Light emitter components and related methods
Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.
1. A light emitter component comprising:
a submount comprising ceramic;
a reflective material disposed on portions of the submount, wherein the reflective material comprises a reflective surface; and
a plurality of light emitter chips disposed on the reflective surface of the reflective material and in contact with one or more electrical traces on the submount, wherein the reflective surface extends below each of the plurality of light emitter chips and between each of the one or more electrical traces, wherein each light emitter chip comprises a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts that face the reflective surface;
wherein a ratio of a combined epi area of the plurality of light emitter chips to a surface area of the reflective surface not covered by the plurality of light emitter chips is at least 0.4 or more, and
wherein a ratio of a combined planar surface area of the plurality of light emitter chips to a planar surface area of the reflective surface not covered by the plurality of light emitter chips is at least approximately 0.25 or more.
2. The component of claim 1 , further comprising a retention wall disposed around the plurality of light emitter chips.
3. The component of claim 2 , wherein the reflective material is disposed on a first portion of the submount that is on a first side of the retention wall, a second portion of the submount that is on a second side of the retention wall, and a third portion of the submount that is below the retention wall.
4. The component of claim 1 , wherein the ceramic comprises aluminum nitride (AlN).
5. The component of claim 1 , wherein the reflective material extends to outermost edges of the submount.
6. The component of claim 1 , wherein at least 75% of a planar surface of the submount is covered with the reflective material.
7. The component of claim 1 , wherein the reflective material comprises a reflective plastic, a reflective polymer, reflective particles, and/or a solder mask material.
8. The component of claim 1 , wherein the light emitter chips are spaced apart by a distance of approximately 0.3 millimeters (mm) or less.
9. The component of claim 1 , further comprising a plurality of electrical traces disposed on the submount, wherein each of the electrical traces comprises a width of approximately 90 μm or less.
10. The component of claim 1 , wherein the light emitter chips are encapsulated in silicone.
11. A light emitter component comprising:
a submount comprising ceramic;
a reflective material disposed on the submount;
a plurality of light emitter chips disposed on the reflective material and in contact with one or more electrical traces on the submount, wherein the reflective material extends below each of the plurality of light emitter chips and between each of the one or more electrical traces; and
a retention wall disposed around the plurality of light emitter chips wherein the reflective material is disposed over:
a first portion of the submount that is on a first side of the retention wall;
a second portion of the submount that is on a second side of the retention wall; and
a third portion of the submount that is below the retention wall such that the reflective material contacts portions of the submount and the retention wall,
wherein the reflective material comprises a reflective surface, and wherein the plurality of light emitter chips disposed on and covering at least a portion of the reflective material occupies approximately 50% or more of a surface area of the reflective surface of the reflective material.
12. The component of claim 11 , wherein the plurality of light emitter chips occupies approximately 70% or more of a surface area of the reflective surface.
13. The component of claim 11 , wherein the ceramic comprises aluminum nitride (AlN).
14. The component of claim 11 , wherein the reflective material extends to outermost edges of the submount.
15. The component of claim 11 , wherein at least 75% of a planar surface of the submount is covered with the reflective material.
16. The component of claim 11 , further comprising a plurality of electrical traces that are configured to electrically communicate with the plurality of light emitter chips, wherein less than 5% of a planar surface area of the reflective surface is occupied by the plurality of electrical traces.
17. The component of claim 11 , wherein the reflective material comprises a reflective plastic, a reflective polymer, reflective particles, or a solder mask material.
18. The component of claim 11 , wherein the light emitter chips are spaced apart by a distance of approximately 0.3 millimeters (mm) or less.
19. A light emitter component comprising:
a submount comprising a reflective surface;
a plurality of light emitter chips disposed on the reflective surface and in contact with one or more electrical traces on the submount, wherein the reflective surface extends below each of the plurality of light emitter chips and between each of the one or more electrical traces, wherein each of the plurality of light emitter chips comprises a sapphire substrate, and wherein a ratio of a combined planar surface area of the plurality of light emitter chips to a planar surface area of the reflective surface not covered by the plurality of light emitter chips is at least approximately 0.25 or more; and
a retention structure disposed around the reflective surface and the plurality of light emitter chips, wherein the retention structure is configured as a substantially square shape in a planar view over the submount.
20. The component of claim 19 , wherein the reflective surface comprises a reflective material that is disposed on a first portion of the submount that is on a first side of the retention structure, a second portion of the submount that is on a second side of the retention structure, and a third portion of the submount that is below the retention structure.
21. The component of claim 19 , wherein the submount comprises aluminum nitride (AlN).
22. The component of claim 19 , wherein a ratio of the combined planar surface area of the plurality of light emitter chips to the planar surface area of the reflective surface is at least approximately 0.5 or more.
23. The component of claim 19 , wherein the ratio of the combined planar surface area of the plurality of light emitter chips to the planar surface area of the reflective surface is at least approximately 0.75 or more.