Light emitter packages and devices having improved wire bonding and related methods
View Patent ↗Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.
1. A method of providing a light emitter package, the method comprising:
providing at least one light emitting diode (LED) chip;
providing an electrical element; and
wire bonding the at least one LED chip to the electrical element at a temperature of approximately 150° C. or less; and
wherein wire bonding the LED chip to the electrical element further comprises at least one of:
wire bonding at a force of approximately 100 grams force (gf) or less;
wire bonding at a power of approximately 1700 mW or less; or
wire bonding at a time of approximately 100 milliseconds (ms) or less.
2. The method of claim 1 , further comprising providing a substrate bonded to the at least one LED chip.
3. The method of claim 2 , further comprising providing an epoxy die attach material disposed between the substrate and the at least on LED chip.
4. The method of claim 2 , wherein the light emitter package comprises a thermal resistance of approximately 220° C./W or less.
5. The method of claim 2 , wherein the package comprises a thermal resistance of approximately 80° C./W or less.
6. The method of claim 2 , wherein the package comprises a thermal resistance of approximately 60° C./W or less.
7. The method of claim 2 , further comprising wire bonding at the force of approximately 100 grams force (gf) or less.
8. The method of claim 2 , further comprising wire bonding at the power of approximately 1700 mW or less.
9. The method of claim 2 , further comprising wire bonding at the time of approximately 100 milliseconds (ms) or less.
10. A method of providing a light emitter package, the method comprising:
providing a substrate;
providing at least one light emitting diode (LED) chip; and
bonding the at least one LED chip to the substrate using a silicone epoxy;
providing an electrical element;
wire bonding the LED chip to the electrical element at a temperature approximately equal to or less than a glass transition temperature of the silicone epoxy; and
wherein wire bonding the LED chip to the electrical element further comprises at least one of:
wire bonding at a force of approximately 100 grams force (gf) or less;
wire bonding at a power of approximately 1700 mW or less; or
wire bonding at a time of approximately 100 milliseconds (ms) or less.
11. The method of claim 10 , wherein the silicone epoxy comprises a glass transition temperature of approximately 140° C. or less.
12. The method of claim 10 , wherein providing the substrate comprises providing a ceramic material.
13. The method of claim 10 , wherein providing the substrate comprises providing a metal.
14. The method of claim 10 , wherein the substrate is provided within an LED package.
15. The method of claim 10 , further comprising wire bonding at the force of approximately 100 grams force (gf) or less.
16. The method of claim 10 , further comprising wire bonding at the power of approximately 1700 mW or less.
17. The method of claim 10 , further comprising wire bonding at the bonding time of approximately 100 milliseconds (ms) or less.
18. The method of claim 10 , wherein the package comprises a thermal resistance of approximately 220° C./W or less.
19. The method of claim 10 , wherein the package comprises a thermal resistance of approximately 80° C./W or less.
20. The method of claim 10 , wherein the package comprises a thermal resistance of approximately 60° C./W or less.
21. A method of providing a light emitter package, the method comprising:
providing at least one light emitting diode (LED) chip;
providing an electrical element;
wire bonding the LED chip to the electrical element using a plurality of four predetermined parameters or a combination thereof, the parameters comprising:
(i) a temperature of approximately 150° C. or less;
(ii) a bonding time of approximately 100 ms or less;
(iii) a power of approximately 1700 mW or less; and
(iv) a force of approximately 100 grams force (gf) or less.
22. The method of claim 21 , further comprising providing a substrate bonded to the at least one LED chip.
23. The method of claim 22 , further comprising providing an epoxy die attach material disposed between the substrate and the at least on LED chip.
24. The method of claim 21 , wherein the package comprises a thermal resistance of approximately 220° C./W or less.
25. The method of claim 21 , wherein the package comprises a thermal resistance of approximately 80° C./W or less.
26. The method of claim 21 , wherein the package comprises a thermal resistance of approximately 60° C./W or less.