2
Abstract

An adaptive electrical routing system for constructing an LED device. The system takes into account placement errors and tolerance regions for connection of one or more LEDs on a substrate. An optical device captures an image (e.g., comprising positional data of components of the LED device) of the LED device showing the actual placement of LEDs on the substrate and transfers the image to an analysis program. A customized pattern (e.g., a customized electrical routing pattern) can be created in one of several possible ways.

Claims (42)

1. A method for adaptively forming a pattern on a light emitting device, the method comprising:

providing a base, which comprises a light-transmissive material;

providing an adhesive layer on a surface of the base;

pressing a light emitting surface of the light emitting diodes (LEDs) against the adhesive layer to secure the LEDs to the base, such that the light emitting surface of the LEDs faces the adhesive layer;

capturing, using a position sensing device, positional data of the LEDs on the base of the light emitting device;

transferring the positional data to a computing device, which comprises a processor and a memory;

executing, using the processor, an adaptive algorithm stored in the memory to analyze the positional data of the LEDs on the base;

producing a pattern based on the positional data;

transmitting the pattern to a pattern generating device; and

transferring the pattern onto the light emitting device.

2. The method of claim 1 , wherein the pattern ultimately comprises electrically conductive features.

3. The method of claim 2 , wherein forming the electrically conductive features comprises one or more of wirebonding, photochemical deposition, pattern exposure and developing, vacuum deposition, curing, plating, etching, and/or silkscreening.

4. The method of claim 2 , comprising using a wirebonder to form at least one of the electrically conductive features, which are either uniquely determined or chosen from a library based on a position of the LEDs such that a wire shape or a landing location is altered.

5. The method of claim 1 , comprising using a photo-imageable resist in subsequent processing to generate the pattern.

6. The method of claim 1 , comprising selectively removing electrically conductive material via laser ablation.

7. The method of claim 1 , wherein the pattern ultimately comprises one or more optical features.

8. The method of claim 1 , wherein the positional data comprises actual positions and orientations of each of the LEDs attached to the base of the light emitting device, the method comprising comparing the actual positions and orientations of each LED to reference design positions and orientations for each LED, wherein comparing the actual and reference design positions and orientations for each LED comprises:

recognizing conductive elements on each LED and/or on the base of the light emitting device; and

determining a routing path using prescribed routing rules.

9. The method of claim 1 , comprising:

applying electrically conductive elements to the LEDs, either before or after the LEDs are attached to the base; and

dispensing an encapsulant layer over the base and around the LEDs of the light emitting device.

10. The method of claim 9 , comprising:

planarizing the encapsulant layer to form a substantially flat top surface of the encapsulant layer and/or expose the electrically conductive elements; and

depositing electrically conductive traces over the encapsulant layer using an adaptive approach, based on a respective position of each of the electrically conductive elements in the top surface of the encapsulant layer.

11. The method of claim 1 , comprising:

applying electrically conductive elements to a surface of the LEDs that is opposite the light emitting surface, either before or after the LEDs are attached to the base; and

dispensing an encapsulant layer over the base and around the LEDs of the light emitting device.

12. A method for adaptively forming a pattern on a light emitting device, the method comprising:

providing a base, which comprises a light-transmissive material;

providing an adhesive layer on a surface of the base;

pressing light emitting diodes (LEDs) against the adhesive layer to secure the LEDs to the base;

capturing, using a position sensing device, positional data of the LEDs on the base of the light emitting device;

transferring the positional data to a computing device, which comprises a processor and a memory;

executing, using the processor, an adaptive algorithm stored in the memory to analyze the positional data of the LEDs on the base;

producing a pattern based on the positional data;

transmitting the pattern to a pattern generating device;

transferring the pattern onto the light emitting device;

applying electrically conductive elements to the LEDs, either before or after the LEDs are attached to the base;

dispensing an encapsulant layer over the base and around the LEDs of the light emitting device;

planarizing the encapsulant layer to form a substantially flat top surface of the encapsulant layer and/or expose the electrically conductive elements; and

depositing electrically conductive traces over the encapsulant layer using an adaptive approach, based on a respective position of each of the electrically conductive elements in the top surface of the encapsulant layer.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2018
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 047341/0810 →