Submount based surface mount device (SMD) light emitter components and methods

1. A method of providing a surface mount device (SMD) light emitter component, the method comprising:

providing a ceramic based submount, wherein the submount comprises a single body of material that is devoid of electrical conductors;

providing at least one electrical contact that physically contacts at least one external surface of the submount;

providing at least one light emitter chip on the submount; and

dispensing a volume of material over at least one side of the at least one electrical contact to form a non-metallic retention material disposed about a perimeter of the submount and defining a reflector cavity directly on a portion of the submount;

dispensing a filling material in the reflector cavity and over the at least one light emitter chip,

wherein:

the retention material is a dispensed material comprising a silicone material, an epoxy, a plastic material, or a thermoset material;

the retention material is adapted to receive and contact the filling material;

the retention material has at least one curved upper edge, which is contiguous with an upper surface of the filling material;

the retention material is a different material than the ceramic based submount; and

the retention material is thicker than the at least one light emitter chip for retaining the filling material over the at least one light emitter chip; and curing the retention material and the filling material.

2. The method of claim 1 , wherein the at least one electrical contact is disposed along portions of at least three external surfaces of the submount.

3. The method of claim 1 , wherein the retention material is dispensed directly over portions of the submount and the at least one electrical contact.

4. The method of claim 1 , wherein retention material comprises a reflective retention material.

5. The method of claim 1 , wherein the ceramic based submount comprises alumina (Al 2 O 3 ).

6. The method of claim 1 , wherein the at least one light emitter chip comprises a light emitting diode (LED) chip.

7. The method of claim 1 , wherein the at least one light emitter chip comprises two or more light emitting diode (LED) chips.

8. The method of claim 7 , wherein the at least one light emitter chip comprises six LED chips.

9. The method of claim 1 , wherein the at least one electrical contact is formed by applying metal to at least a portion of one or more external lateral sides of the submount for electrically connecting a top contact portion of the at least one electrical contact to a bottom contact portion of the at least one electrical contact.

10. The method according to claim 9 , wherein applying metal comprises electroplating at least a portion of the one or more external lateral sides of the submount.

11. The method according to claim 9 , wherein applying metal comprises chemically or physically depositing metal to at least a portion of the one or more external lateral sides of the submount.

12. The method according to claim 1 , wherein the at least one light emitter chip is mounted directly to a top surface of the submount with an adhesive.

13. The method according to claim 1 , wherein the reflector cavity has an angled inner wall.

14. The method according to claim 1 , wherein the filling material comprises an encapsulant.

15. A surface mount device (SMD) submount based light emitter component comprising:

a ceramic based submount, the submount comprising a single, monolithic body of material which is devoid of internal electrical conductors;

at least one electrical contact disposed along portions of at least three external surfaces of the submount;

at least one light emitter chip disposed on the submount; and

a non-metallic retention material defining a reflector cavity disposed about the at least one light emitter chip, wherein the retention material is dispensed as a liquid over at least one side of the at least one electrical contact and is disposed about a perimeter of the submount; and

a filling material disposed in the reflector cavity and over the at least one light emitter chip, wherein:

the retention material comprises a dispensed material, comprising a silicone material, an epoxy, a plastic material, or a thermoset material;

the retention material is adapted to receive and contact the filling material;

the retention material has at least one curved edge which is contiguous with the filling material;

the retention material comprises a wall that is disposed around the at least one light emitter chip, wherein the wall comprises an upper edge with a curved sectional shape that is contiguous with an upper surface of the filling material;

the retention material is a different material than the ceramic based submount; and

the retention material is thicker than the light emitter chip for retaining the filling material over the light emitter chip.

16. The component of claim 15 , wherein the at least three external surfaces of the submount comprise a top surface, a bottom surface, and a side surface.

17. The component of claim 16 , wherein the electrical contact comprises a top contact portion on the top surface, a bottom contact portion on the bottom surface, and a side contact portion on a side surface.

18. The component of claim 17 , wherein each of the top, bottom, and side contact portions comprise areas of electroplated metal.

19. The component of claim 17 , wherein the side contact portion comprises a sawn thru-hole.

20. The component of claim 15 , wherein a thickness, height, or angle of the reflector cavity is customized.

21. The component of claim 15 , wherein the at least one light emitter chip comprises a light emitting diode (LED) chip.

22. The component of claim 15 , wherein the at least one electrical contact comprises one or more internal vias connecting to a bottom contact portion.

23. A surface mount device (SMD) light emitter component comprising:

a submount comprising a single, monolithic layer of material, the submount being devoid of internal electrical conductors;

at least one electrical contact spaced apart from the at least one light emitter chip, the electrical contact comprising a top contact portion, a bottom contact portion, and a side contact portion disposed between the top contact and the bottom contact portion, wherein the top, bottom, and side contact portions are only disposed on, and in physical contact with, external portions of the submount; and

the at least one light emitter chip disposed over the submount and wirebonded to the top contact portion

a non-metallic retention material defining a reflector cavity disposed directly on a portion of the submount, wherein the retention material is dispensed as a liquid over the top contact portion of the at least one electrical contact and is disposed about a perimeter of the submount; and

a filling material disposed in the reflector cavity and over the at least one light emitter chip, wherein:

the retention material comprises a dispensed material, comprising a silicone material, an epoxy, a plastic material, or a thermoset material;

the retention material is adapted to receive, retain and contact the filling material;

the retention material comprises a wall that is disposed around the at least one light emitter chip, wherein the wall comprises an upper edge having a curved sectional shape, the upper edge being contiguous with the filling material; and

the retention material is a different material than the submount.

24. The component of claim 23 , wherein a thickness, height, and/or angle of the retention material is customized.

25. The component of claim 23 , wherein the side contact portion comprises an area of conductive paste, ink, epoxy, metal, an exposed metallic via, and/or an end cap.

26. The component of claim 23 , wherein the top contact portion, the bottom contact portion, and the side contact portion comprise areas of electroplated metal.

27. The component of claim 26 , wherein the areas of electroplated metal comprise at least one material selected from the group consisting of silver, copper, nickel, gold, palladium, titanium and combinations thereof.

28. The component of claim 23 , wherein the bottom contact portion is soldered to an external substrate or heat sink.