IP Library Granted Patent US 8,455,908
Granted Patent B2
US 8,455,908 · App. 13/336,540 · Granted Jun 4, 2013

Light emitting devices

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Quick Facts
Patent No.
US 8,455,908
App. No.
13/336,540
Granted
Jun 4, 2013
Kind
B2
Abstract

Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

Claims (37)

1. A light emitting device, comprising:

a submount for supporting one or more light emitting diodes (LEDs);

wherein the submount comprises:

a conductive layer;

a reflective layer disposed over the conductive layer, wherein at least one hole is disposed in the reflective layer such that the reflective layer forms a sidewall of the hole; and

a layer of solder mask disposed over the reflective layer such that at least a portion of the solder mask is disposed in the hole.

2. The light emitting device of claim 1 , wherein the hole terminates at an upper surface of the conductive layer.

3. The light emitting device of claim 1 , wherein the at least one hole is disposed in the conductive layer, such that the reflective layer and the conductive layer form sidewalls of the hole.

4. The light emitting device of claim 3 , further comprising a dielectric layer.

5. The light emitting device of claim 4 , wherein the at least one hole terminates at an upper surface of the dielectric layer.

6. The light emitting device of claim 1 , wherein the submount further comprises a barrier layer disposed below the reflective layer.

7. The light emitting device of claim 6 , wherein the conductive layer comprises copper (Cu), the reflective layer comprises silver (Ag), and the barrier layer comprises nickel (Ni).

8. The light emitting device of claim 1 , wherein the conductive layer comprises at least one electrically conductive trace.

9. The light emitting device of claim 1 , wherein a plurality of holes is disposed in the reflective layer.

10. The light emitting device of claim 9 , wherein the plurality of holes comprises a matrix.

11. The light emitting device of claim 9 , wherein the plurality of holes comprises a random pattern.

12. The light emitting device of claim 9 , wherein the plurality of holes are disposed along an edge of the reflective layer.

13. The light emitting device of claim 9 , wherein the plurality of holes comprise at least one of a circle, square, star, and asymmetric shape, or combinations thereof.

14. The light emitting device of claim 1 , wherein the at least one hole comprises a depth ranging between approximately 0.2 and 500 micrometers (μm).

15. The light emitting device of claim 1 , comprising one or more light emitting diodes.

16. A light emitting device, comprising:

a submount;

a plurality of light emitting diodes (LEDs) disposed over the submount, wherein the LEDs are electrically connected via one or more electrical connectors; and

a retention material disposed about the plurality of LEDs, wherein the retention material covers at least a portion of the one or more electrical connectors; and

wherein the submount comprises:

a reflective layer disposed over the conductive layer, wherein at least one hole is disposed in the reflective layer such that the reflective layer forms a sidewall of the hole; and

a layer of solder mask disposed over the reflective layer such that at least a portion of the solder mask is disposed in the hole.

17. The light emitting device of claim 16 , wherein the hole terminates at an upper surface of the conductive layer.

18. The light emitting device of claim 17 , wherein the at least one hole is disposed in the conductive layer, such that the reflective layer and the conductive layer form sidewalls of the hole.

19. The light emitting device of claim 18 , further comprising a dielectric layer.

20. The light emitting device of claim 19 , wherein the at least one hole terminates at an upper surface of the dielectric layer.

21. The light emitting device of claim 18 , wherein a plurality of holes is disposed in the reflective layer.

22. The light emitting device of claim 21 , wherein the plurality of holes comprises a matrix.

23. The light emitting device of claim 21 , wherein the plurality of holes comprises a random pattern.

24. The light emitting device of claim 21 , wherein the plurality of holes are disposed along an edge of the reflective layer.

25. The light emitting device of claim 21 , wherein the plurality of holes comprise at least one of a circle, square, star, asymmetric shape, or combinations thereof.

26. The light emitting device of claim 16 , wherein the at least one hole comprises a depth ranging between approximately 0.2 and 500 micrometers (μm).

Assignments (4)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →