LED package die having a small footprint
View Patent ↗A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads are attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.
1. A method of manufacturing a light emitting die package, the method comprising:
fabricating a stem substrate rod having a predetermined length, the stem substrate rod defining at least one groove;
attaching wire lead on the groove of the stem substrate rod;
cutting the stem substrate rod including the attached wire leads to a predetermined length thereby forming an individual stem substrate;
planarizing a first end surface of the individual stem substrate; and
mounting a light emitting diode (LED) on the first end surface, the LED making electrical and thermal contact with the stem substrate, the LED also connected to the wire lead.
2. The method recited in claim 1 further comprising encapsulating the LED.
3. The method recited in claim 1 further comprising attaching a sleeve surrounding the stem substrate proximal to the first end surface, the sleeve defining an opening at the first end surface.
4. The method recited in claim 2 further comprising coupling a reflector on the sleeve, the reflector surrounding the opening.
5. The method recited in claim 2 further comprising coupling a lens to the sleeve, the lens covering the opening.