Tunable integrated optics LED components and methods
Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
1. A method of producing a light emitting diode (LED) apparatus, the method comprising:
providing a substrate with at least one LED disposed over the substrate;
applying an encapsulation material over the at least one LED; and
applying, after the encapsulation material is applied over the at least one LED, a reflective material on a portion of the encapsulation material such that the reflective material defines an opening where the encapsulation material is not covered by the reflective material to allow light to pass through the opening from the one or more LED.
2. The method of claim 1 , comprising removing the reflective material in a region above the at least one LED to expose a further portion of the encapsulation material.
3. The method of claim 2 , comprising lapping or buffing the exposed encapsulation material to result in a surface finish from matte to high gloss.
4. A method of controlling light output from a light emitting diode (LED) apparatus, the method comprising:
providing an LED apparatus comprising:
a substrate;
one or more LED disposed over the substrate; and
an encapsulation material disposed over the one or more LED; and
controlling light output from the one or more LED by applying, after the encapsulation material has been disposed over the one or more LED, a layer of light-transmissive reflective material on a portion of the encapsulation material such that the reflective material creates an opening where the encapsulation material is not covered by the reflective material to allow light to pass through the opening from the one or more LED.
5. The method of claim 4 , comprising removing a portion of the reflective material from the encapsulation material to increase a size of the opening.
6. The method of claim 1 , wherein a width of the encapsulation material where the encapsulation material contacts the substrate is greater than a width of the encapsulation material at the opening.
7. The method of claim 4 , wherein a width of the encapsulation material where the encapsulation material contacts the substrate is greater than a width of the encapsulation material at the opening.