Micro device integration into system substrate
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.
1. An integrated device comprising:
a plurality of micro devices integrated on a receiver substrate;
a patterned filler layer formed about at least a first micro device; and
a reflective layer formed around and over the patterned filler layer to confine light emitted by the at least first micro device within an active area of the at least first micro device;
wherein the reflective layer is patterned in vertical and horizontal directions to form a touch screen crossing electrode.
2. The integrated device according to claim 1 , wherein the reflective layer is covering at least a portion of one of: a top and a bottom of the patterned filler layer and confining at least a portion of incoming or outgoing light within the active area of the first micro device.
3. The integrated device according to claim 2 , wherein the reflective layer is fabricated as an electrode of the first micro device.
4. The integrated device according to claim 1 , wherein the patterned filler layer is further formed about a second micro device and between the first micro device and the second micro device.
5. The integrated device according to claim 1 , wherein the patterned filler layer is comprised of a dielectric filler material.
6. The integrated device according to claim 1 , further comprising:
a dielectric layer formed between the reflective layer and the patterned filler layer.
7. The integrated device according to claim 1 , further comprising;
a transparent conductive layer formed over a top of the first micro device; and
a contact pad formed at a bottom of the first micro device, wherein the contact pad is formed with a concave structure capable of enhancing the outcoupling of light from the first micro device.
8. The integrated device according to claim 1 , wherein the reflective layer is fabricated as a portion of the electrode of the first micro device.
9. The integrated device according to claim 1 , wherein the reflective layer is covered by a black matrix to reduce an ambient reflection of the integrated device.
10. The integrated device of claim 1 , wherein a dielectric is used between vertical and horizontal traces.
11. The integrated device of claim 1 , wherein the reflective layer is opaque.
12. The integrated device of claim 1 , wherein the reflective layer is a metallic bilayer.
13. The integrated device of claim 1 , wherein the reflective layer has multiple layers.