IP Library Granted Patent US 12,364,074
Granted Patent B2
US 12,364,074 · App. 15/676,965 · Granted Jul 15, 2025

Light emitting diodes and methods

Inventor: Christopher P. Hussell (Cary, NC)
Assignee: CreeLED, Inc.
H10H20/856H01L25/0753H10H20/852H10H20/857H01L24/13H01L24/16H01L24/29H01L24/48H01L24/73H01L2224/13101H01L2224/16225H01L2224/29101H01L2224/32225H01L2224/48227H01L2224/48471H01L2224/73265H01L2924/00014H01L2924/12041H01L2924/181H10H20/0362H10H20/0363H10H20/853H10H20/854H10H20/855
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,364,074
App. No.
15/676,965
Granted
Jul 15, 2025
Kind
B2
Abstract

Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.

Claims (29)

1. A light emitting diode (LED) apparatus comprising:

a substrate;

one or more light emitting diodes (LEDs) that are in contact with a top surface of the substrate and bonded to the substrate;

one or more light-transmissive layers disposed over the substrate and the one or more LEDs; and

one or more dark layers disposed over the one or more light-transmissive layers,

wherein the one or more dark layers are arranged so they do not contact the substrate,

wherein a top surface of the one or more LEDs is higher than or coplanar with a top surface of the one or more dark layers, and

wherein a region above the one or more LEDs is substantially or completely devoid of the one or more dark layers.

2. The LED apparatus of claim 1 , wherein the one or more light-transmissive layers are clear.

3. The LED apparatus of claim 1 , wherein the one or more dark layers are black.

4. The LED apparatus of claim 1 , wherein the region above the one or more LEDs is further devoid of the one or more light-transmissive layers.

5. The LED apparatus of claim 1 , wherein the one or more light-transmissive layers are disposed at least partially under the one or more LEDs, between the one or more LEDs and the substrate.

6. The LED apparatus of claim 1 , wherein a thickness of the one or more dark layers is in a range of about 0.01-0.2 mm.

7. The LED apparatus of claim 1 , further comprising an intermediate reflective layer disposed between the one or more light-transmissive layers and the one or more dark layers.

8. The LED apparatus of claim 1 , wherein any of the layers is a powder-coated material.

9. The LED apparatus of claim 8 , wherein the one or more dark layers comprise epoxy, epoxy-polyester hybrid, aliphatic urethane, TGIC polyester, non-TGIC polyester, silicone, silicon-modified polyester, or combinations thereof.

10. The LED apparatus of claim 8 , wherein any of the layers further comprise a filler material such as a mineral or silica.

11. The LED apparatus of claim 1 , wherein any of the layers is adapted to be removed by grinding, buffing, lapping, and/or sanding.

12. The LED apparatus of claim 1 , further comprising at least one additional layer disposed over the one or more dark layers and an exposed portion of the one or more light-transmissive layers.

13. The LED apparatus of claim 1 , further comprising opaque sidewalls.

14. The LED apparatus of claim 1 , wherein at least one of the one or more LEDs is a wire-bonded LED.

15. The LED apparatus of claim 1 , wherein:

the one or more LEDs comprise a plurality of LEDs; and

the plurality of LEDs comprise at least one wirebonded LED and at least one non-wirebonded LED.

16. The LED apparatus of claim 15 , wherein the at least one non-wirebonded LED has a thickness that is greater than a thickness of the at least one wirebonded LED.

17. The LED apparatus of claim 15 , wherein the plurality of LEDs comprises LEDs of different thicknesses, and the LEDs are disposed on the substrate such that top surfaces of the LEDs are substantially coplanar.

18. The LED apparatus of claim 15 , wherein the LEDs are disposed on electrical traces of different thicknesses.

19. The LED apparatus of claim 1 , wherein at least a portion of the one or more light-transmissive layers is disposed between the one or more dark layers and the substrate.

20. The LED apparatus of claim 1 , further comprising an additional layer disposed over the one or more dark layers, the additional layer comprising a surface finish that comprises a matte finish.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2019
From: HUSSELL, CHRISTOPHER P.
To: CREE, INC.
Reel/Frame 048235/0006 →
Continuity (4)
Continuation In Part 15087641 · Mar 31, 2016
Provisional Application 62141065 · Mar 31, 2015
Related Publication 20180076368A1 · Mar 15, 2018
Related Publication 20190355886A9 · Nov 21, 2019
References Cited (304)
US 1014179A · Roney · 1912 [cited by examiner]
US 4473277A · Brown · 1984 [cited by applicant]
US 4918497A · Edmond · 1990 [cited by applicant]
US 4946547A · Palmour et al. · 1990 [cited by applicant]
US 4966862A · Edmond · 1990 [cited by applicant]
US 5027168A · Edmond · 1991 [cited by applicant]
US 5200022A · Kong et al. · 1993 [cited by applicant]
US 5210051A · Carter, Jr. · 1993 [cited by applicant]
US 5338944A · Edmond et al. · 1994 [cited by applicant]
US 5359345A · Hunter · 1994 [cited by applicant]
US 5382811A · Takahashi · 1995 [cited by applicant]
US RE34861E · Davis et al. · 1995 [cited by applicant]
US 5393993A · Edmond et al. · 1995 [cited by applicant]
US 5416342A · Edmond et al. · 1995 [cited by applicant]
US 5523589A · Edmond et al. · 1996 [cited by applicant]
US 5604135A · Edmond et al. · 1997 [cited by applicant]
US 5631190A · Negley · 1997 [cited by applicant]
US 5739554A · Edmond et al. · 1998 [cited by applicant]
US 5912477A · Negley · 1999 [cited by applicant]
US 6120600A · Edmond et al. · 2000 [cited by applicant]
US 6187606B1 · Edmond et al. · 2001 [cited by applicant]
US 6195882B1 · Tsukamoto et al. · 2001 [cited by applicant]
US 6201262B1 · Edmond et al. · 2001 [cited by applicant]
US 6600175B1 · Baretz et al. · 2003 [cited by applicant]
US 6791119B2 · Slater et al. · 2004 [cited by applicant]
US 6853010B2 · Slater et al. · 2005 [cited by applicant]
US 6958497B2 · Emerson et al. · 2005 [cited by applicant]
US 7095056B2 · Vitta et al. · 2006 [cited by applicant]
US 7128442B2 · Lee et al. · 2006 [cited by applicant]
US 7213940B1 · van De Ven et al. · 2007 [cited by applicant]
US 7244965B2 · Andrews et al. · 2007 [cited by applicant]
US 7256486B2 · Lee et al. · 2007 [cited by applicant]
US 7279355B2 · Lee et al. · 2007 [cited by applicant]
US 7382976B1 · Mok · 2008 [cited by examiner]
US 7445354B2 · Aoki · 2008 [cited by examiner]
US 7456035B2 · Eliashevich · 2008 [cited by examiner]
US 7456499B2 · Loh et al. · 2008 [cited by applicant]
US 7564180B2 · Brandes · 2009 [cited by applicant]
US 7655957B2 · Loh et al. · 2010 [cited by applicant]
US 7678595B2 · Chang · 2010 [cited by examiner]
US 7791061B2 · Edmond et al. · 2010 [cited by applicant]
US 7802901B2 · McMillan · 2010 [cited by applicant]
US 7821023B2 · Yuan et al. · 2010 [cited by applicant]
US 7919787B2 · Lee et al. · 2011 [cited by applicant]
US 7952544B2 · Roberts · 2011 [cited by applicant]
US 7960819B2 · Loh et al. · 2011 [cited by applicant]
US 7999283B2 · Chakraborty et al. · 2011 [cited by applicant]
US 8018135B2 · Van De Ven et al. · 2011 [cited by applicant]
US 8044418B2 · Loh et al. · 2011 [cited by applicant]
US 8058088B2 · Cannon et al. · 2011 [cited by applicant]
US 8125137B2 · Medendorp, Jr. et al. · 2012 [cited by applicant]
US 8264138B2 · Negley et al. · 2012 [cited by applicant]
US 8337071B2 · Negley et al. · 2012 [cited by applicant]
US 8373182B2 · Seko · 2013 [cited by examiner]
US 8563339B2 · Tarsa et al. · 2013 [cited by applicant]
US 8729589B2 · Hussell et al. · 2014 [cited by applicant]
US 8735928B2 · Jager et al. · 2014 [cited by applicant]
US 8866410B2 · Negley et al. · 2014 [cited by applicant]
US 8940561B2 · Donofrio et al. · 2015 [cited by applicant]
US 8970131B2 · Brandes et al. · 2015 [cited by applicant]
US 8981415B1 · Hsu · 2015 [cited by examiner]
US 9024349B2 · Chitnis et al. · 2015 [cited by applicant]
US 9054257B2 · Chan et al. · 2015 [cited by applicant]
US 9131561B2 · Athalye · 2015 [cited by applicant]
US 9159888B2 · Chitnis et al. · 2015 [cited by applicant]
US 9277605B2 · Ni · 2016 [cited by applicant]
US 9406852B2 · Nakabayashi et al. · 2016 [cited by applicant]
US 9414454B2 · Brandes et al. · 2016 [cited by applicant]
US 9607958B2 · Lin et al. · 2017 [cited by applicant]
US 9680071B2 · Nakabayashi et al. · 2017 [cited by applicant]
US 9682886B1 · Almanza-Workman et al. · 2017 [cited by applicant]
US 9713211B2 · van de Ven et al. · 2017 [cited by applicant]
US 9735198B2 · Joo et al. · 2017 [cited by applicant]
US 9887329B2 · Yamada · 2018 [cited by examiner]
US 9966370B2 · Moosburger et al. · 2018 [cited by applicant]
US 10043960B2 · Andrews · 2018 [cited by examiner]
US 10312285B2 · Mizuta · 2019 [cited by examiner]
US 10325962B2 · Kim · 2019 [cited by examiner]
US 10388838B2 · Hung · 2019 [cited by examiner]
US 10453827B1 · Hussell et al. · 2019 [cited by applicant]
US 10910523B2 · Hung · 2021 [cited by examiner]
US 11171123B2 · Tangring · 2021 [cited by applicant]
US 11245057B2 · Maeda · 2022 [cited by examiner]
US 11322662B2 · Brandl et al. · 2022 [cited by applicant]
US 11508887B2 · Chen · 2022 [cited by examiner]
US 11870022B2 · Chen · 2024 [cited by examiner]
US 20010032985A1 · Bhat · 2001 [cited by examiner]
US 20020125044A1 · Johnson · 2002 [cited by applicant]
US 20020131151A1 · Engler et al. · 2002 [cited by applicant]
US 20030143423A1 · McCormick · 2003 [cited by examiner]
US 20030146695A1 · Seki · 2003 [cited by applicant]
US 20030151361A1 · Ishizaka · 2003 [cited by applicant]
US 20040062040A1 · Blume et al. · 2004 [cited by applicant]
US 20040069993A1 · Murano · 2004 [cited by applicant]
US 20050023550A1 · Eliashevich · 2005 [cited by examiner]
US 20050035356A1 · Kek et al. · 2005 [cited by applicant]
US 20050045897A1 · Chou · 2005 [cited by examiner]
US 20050184387A1 · Collins et al. · 2005 [cited by applicant]
US 20050212447A1 · Oh · 2005 [cited by examiner]
US 20060006404A1 · Ibbetson · 2006 [cited by examiner]
US 20060018608A1 · Mizoguchi · 2006 [cited by examiner]
US 20060060870A1 · Park · 2006 [cited by examiner]
US 20060118807A1 · Ives et al. · 2006 [cited by applicant]
US 20060145172A1 · Su et al. · 2006 [cited by applicant]
US 20060148971A1 · Jing et al. · 2006 [cited by applicant]
US 20060152668A1 · Jang et al. · 2006 [cited by applicant]
US 20060157722A1 · Takezawa et al. · 2006 [cited by applicant]
US 20060193121A1 · Kamoshita · 2006 [cited by examiner]
US 20060198162A1 · Ishidu et al. · 2006 [cited by applicant]
US 20060221272A1 · Negley et al. · 2006 [cited by applicant]
US 20060261364A1 · Suehiro et al. · 2006 [cited by applicant]
US 20070085944A1 · Tanaka et al. · 2007 [cited by applicant]
US 20070104828A1 · Fornaguera · 2007 [cited by applicant]
US 20070139923A1 · Negley et al. · 2007 [cited by applicant]
US 20070158668A1 · Tarsa et al. · 2007 [cited by applicant]
US 20070161211A1 · Sunohara et al. · 2007 [cited by applicant]
US 20070170447A1 · Negley et al. · 2007 [cited by applicant]
US 20070178629A1 · Ogawa et al. · 2007 [cited by applicant]
US 20070223219A1 · Medendorp, Jr. et al. · 2007 [cited by applicant]
US 20070228387A1 · Negley et al. · 2007 [cited by applicant]
US 20070253209A1 · Loh et al. · 2007 [cited by applicant]
US 20070262323A1 · Sonobe et al. · 2007 [cited by applicant]
US 20070262339A1 · Hussell et al. · 2007 [cited by applicant]
US 20070268694A1 · Bailey et al. · 2007 [cited by applicant]
US 20080012036A1 · Loh et al. · 2008 [cited by applicant]
US 20080048200A1 · Mueller · 2008 [cited by examiner]
US 20080121921A1 · Loh et al. · 2008 [cited by applicant]
US 20080173884A1 · Chitnis et al. · 2008 [cited by applicant]
US 20080179611A1 · Chitnis et al. · 2008 [cited by applicant]
US 20080198112A1 · Roberts · 2008 [cited by applicant]
US 20080218072A1 · Haruna · 2008 [cited by examiner]
US 20080224608A1 · Konishi et al. · 2008 [cited by applicant]
US 20080233666A1 · Park et al. · 2008 [cited by applicant]
US 20080258130A1 · Bergmann et al. · 2008 [cited by applicant]
US 20080258156A1 · Hata · 2008 [cited by applicant]
US 20080284307A1 · Kuo · 2008 [cited by applicant]
US 20080298063A1 · Hayashi · 2008 [cited by applicant]
US 20080308825A1 · Chakraborty et al. · 2008 [cited by applicant]
US 20090050907A1 · Yuan et al. · 2009 [cited by applicant]
US 20090050908A1 · Yuan et al. · 2009 [cited by applicant]
US 20090057690A1 · Chakraborty · 2009 [cited by applicant]
US 20090079328A1 · Fedorovskaya · 2009 [cited by examiner]
US 20090080185A1 · McMillan · 2009 [cited by applicant]
US 20090108281A1 · Keller et al. · 2009 [cited by applicant]
US 20090115313A1 · Lu et al. · 2009 [cited by applicant]
US 20090127702A1 · Dekker · 2009 [cited by examiner]
US 20090146176A1 · Oishi · 2009 [cited by applicant]
US 20090160363A1 · Negley et al. · 2009 [cited by applicant]
US 20090173956A1 · Aldaz et al. · 2009 [cited by applicant]
US 20090184616A1 · Van De Ven et al. · 2009 [cited by applicant]
US 20090230409A1 · Basin et al. · 2009 [cited by applicant]
US 20100060553A1 · Zimmerman et al. · 2010 [cited by applicant]
US 20100140655A1 · Shi · 2010 [cited by applicant]
US 20100155763A1 · Donofrio et al. · 2010 [cited by applicant]
US 20100200898A1 · Lin et al. · 2010 [cited by applicant]
US 20100237375A1 · Yamazaki et al. · 2010 [cited by applicant]
US 20100246152A1 · Lin et al. · 2010 [cited by applicant]
US 20100252851A1 · Emerson et al. · 2010 [cited by applicant]
US 20100258830A1 · Ide et al. · 2010 [cited by applicant]
US 20110006334A1 · Ishii et al. · 2011 [cited by applicant]
US 20110031524A1 · Pei · 2011 [cited by applicant]
US 20110068702A1 · van De Ven et al. · 2011 [cited by applicant]
US 20110079801A1 · Zhang et al. · 2011 [cited by applicant]
US 20110140148A1 · Liu · 2011 [cited by applicant]
US 20110176301A1 · Liang et al. · 2011 [cited by applicant]
US 20110291125A1 · Donauer et al. · 2011 [cited by applicant]
US 20110316024A1 · Hung et al. · 2011 [cited by applicant]
US 20120056228A1 · Horng et al. · 2012 [cited by applicant]
US 20120112220A1 · West et al. · 2012 [cited by applicant]
US 20120126262A1 · Huang et al. · 2012 [cited by applicant]
US 20120149138A1 · Su et al. · 2012 [cited by applicant]
US 20120153340A1 · Song et al. · 2012 [cited by applicant]
US 20120193788A1 · Fu et al. · 2012 [cited by applicant]
US 20120206503A1 · Hirakata · 2012 [cited by applicant]
US 20120235169A1 · Seko · 2012 [cited by examiner]
US 20120248469A1 · Choi · 2012 [cited by applicant]
US 20120261689A1 · Appelt et al. · 2012 [cited by applicant]
US 20120305949A1 · Donofrio et al. · 2012 [cited by applicant]
US 20120319150A1 · Shimomura et al. · 2012 [cited by applicant]
US 20130026520A1 · Hu et al. · 2013 [cited by applicant]
US 20130069525A1 · Imai · 2013 [cited by applicant]
US 20130075902A1 · Chow et al. · 2013 [cited by applicant]
US 20130092966A1 · Jaeger et al. · 2013 [cited by applicant]
US 20130093313A1 · Oyamada · 2013 [cited by applicant]
US 20130134454A1 · Chan et al. · 2013 [cited by applicant]
US 20130163244A1 · Suzuki · 2013 [cited by examiner]
US 20130187178A1 · Tischler · 2013 [cited by applicant]
US 20130207141A1 · Reiherzer · 2013 [cited by applicant]
US 20130256711A1 · Joo et al. · 2013 [cited by applicant]
US 20130264589A1 · Bergmann et al. · 2013 [cited by applicant]
US 20130270592A1 · Reiherzer et al. · 2013 [cited by applicant]
US 20130279169A1 · Reiherzer et al. · 2013 [cited by applicant]
US 20130307013A1 · Chan et al. · 2013 [cited by applicant]
US 20130334959A1 · Wang et al. · 2013 [cited by applicant]
US 20140042467A1 · Livesay et al. · 2014 [cited by applicant]
US 20140070235A1 · Andrews et al. · 2014 [cited by applicant]
US 20140077682A1 · Ho et al. · 2014 [cited by applicant]
US 20140091326A1 · Tran · 2014 [cited by examiner]
US 20140153238A1 · Nishimura et al. · 2014 [cited by applicant]
US 20140239325A1 · Andrews · 2014 [cited by examiner]
US 20140239332A1 · Iwakura · 2014 [cited by examiner]
US 20140346545A1 · Chan et al. · 2014 [cited by applicant]
US 20140362570A1 · Miyoshi et al. · 2014 [cited by applicant]
US 20140367713A1 · Zhang et al. · 2014 [cited by applicant]
US 20150021642A1 · Nakabayashi · 2015 [cited by applicant]
US 20150028307A1 · Kim · 2015 [cited by examiner]
US 20150049510A1 · Haiberger et al. · 2015 [cited by applicant]
US 20150129902A1 · Iino · 2015 [cited by applicant]
US 20150162317A1 · Tran · 2015 [cited by examiner]
US 20150194583A1 · Sabathil · 2015 [cited by examiner]
US 20150257211A1 · Johnson et al. · 2015 [cited by applicant]
US 20150287892A1 · Han et al. · 2015 [cited by applicant]
US 20150371585A1 · Bower et al. · 2015 [cited by applicant]
US 20160027973A1 · Maki · 2016 [cited by applicant]
US 20160043064A1 · Tran · 2016 [cited by examiner]
US 20160181476A1 · Chang et al. · 2016 [cited by applicant]
US 20160181491A1 · Sabathil · 2016 [cited by examiner]
US 20160293811A1 · Hussell · 2016 [cited by examiner]
US 20160293812A1 · Pindl · 2016 [cited by examiner]
US 20160351539A1 · Bower et al. · 2016 [cited by applicant]
US 20170005079A1 · Hoeppel · 2017 [cited by examiner]
US 20170062681A1 · Miyoshi et al. · 2017 [cited by applicant]
US 20170092690A1 · Mizuta · 2017 [cited by examiner]
US 20170154880A1 · Ozeki et al. · 2017 [cited by applicant]
US 20170345801A1 · Lin et al. · 2017 [cited by applicant]
US 20170345866A1 · Joo et al. · 2017 [cited by applicant]
US 20170358624A1 · Takeya et al. · 2017 [cited by applicant]
US 20180006192A1 · Rudmann · 2018 [cited by examiner]
US 20180076368A1 · Hussell · 2018 [cited by applicant]
US 20180097164A1 · Katsumata et al. · 2018 [cited by applicant]
US 20180105669A1 · Otsubo · 2018 [cited by examiner]
US 20180195675A1 · Miyoshi et al. · 2018 [cited by applicant]
US 20180358405A1 · Chaji et al. · 2018 [cited by applicant]
US 20190009766A1 · Meckenstock · 2019 [cited by examiner]
US 20190051762A1 · Yu · 2019 [cited by examiner]
US 20190123213A1 · Yu · 2019 [cited by examiner]
US 20190355884A1 · Pan · 2019 [cited by examiner]
US 20190355886A9 · Hussell · 2019 [cited by applicant]
US 20200235084A1 · Wu · 2020 [cited by examiner]
CA 2936473A1 · 2018 [cited by applicant]
CN 201340702 · 2009 [cited by applicant]
CN 201355545 · 2009 [cited by applicant]
CN 201688336 · 2010 [cited by applicant]
CN 104979338A · 2015 [cited by examiner]
CN 103718325B · 2017 [cited by examiner]
CN 107438899A · 2017 [cited by applicant]
CN 107438899B · 2021 [cited by applicant]
DE 102013112549A1 · 2015 [cited by applicant]
EP 2211394A2 · 2010 [cited by applicant]
EP 2472578A2 · 2012 [cited by applicant]
EP 2693854A2 · 2014 [cited by examiner]
EP 2811517A1 · 2014 [cited by applicant]
EP 3364458A1 · 2018 [cited by applicant]
JP H10247748A · 1998 [cited by applicant]
JP 2000022218A · 2000 [cited by applicant]
JP 2001160630A · 2001 [cited by applicant]
JP 2002033517A · 2002 [cited by examiner]
JP 2006093435A · 2006 [cited by applicant]
JP 2007189006A · 2007 [cited by applicant]
JP WO2009069671A1 · 2009 [cited by examiner]
JP 2010157638 · 2010 [cited by examiner]
JP 2010157638A · 2010 [cited by applicant]
KR 20080030811A · 2008 [cited by applicant]
KR 100933920B1 · 2009 [cited by applicant]
KR 20100008509A · 2010 [cited by applicant]
KR 20110111941A · 2011 [cited by applicant]
TW 201214795A · 2012 [cited by applicant]
WO WO2016161161 · 2016 [cited by applicant]
WO WO2019231843A1 · 2019 [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641 dated Sep. 20, 2018. [cited by applicant]
Restriction Requirement for U.S. Appl. No. 15/087,641 dated Nov. 20, 2017. [cited by applicant]
Restriction Requirement for U.S. Appl. No. 15/654,323 dated Dec. 28, 2017. [cited by applicant]
Notice of Publication for Application No. PCT/US2016/025346 dated Oct. 6, 2016. [cited by applicant]
International Search Report and Written Opinion for Application No. PCT/US2016/025346 dated Aug. 2, 2016. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641 dated Feb. 23, 2018. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/654,323 dated May 8, 2018. [cited by applicant]
Chinese Office Action for Application No. 201680019859.4 dated May 27, 2019. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/993,540 dated Jun. 13, 2019. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/993,540 dated Feb. 21, 2019. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641 dated Oct. 3, 2019. [cited by applicant]
International Search Report and Written Opinion for Application No. PCT/US2019/033914 dated Sep. 5, 2019. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641 dated May 1, 2020. [cited by applicant]
Chinese Office Action for Application No. 201680019859 dated May 6, 2020. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641 dated Oct. 9, 2020. [cited by applicant]
Chinese Supplementary Search for Application No. 201680019859.4 dated Jan. 5, 2021. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641 dated Apr. 16, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/654,323, mailed Jan. 31, 2020, 8 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/654,323, mailed Mar. 1, 2019, 9 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/654,323, mailed Jul. 23, 2019, 9 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/654,323, mailed Nov. 21, 2019, 10 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641, mailed Oct. 27, 2021. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641, mailed Apr. 29, 2022, 17 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 15/087,641, mailed Jul. 12, 2022, 3 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641, mailed Aug. 5, 2022, 17 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641, mailed Jan. 23, 2023, 17 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 15/087,641, mailed Mar. 24, 2023, 3 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641, mailed May 26, 2023, 16 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 15/087,641, mailed Jan. 29, 2024, 3 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/087,641, mailed Mar. 28, 2024, 15 pages. [cited by applicant]
Second Office Action for Chinese Patent Application No. 202110389262.1, mailed Apr. 1, 2024, 13 pages. [cited by applicant]
Notification to Grant for Chinese Patent Application No. 202110389262.1, mailed Jul. 12, 2024, 8 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641, mailed Oct. 11, 2024, 10 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/087,641, mailed Nov. 15, 2023, 14 pages. [cited by applicant]
First Office Action for Chinese Patent Application No. 202110389262.1, mailed Sep. 21, 2023, 22 pages. [cited by applicant]