IP Library Granted Patent US 10,734,560
Granted Patent B2
US 10,734,560 · App. 15/826,417 · Granted Aug 4, 2020

Configurable circuit layout for LEDs

Inventors: David N. Randolph (Wake Forest, NC); Ryan C. Mohn (Cary, NC)
Assignee: Cree, Inc.
H01L33/62H01L27/15H01L33/644H05K1/00H01L2933/0066
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Quick Facts
Patent No.
US 10,734,560
App. No.
15/826,417
Granted
Aug 4, 2020
Kind
B2
Abstract

A device for an LED has a substrate and a circuit on the substrate configured to accept the LED. The circuit includes a first set of electrical traces terminating at a first set of solder pads for a first sized LED, a second set of electrical traces terminating at a second set of solder pads for a second sized LED different from the first sized LED, and peripheral electrical traces for electrically interconnecting electrical traces of the first set of electrical traces or between electrical traces of the second set of electrical traces. Connection components electrically interconnect the first set of electrical traces with each other or the electrical traces of the second set of electrical traces with each other, respectively, at corresponding solder pads. The device is configurable to provide a first voltage and a second voltage to the LED.

Claims (42)

1. A device for a light emitting diode (LED), which can at least be a first sized LED or a second sized LED, the second sized LED being a different size from the first sized LED, the device comprising:

a substrate; and

a circuit disposed on the substrate and configured to accept both the first sized LED and the second sized LED,

wherein the circuit comprises:

a first set of electrical traces, at least some of which terminate at a first set of solder pads configured for electrical connection to the LED when the LED is the first sized LED;

a second set of electrical traces, at least some of which terminate at a second set of solder pads configured for electrical connection to the LED when the LED is the second sized LED; and

a plurality of peripheral electrical traces for providing electrical interconnection between electrical traces of the first set of electrical traces or between electrical traces of the second set of electrical traces, wherein the plurality of peripheral electrical traces comprise a plurality of peripheral solder pads for mounting connection components to provide the electrical interconnection between the electrical traces of the first set of electrical traces or between the electrical traces of the second set of electrical traces, respectively, and

wherein the device is configurable to provide one of at least a first voltage and a second voltage to the LED, regardless of whether the LED is the first sized LED or the second sized LED.

2. The device of claim 1 , wherein the second voltage is double a magnitude of the first voltage.

3. The device of claim 1 , wherein the connection components comprise at least one of a zero-ohm resistor, a wirebond, and a jumper.

4. The device of claim 1 , wherein the first set of electrical traces and the second set of electrical traces each comprise four traces.

5. The device of claim 4 , comprising:

a first connection component disposed to electrically connect together two adjacent traces of the first set of electrical traces or the second set of electrical traces on a first side of the LED; and

a second connection component disposed to electrically connect together two adjacent traces of the first set of electrical traces or the second set of electrical traces on a second side of the LED,

wherein the first side of the LED is opposite the second side of the LED.

6. The device of claim 5 , wherein the first connection component and the second connection component are configured for connection to the first set of electrical traces to supply the first voltage to the first set of electrical traces.

7. The device of claim 6 , wherein the LED is the first sized LED, wherein the first sized LED is a 5 mm square LED, and wherein the first voltage comprises approximately 6V.

8. The device of claim 5 , wherein the first connection component and the second connection component are configured for connection to the second set of electrical traces to supply the first voltage to the second set of electrical traces.

9. The device of claim 8 , wherein the LED is the second sized LED, wherein the second sized LED is a 7 mm square LED, and wherein the first voltage comprises approximately 6V.

10. The device of claim 4 , comprising three connection components configured to electrically connect two electrical traces of the first set of electrical traces, via at least two of the plurality of peripheral electrical traces, and to supply the second voltage to the first set of electrical traces.

11. The device of claim 10 , wherein the LED is the first sized LED, wherein the first sized LED is a 5 mm square LED, and wherein the second voltage comprises approximately 12V.

12. The device of claim 4 , comprising two connection components configured to electrically connect two electrical traces of the second set of electrical traces, via at least a third of the plurality of peripheral electrical traces, and to supply the second voltage to the second set of electrical traces.

13. The device of claim 12 , wherein the LED is the second sized LED, wherein the second sized LED is a 7 mm square LED, and wherein the second voltage comprises approximately 12V.

14. The device of claim 1 , comprising a solder mask disposed over at least a portion of the circuit.

15. The device of claim 1 , further comprising an electrically isolated, thermally conductive element disposed below the LED.

16. A system for attaching a plurality of LEDs, the system comprising:

a substrate; and

a plurality of circuits that are arranged on an upper surface of the substrate and configured to accept a respective one of the plurality of LEDs,

wherein each of the plurality of circuits comprises:

a first set of electrical traces, at least some of which terminate at a first set of solder pads configured for electrical connection to a first sized LED of the plurality of LEDs;

a second set of electrical traces, at least some of which terminate at a second set of solder pads configured for electrical connection to a second sized LED of the plurality of LEDs, wherein the second sized LED is a different size from the first sized LED; and

a plurality of peripheral electrical traces for providing electrical interconnection between electrical traces of the first set of electrical traces or between electrical traces of the second set of electrical traces, wherein the plurality of peripheral electrical traces comprise a plurality of peripheral solder pads for mounting connection components to provide the electrical interconnection between the electrical traces of the first set of electrical traces or between the electrical traces of the second set of electrical traces, respectively, and

wherein the system is configurable to provide one of at least a first voltage and a second voltage to each of the plurality of LEDs.

17. The system of claim 16 , wherein the plurality of circuits are electrically connected to each other.

18. A method for connecting light emitting diode (LED), which can at least be a first sized LED or a second sized LED, the second sized LED being a different size from the first sized LED, on a substrate, the method comprising:

providing a circuit configured to accept both the first sized LED and the second sized LED on the substrate, wherein the circuit comprises:

a first set of electrical traces, at least some of which terminate at a first set of solder pads configured for electrical connection to the LED when the LED is the first sized LED;

a second set of electrical traces, at least some of which terminate at a second set of solder pads configured for electrical connection to the LED when the LED is the second sized LED; and

a plurality of peripheral electrical traces for providing electrical interconnection between electrical traces of the first set of electrical traces or between electrical traces of the second set of electrical traces, wherein the plurality of peripheral electrical traces comprise a plurality of peripheral solder pads for mounting connection components to provide the electrical interconnection between the electrical traces of the first set of electrical traces or between the electrical traces of the second set of electrical traces, respectively;

arranging and connecting the connection components to electrically interconnect the electrical traces of the first set of electrical traces or the electrical traces of the second set of electrical traces, respectively;

connecting the first sized LED to the first set of solder pads or the second sized LED to the second set of solder pads; and

supplying a first voltage or a second voltage to one of at least the first set of electrical traces, when the LED is the first sized LED and is connected to the first set of solder pads, or the second set of electrical traces, when the LED is the second sized LED and is connected to the second set of solder pads.

Assignments (5)
PATENT SECURITY AGREEMENT Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Recorded Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
SECURITY INTEREST Recorded Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2021
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 055780/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2018
From: RANDOLPH, DAVID N.; MOHN, RYAN C.
To: CREE, INC.
Reel/Frame 047201/0431 →