Apparatus and methods for mass transfer of electronic die

1. A method of transferring electronic components onto a substrate comprising a superstrate and an adhesive layer formed on at least a first side of the superstrate, the method comprising:

positioning an ejector assembly under an individual electronic component, or a subset of a plurality of electronic components, on a die sheet;

positioning an adhesive receiving structure at a position for forming a pattern of electronic components on the receiving structure;

actuating the ejector assembly;

transferring the individual electronic component, or the subset of the plurality of electronic components, from the die sheet onto the receiving structure at the position;

moving the receiving structure between a first press element and the superstate, such that the first side of the superstrate faces a first side of the receiving structure;

applying, using at least the first press element, a compressive force to press the individual electronic component, or the subset of the plurality of electronic components, on the receiving structure against the adhesive layer to attach the individual electronic component, or the subset of the plurality of electronic components, to the superstrate; and

transferring the individual electronic component, or the subset of the plurality of electronic components, from the receiving structure onto the superstrate.

2. The method of claim 1 , comprising removing the receiving structure after the individual electronic component, or the subset of the plurality of electronic components, are attached to the adhesive layer of the superstrate.

3. The method of claim 1 , comprising arranging a second press element adjacent to the superstrate, opposite the receiving structure, wherein the first press element is arranged adjacent to the receiving structure, opposite the superstrate, and wherein the compressive force is applied using the first and second press elements.

4. The method of claim 1 , wherein:

the electronic components are light emitting devices comprising a primary light emitting surface;

the superstrate comprises a translucent material;

the adhesive layer is a layer of the translucent material that is not fully cured; and

the primary light emitting surface the individual electronic component, or of each electronic component of the subset of the plurality of electronic components, is oriented to face the superstrate.

5. The method of claim 4 , comprising at least partially curing the adhesive layer to set the electronic components therein by applying, using the first press element, a heat.

6. The method of claim 1 , wherein the adhesive layer has an equivalent or greater degree of adhesiveness as the receiving structure.

7. A method of transferring electronic components onto a substrate comprising a superstrate and an adhesive layer formed on at least a first side of the superstrate, the method comprising:

transporting a receiving portion of an adhesive receiving structure to a first transfer apparatus;

positioning a first ejector assembly under an individual first electronic component, or a subset of a plurality of first electronic components, on a first die sheet, wherein each first electronic component is configured to emit a green light;

positioning the receiving portion of the receiving structure at a first position for forming a pattern of first electronic components on the receiving portion of the receiving structure;

actuating the first ejector assembly;

transferring the individual first electronic component, or the subset of the plurality of first electronic components, from the first die sheet onto the receiving structure at the first position;

transporting the receiving portion of the receiving structure to a second transfer apparatus;

positioning a second ejector assembly under an individual second electronic component, or a subset of a plurality of second electronic components, on a second die sheet, wherein each second electronic component is configured to emit a red light;

positioning the receiving portion of the receiving structure at a second position for forming a pattern of second electronic components on the receiving portion of the receiving structure;

actuating the second ejector assembly;

transferring the individual second electronic component, or the subset of the plurality of second electronic components, from the second die sheet onto the receiving structure at the second position to create a plurality of first and second electronic components on the receiving structure;

transporting the receiving portion of the receiving structure to a third transfer apparatus;

positioning a third ejector assembly under an individual third electronic component, or a subset of a plurality of third electronic components, on a third die sheet, wherein each third electronic component is configured to emit a blue light;

positioning the receiving portion of the receiving structure at a third position for forming a pattern of third electronic components on the receiving portion of the receiving structure;

actuating the third ejector assembly;

transferring the individual third electronic component, or the subset of the plurality of third electronic components, from the third die sheet onto the receiving structure at the third position to create a plurality of first, second, and third electronic components;

transporting the receiving portion of the receiving structure to a placement apparatus;

moving the receiving portion of the receiving structure through a gap between the superstrate and a press element, such that the first side of the superstrate faces a first side of the receiving structure; and

applying, using the press element, a compressive force to press the first, second, and third electronic components on the receiving structure against the adhesive layer of the superstrate to attach the first, second, and third electronic components to the superstrate.

8. A light emitter panel produced according to a method of transferring electronic components onto a substrate comprising a superstrate and an adhesive layer formed on at least a first side of the superstrate, the method comprising:

positioning an ejector assembly under an individual electronic component, or a subset of a plurality of electronic components, on a die sheet;

positioning an adhesive receiving structure at a position for forming a pattern of electronic components on the receiving structure;

actuating the ejector assembly;

transferring the individual electronic component, or the subset of the plurality of electronic components, from the die sheet onto the receiving structure at the position;

moving the receiving structure between a first press element and the superstate, such that the first side of the superstrate faces a first side of the receiving structure;

applying, using at least the first press element, a compressive force to press the individual electronic component, or the subset of the plurality of electronic components, on the receiving structure against the adhesive layer to attach the individual electronic component, or the subset of the plurality of electronic components, to the superstrate; and

transferring the individual electronic component, or the subset of the plurality of electronic components, from the receiving structure onto the superstrate.

9. The method of claim 1 , comprising arranging a backing support adjacent to the receiving structure on an opposite side thereof from the die sheet.

10. The method of claim 1 , wherein:

the ejector assembly comprises:

an ejector pin; and

a vacuum chamber arranged around a perimeter of the ejector pin; and

actuating the ejector assembly comprises:

longitudinally extending the ejector pin in a direction towards the receiving structure; and

applying a suction force to an underside of the die sheet, opposite a top side thereof on which the plurality of electronic components are arranged, to cause a localized deformation of the die sheet adjacent to the ejector pin to prevent an attachment of adjacent electronic components on the die sheet to the receiving structure.

11. The method of claim 1 , wherein the electronic components are light emitting devices.

12. The method of claim 1 , wherein:

the plurality of electronic components are arranged on the die sheet in an array; and

the pattern of electronic components is a two-dimensional array of electronic components.

13. The method of claim 1 , wherein one or more of the die sheet, the receiving structure, and the ejector assembly are movable, independently of each other, along an x-direction, a y-direction, a z-direction, a φ-direction, and/or a ψ-direction.

14. The method of claim 1 , comprising:

disposing a mask with gaps formed therein between the receiving structure and the die sheet;

aligning the individual electronic component, or each electronic device of the subset of the plurality of electronic components, with one of the gaps formed in the mask; and

pressing the individual electronic component, or the subset of the plurality of electronic components, against the receiving structure at the position through the one of the gaps.

15. The method of claim 14 , comprising forming the mask adjacent to a surface of the receiving structure, against which the individual electronic component, or the subset of the plurality of electronic components, are pressed by the ejector assembly to form the pattern of electronic components.