IP Library Granted Patent US 8,866,166
Granted Patent B2
US 8,866,166 · App. 13/953,438 · Granted Oct 21, 2014

Solid state lighting device

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Quick Facts
Patent No.
US 8,866,166
App. No.
13/953,438
Granted
Oct 21, 2014
Kind
B2
Abstract

A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.

Claims (13)

1. A light emission package comprising:

at least one solid state emitter;

a heatsink element in thermal communication with the at least one solid state emitter;

a leadframe defining a plurality of electrical leads in electrical communication with the at least one solid state emitter; and

a body structure encasing at least a portion of the leadframe and arranged to retain the heatsink element, wherein the body structure defines a cavity, and the at least one solid state emitter is disposed within the cavity;

wherein the cavity is bounded by a floor, side wall portions, end wall portions, and transition wall portions;

wherein a transition wall portion is disposed between each respective side wall portion and end wall portion; and

wherein each side wall portion and each end wall portion includes a substantially straight upper edge, and each transition wall portion includes a curved or segmented upper edge transitioning from the upper edge of a side wall portion to the upper edge of an end wall portion.

2. The light emission package of claim 1 , wherein each transition wall portion is inclined at a larger average angle, relative to a plane perpendicular to the floor, than each side wall portion and each end wall portion.

3. The light emission package of claim 1 , wherein each side wall portion and each end wall portion is inclined at an angle of at least about 40 degrees relative to a plane perpendicular to the floor.

4. The light emission package of claim 1 , wherein each transition wall portion comprises at least a section thereof that is inclined at an angle of at least about 50 degrees relative to a plane perpendicular to the floor.

5. The light emission package of claim 1 , wherein the body structure has a length and a width that are substantially equal.

6. The light emission package of claim 1 , wherein the at least one solid state emitter comprises a plurality of solid state emitters.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2014
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 033275/0095 →